Microstructure,interfacial reaction behavior,and mechanical properties of Ti_(3)AlC_(2)reinforced Al6061 composites

The interfacial reaction behavior of Al and Ti_(3)AlC_(2)at different pouring temperatures and its effect on the microstructure and mechanical properties of the composites were investigated.The results show that the addition of3.0 wt.%Ti_(3)AlC_(2)refines the average grain size ofα(Al)in the composite by 50.1%compared to Al6061 alloy.Morphological analyses indicate that an in-situ Al_(3Ti)transition layer of-180 nm in thickness is generated around the edge of Ti_(3)AlC_(2)at 720℃,forming a well-bonded Al-Al_(3Ti)interface.At this processing temperature,the ultimate tensile strength of A16061-3.0 wt.%Ti_(3)AlC_(2)composite is 199.2 MPa,an improvement of 41.5%over the Al6061 matrix.Mechanism analyses further elucidate that 720℃is favourable for forming the nano-sized transition layer at the Ti_(3)AlC_(2)edges.And,the thermal mismatch strengthening plays a dominant role in this state,with a strengthening contribution of about 74.8%.

Control of interfacial reaction and defect formation in Gd/Bi_(2)Te_(2.7)Se_(0.3) composites with excellent thermoelectric and magnetocaloric properties

The method to combine thermoelectric(TE)and magnetocaloric(MC)cooling techniques lies in developing a new material that simultaneously possesses a large TE and good MC cooling performance.In this work,using n-type Bi_(2)Te_(2.7)Se_(0.3)(BTS)as the TE base material and Gd as the second-phase MC material,Gd/BTS composites were prepared by the spark plasma sintering method.In the composites,interfacial reaction between Gd and BTS was identified,resulting in the formation of Gd Te,which has a large impact on the electron concentration through the adjustment of defect concentration.The MC/TE composite containing 2.5 wt%Gd exhibited a ZT value of 0.6 at 300 K,essentially retaining the original TE performance,while all the composites largely maintained the excellent MC performance of Gd.This work provides a potential pathway to achieving high performance in MC/TE composites.

Interfacial reactions between Ti-1100 alloy and CaO crucible during casting process

Ti-1100 alloys were melted in a controlled atmospheric induction furnace equipped with a Ca O crucible. The microstructure, chemical composition, microhardness and metal-crucible interfacial reactions were systematically investigated. The results demonstrate that the primary solidification microstructure in the as-cast alloys was the typical Widmansttten structure. The interactions between crucible and molten alloys are attributed to slight chemical dissolution and weak physical erosion. According to the line scanning analysis, the interfacial layer（α-case） thicknesses of Ti-1100 samples in the bottom and side wall are about 18 and 17 μm, respectively, which are slightly lower than those presented from microhardness tests（25 and 20 μm）. The formation of α-case was caused by interstitial oxygen atoms. The standard Gibbs energy of reaction Ca O（s）=Ca＋O for Ti-1100 alloy was also determined. The equilibrium constant and the interaction parameter between calcium and oxygen were obtained as lg K=-3.14 and eCa O =-3.54.

Effect of Si content on interfacial reaction and properties between solid steel and liquid aluminum

The effect of Si content on the microstructures and growth kinetics of intermetallic compounds(IMCs)formed during the initial interfacial reaction(<10 s)between solid steel and liquid aluminum was investigated by a thermophysical simulation method.The influence of Si addition on interfacial mechanical properties was revealed by a high-frequency induction brazing.The results showed that IMCs layers mainly consisted ofη-Fe_(2)Al_(5)andθ-Fe_(4)Al_(13).The addition of Si reduced the thickness of the IMCs layer.The growth of theηphase was governed by the diffusion process when adding 2 wt.%Si to the aluminum melt.When 5 wt.%or 8 wt.%Si was added to aluminum,the growth was governed by both the diffusion process and interfacial reaction,and ternary phaseτ1/τ9-(Al,Si)_(5)Fe_(3)was formed in theηphase.The apparent activation energies of theηphase decreased gradually with increasing Si content.The joint with pure aluminum metal had the highest tensile strength and impact energy.

