Wafer curvature method has been applied to determine the internal stress in the films using Stoney＇s equation.During the film deposition,the wafer fixation on the sample holder will restrict the deformation of the re...Wafer curvature method has been applied to determine the internal stress in the films using Stoney＇s equation.During the film deposition,the wafer fixation on the sample holder will restrict the deformation of the rectangle-shaped wafer,which may result in the stress datum difference along length and width direction.In this paper,the effect of wafer size and the wafer fixation on the TiN film internal stress measured by wafer curvature method was discussed.The rectangle-shaped wafers with different length/width ratios（L/W=1：1,2：1,3：1 and 4：1） were fixed as a cantilever beam.After the TiN films deposition,the profiles of the film/wafer were measured using a stylus profilometer and then the internal stress was calculated using the Stoney equation in the film.The results showed that the fixed end of the wafers limited to some degree the curvature of the wafers along the width direction.For film internal stress measured by wafer curvature method,the wafer profile should be scanned along the length direction and the scan distance should be greater than or equal to half of wafer length.When the length/width ratio of the wafer reached 3：1,the wafer curvature and the calculated stress were basically the same at different positions along the length direction.For film internal stress measured by wafer curvature method,it was recommended that the length/width ratio of wafer should be considered to be greater than or equal to 3：1,and the deformed profile was scanned along the length direction.展开更多
批加工设备调度是半导体生产线调度的重要组成部分,对半导体生产线性能有重要影响。在综述批加工设备调度研究成果的基础上,提出了同时考虑即将到来工件与下游设备负载情况的半导体生产线批加工设备调度规则(Scheduling Rule for Batch ...批加工设备调度是半导体生产线调度的重要组成部分,对半导体生产线性能有重要影响。在综述批加工设备调度研究成果的基础上,提出了同时考虑即将到来工件与下游设备负载情况的半导体生产线批加工设备调度规则(Scheduling Rule for Batch Processing Machines in Semiconductor Wafer Fabrication Facilities,SRB)。基于三种不同规模的半导体生产线模型,在非批加工设备使用不同的调度规则的情况下,对提出的SRB进行了仿真验证。仿真结果表明,与目前常用的固定加工批量调度规则相比,SRB能够更好的改善半导体生产线性能,获得较高的工件移动步数、产量和准时交货率,以及较低的加工周期。展开更多
基金Funded by National Scholastic Athletics Foundotion(NSAF)(No.U1330113)National Natural Science Foundation of China(No.81271953)
文摘Wafer curvature method has been applied to determine the internal stress in the films using Stoney＇s equation.During the film deposition,the wafer fixation on the sample holder will restrict the deformation of the rectangle-shaped wafer,which may result in the stress datum difference along length and width direction.In this paper,the effect of wafer size and the wafer fixation on the TiN film internal stress measured by wafer curvature method was discussed.The rectangle-shaped wafers with different length/width ratios（L/W=1：1,2：1,3：1 and 4：1） were fixed as a cantilever beam.After the TiN films deposition,the profiles of the film/wafer were measured using a stylus profilometer and then the internal stress was calculated using the Stoney equation in the film.The results showed that the fixed end of the wafers limited to some degree the curvature of the wafers along the width direction.For film internal stress measured by wafer curvature method,the wafer profile should be scanned along the length direction and the scan distance should be greater than or equal to half of wafer length.When the length/width ratio of the wafer reached 3：1,the wafer curvature and the calculated stress were basically the same at different positions along the length direction.For film internal stress measured by wafer curvature method,it was recommended that the length/width ratio of wafer should be considered to be greater than or equal to 3：1,and the deformed profile was scanned along the length direction.
