GIS用聚四氟乙烯与金属粘接的工艺研究

针对GIS产品常用聚四氟乙烯(PTFE)与金属粘接的结构特点,采用钠-萘化学处理法处理PTFE,用无水乙醇对金属粘接面和PTFE进行脱脂清洗,选用不同胶粘剂,制备PTFE与不同基材金属(钢基、铜基和铝基)的标准剪切试样。通过拉伸、剪切强度测试法,研究不同胶粘剂的粘接能力,并对不同基材金属的粘接效果进行研究,同时结合实际工程运用,提出一种适用于GIS产品用PTFE与金属粘接的工艺方法。

Determination of interfacial adhesive properties for polymeric film by blister test

The interfacial adhesive properties ofpolypropylene/stainless steel were studied by the blister test. The polypropylene film with a squared free-standing window was pressured by oil from one side of film. The corresponding deformation field was observed by a digital speckle correlation method. The experimental results show that the squared film deforms and debonds from stainless steel with the increase of pressure. The debonding of the squared film in initiates from the center of edge and extends to the comer, and then the deformation of film evolves from square to circle shape. The interfacial adhesive energy of polypropylene/stainless steel is （22.60±1.55） J/m2, which is in agreement with that measured by film with a circular window.

Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.

Structure characteristics and adhesive property of humic substances extracted with different methods

The structure characteristics and adhesive property of humic substance(HS) extracted with different methods were mainly studied by terms of elementary analysis,visible spectrum,FT-IR spectroscopy,viscosity,adsorption and pelletizing experiments.The results show that HSs extracted with new method(HS-a) own higher degree of aromatization and polymerization,larger relative molecular mass and more polar functional groups than HS extracted with usual method(HS-b).The viscosity of HS-b is about 30-40 mPa·s lower than that of HS-a.The maximum adsorption amounts of HS-a and HS-b onto iron concentrates are 9.11 mg/g and 8.08 mg/g,respectively.Meanwhile,HS-a has a better performance than HS-b in the practical application for pelletizing of iron concentrates.The difference in agglomeration behaviors with iron concentrates lies in the differences of the structure characteristics of HSs.With higher content of polar functional groups,larger relative molecular mass and viscosity of HSs,the agglomeration behavior is improved.

Theoretical Investigation of the Bonding Properties of Bis（glycinato） d8metal（II） Dihydrate Complexes Using Density Functional Theory

Density functional theory （DFT） approach has been applied for the analysis of the bond between the [（H20）2] and the [M（gly）2] fragments in a series of trans and cis [M（gly）2[（H20）2] complexes. For comparative purpose, both relativistic and non-relativistic calculations have been performed. The nature of the interaction between the [（H20）2] and [M（gly）2] fragments was investigated using energy decomposition analysis, Hirshfeld atomic charge variation, molecular orbital considerations and bond order decomposition analysis, respectively. Results reveal that the [（H20）：]-[M（gly）2] interaction lies from the hydrogen bridge interaction between these fragments. The strength of the bonding increases in the order Ni2＋ 〉 Pd2＋ 〉 Pt2＋ while the relativistic correction tends to strengthen the [（H2O）2---[M（gly）2] bond in the order Ni 〈 Pd 〈 Pt.

Surface adhesive properties of continuous PBO fiber after air-plasma-grafting-epoxy treatment

It was found that air dielectric barrier discharge(DBD) plasma contributed to the grafting of epoxy resin onto continuous PBO fiber surface. This air-plasma-grafting-epoxy method yielded a noticeable enhancement in the interfacial adhesion between PBO fiber and thermoplastic matrix resin, with the interlaminar shear strength of the resulting composites increased by 66.7%. DSC and FTIR analyses were then used to study the curing behavior of epoxy coating on PBO fiber surface, deduce the possible grafting reactions and investigate the grafting mechanism. More importantly, TGA measurement showed that the grafting of epoxy onto PBO fiber had almost no effect on the composite heat resistance, and there was more thermoplastic matrix resin adhering to the fiber surface; the latter could also be clearly found in the SEM photos. Thereby, the air-plasma-grafting-epoxy treatment was proved to be an effective method for the improvement of continuous PBO fiber surface adhesive properties.

Adhesive properties study on the interfaces of AlN and metal of Pd,Ag and Cu

A1N is used as high power LED package material because of its excellent thermal conductivity. But its poor adhesive with metal is not compatible with the later processing sequence. The properties of the bonding between the deposited palladium, silver, copper and the clean Al-terminated （0001） surface of wurtzite AIN are investigated by using the density-functional the- ory. The results show that the sites of deposited metal atoms on N site are more stable than that on A1 site. Relaxations are found at all the studied interfaces. The bonding energies of Pd/A1N, Ag/A1N and Cu/A1N are respectively 2.75, 1.98, 2.26 eV. Hybridizations of s orbit and p orbit of the deposited metal atoms are observed, which contributes to the bonding energy of interface. The moving to lower energy state of the d orbit and the easier transfer of electrons to semi-empty d orbit in the case of deposited Pd results in the higher bonding energy of Pd/A1N interface.

Cell adhesion molecules in Drosophila synapse development and function

Synapse is a highly specialized inter-cellular structure between neurons or between a neuron and its target cell that mediates cell-cell communications. Ample results indicate that synaptic adhesion molecules are critically important in modulating the complexity and specificity of the synapse. And disruption of adhesive properties of synapses may lead to neurodevelopmental or neurodegenerative diseases. In this review, we will use the Drosophila NMJ as a model system for glutamatergic synapses to discuss the structure and function of homophilic and heterophilic synaptic adhesion molecules with special focus on recent findings in neurexins and neuroligins in Drosophila.

Study on the mechanical behavior of adhesive interface by digital image correlation

The shear modulus of the adhesive layer and the failure mode of adhesive structure on single lap joint specimens under tensile tests are investigated in this paper.The aluminum-aluminum adherends are bonded by two different adhesives:polydimethylsiloxane (PDMS) and epoxy.The full deformation fields are measured using the digital image correlation (DIC) method with the images on the middle part of the adhesive layer recorded by a high resolution microscope.Then,the shear modulus values of the two adhesives are calculated with a simple pure shear strain model.A numerical model is proposed to simulate the single lap joint structure under tensile load in comparison with the experimental results.The results show that this method can successfully estimate the shear modulus of the adhesive layer.The failure behavior of epoxy adhesive/adherend interface is also analyzed and discussed.