Kinetics and Mechanism of Interfacial Reaction in a SiC_f/Ti Composite

In order to evaluate the interfacial reaction, a SiCf/Ti (TA1) composite was fabricated by a vacuum hot pressing method and then heat-treated in vacuum at 800℃ for up to 100 h. The elemental distributions of C, Si and Ti at the interfacial reaction zone were investigated. It was found that the reaction zone occurs during the fabrication process and continuously grows at high temperature because the Si and C atoms diffuse from SiC fibers to the matrix and Ti atoms diffuse in the opposite direction. The growth of the reaction zone is diffusion controlled and the mechanism of the reaction can be described by a reactive diffusion model of solid-state growth of an AmBn layer between two elementary substances A and B.

Interfacial reactions of chalcopyrite in ammonia–ammonium chloride solution

The interfacial reactions of chalcopyrite in ammonia–ammonium chloride solution were investigated.The chalcopyrite surface was examined by scanning electron microscopy and X-ray photoelectron spectroscopy(XPS)techniques.It was found that interfacial passivation layers of chalcopyrite were formed from an iron oxide layer on top of a copper sulfide layer overlaying the bulk chalcopyrite,whereas CuFe1-xS2 or copper sulfides were formed via the preferential dissolution of Fe.The copper sulfide layer formed a new passivation layer,whereas the iron oxide layer peeled off spontaneously and partially from the chalcopyrite surface.The state of the copper sulfide layer was discussed after being deduced from the appearance of S2-,S22-,Sn2-,S0 and SO42-.A mechanism for the oxidation and passivation of chalcopyrite under different pH values and redox potentials was proposed.Accordingly,a model of the interfacial reaction on the chalcopyrite surface was constructed using a three-step reaction pathway,which demonstrated the formation and transformation of passivation layers under the present experimental conditions.

Effect of infiltrating time on interfacial reaction and properties of tungsten particles reinforced Zr-based bulk metallic glass composites

The tungsten particles reinforced Zr41.2Ti13.8Cu12.5Ni10Be22.5 (Vit 1 alloy) bulk metallic glass composites (BMGCs) were prepared by the melt infiltrating casting method with the infiltrating time of 1, 5 and 10 min, respectively. The changes of interfacial reaction and compression properties of the bulk metallic glass composites with different infiltrating times were studied. Results show that with the increase of infiltrating time, tiny nanocrystals are generated at the interfacial boundary of tungsten particles and the amorphous matrix, and the size of tiny crystals increases with the infiltrating time. When the infiltrating time is 10 min, polygonal crystals with a larger size are also generated within the amorphous matrix. The compressive strength of the composites also increases with the infiltrating time. When the infiltrating time is 10 min, the compressive strength of the composite reaches 2,030 MPa and the compression strain is 44%. The fracture morphology of the composite materials is in a vein-like pattern and the melting phenomenon is found on the fracture surface. In addition, the density of the shear bands during the compressive tests of the composite materials increases with the infiltrating time.

C/Ti/Cu interfacial reaction in SiCf/Cu composites

Continuous SiC fiber reinforced copper matrix （SiC~/Cu） composites were prepared by fiber coating method, and Ti6A14V interlayer was introduced as an interfacial modification coating to improve the interfacial bonding strength. The interfacial reaction characteristics were investigated by transmission electron microscopy （TEM）. The results show that nearly all the titanium atoms reacted with the carbon coating of SiC fibers to form two layers of TiC. Also, a thin copper layer that is sandwiched between these two layers was detected. No Ti-Cu interfacial reaction product was observed. The formation process of the interfacial reaction along with its mechanism was discussed.

