期刊文献+
共找到2篇文章
< 1 >
每页显示 20 50 100
TO252封装产品可靠性改善研究
1
作者 温莉珺 费智霞 《电子工业专用设备》 2017年第1期39-42,共4页
在共模的条件下,TO252单基岛-双芯片封装产品因为粘片胶烘烤产生的挥发物质相互扩散造成框架/芯片沾污,及引线框架与塑封料之间的包容强度不够,容易发生离层现象;研究通过优化框架结构,在TO252引线框架基岛中部加"T"形孔,显... 在共模的条件下,TO252单基岛-双芯片封装产品因为粘片胶烘烤产生的挥发物质相互扩散造成框架/芯片沾污,及引线框架与塑封料之间的包容强度不够,容易发生离层现象;研究通过优化框架结构,在TO252引线框架基岛中部加"T"形孔,显著提高了产品的可靠性,其结果为单基岛双芯片封装产品的可靠性提升提供优化指导。 展开更多
关键词 单基岛双芯片 离层 “t”形孔 可靠性提高
下载PDF
Transport of Wetting and Nonwetting Liquid Plugs in a T-shaped Microchannel 被引量:3
2
作者 雍玉梅 李莎 +1 位作者 杨超 尹小龙 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2013年第5期463-472,共10页
The transport of liquid plugs in microchannels is very important for many applications such as in medical treatments in airways and in extraction of oil from porous rocks.A plug of wetting and non-wetting liquids driv... The transport of liquid plugs in microchannels is very important for many applications such as in medical treatments in airways and in extraction of oil from porous rocks.A plug of wetting and non-wetting liquids driven by a constant pressure difference through a T-shaped microchannel is studied numerically with lattice Boltzmann(LB) method.A two-phase flow LB model based on field mediators is built.Three typical flow patterns(blocking,rupture and splitting flow) of plug flow are obtained with different driving pressures.It is found that it becomes difficult for a plug with short initial plug length to leave the microchannel;the flow pattern of plug transport varies with the contact angle,especially from wetting to nonwetting;with the increase of interfacial tension,the front interface of plug moves faster;the front and rear interfaces of the plug with small viscosity ratio move faster in the microchannel than those of the plug with large viscosity ratio.The study is helpful to provide theoretical data for the design and scale-up of liquid-liquid reactors and separators. 展开更多
关键词 lattice Boltzmann method plug flow contact angle interfacial tension MICROCHANNEL
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部