Growth kinetics of interfacial intermetallic compounds formed in SnPbInBiSb high entropy alloy soldered joints on Cu substrates

The growth behavior of the complex intermetallic compounds(IMCs)formed at the interface of Cu/SnPbInBiSb high entropy alloy solder joints was explored.The growth inhibition mechanism of the IMCs at the Cu/SnPbInBiSb solid−liquid reaction interface was revealed.The results showed that the growth rate of the complex IMCs obviously decreased at the Cu/SnPbInBiSb solid−liquid reaction interface.The maximum average thickness of IMCs only reached up to 1.66μm after reflowing at 200℃for 10 min.The mechanism for the slow growth of the complex IMCs was analyzed into three aspects.Firstly,the high entropy of the liquid SnPbInBiSb alloy reduced the growth rate of the complex IMCs.Secondly,the distorted lattice of complex IMCs restrained the diffusion of Cu atoms.Lastly,the higher activation energy(40.9 kJ/mol)of Cu/SnPbInBiSb solid−liquid interfacial reaction essentially impeded the growth of the complex IMCs.

Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiC_p/Al composites

A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction)and Ni(10%P)(mass fraction)layers.It is observed that variation of P contents in the electroless Ni(P)layer results in different types of microstructures of SnAgNi/Ni(P)solder joint.The morphology of Ni3Sn4 intermetallic compounds(IMCs)formed between the solder and Ni(10%P)layer is observed to be needle-like and this shape provides high speed diffusion channels for Ni to diffuse into solder that culminates in high growth rate of Ni3Sn4.The diffusion of Ni into solder furthermore results in the formation of Kirkendall voids at the interface of Ni(P)layer and SiCp/Al composites substrate.It is observed that solder reliability is degraded by the formation of Ni2SnP,P rich Ni layer and Kirkendall voids.The compact Ni3Sn4 IMC layer in Ni(5%P)solder joint prevents Ni element from diffusing into solder,resulting in a low growth rate of Ni3Sn4 layer.Meanwhile,the formation of Ni2SnP that significantly affects the reliability of solder joints is suppressed by the low P content Ni(5%P)layer.Thus,shear strength of Ni(5%P) solder joint is concluded to be higher than that of Ni(10%P)solder joint.Growth of Ni3Sn4 IMC layer and formation of crack are accounted to be the major sources of the failure of Ni(5%P)solder joint.

The j–pH diagram of interfacial reactions involving H+ and OH-

For aqueous interfacial reactions involving H+and OH-, the interfacial pH varies dynamically during the reaction process, which is a key factor determining the reaction performance. Herein, the kinetic relevance between the interfacial pH and reaction rate is deciphered owing to the success in establishing the transport equations of H+/OH- in unbuffered solutions, and is charted as a current(j)–pH diagram in the form of an electrochemical response. The as-described j–pH interplay is experimentally verified by the oxygen reduction and hydrogen evolution reactions. This diagram serves to form a panoramic graphic view of pH function working on the interfacial reactions in conjunction with the Pourbaix’s potential–pH diagram, and particularly enables a kinetic understanding of the transport effect of H+and OH-on the reaction rate and valuable instruction toward associated pH control and buffering manipulation.

Atomic-resolution Interfacial Microstructure and Thermo-electro-magnetic Energy Conversion Performance of Gd/Bi_(0.5)Sb_(1.5)Te_(3)Composites

Thermo-electro-magnetic materials with simultaneously large magnetocaloric(MC)and thermoelectric(TE)effects are the core part for designing TE/MC all-solid-state cooling devices.Compositing MC phase with TE material is an effective approach.However,the elemental diffusion and chemical reaction occurring at the two-phase interfaces could significantly impair the cooling performance.Herein,Gd/Bi_(0.5)Sb_(1.5)Te_(3)(Gd/BST)composites were prepared by a low-temperature high-pressure spark plasma sintering method with an aim to control the extent of interfacial reaction.The reaction of Gd with the diffusive Te and the formation of GdTe nanocrystals were identified at the Gd/BST interfaces by the atomic-resolution microscope.The formed Bi’_(Te)antisite defects and enhanced{000 l}preferential orientation in BST are responsible for the increased carrier concentration and mobility,which leads to optimized electrical properties.The heterogeneous interface phases,along with antisite defects,favor the phonon scattering enhancement and lattice thermal conductivity suppression.The optimized composite sintered at 693 K exhibited a maximum ZT of 1.27 at 300 K.Furthermore,the well-controlled interfacial reaction has a slight impact on the magnetic properties of Gd and a high magnetic entropy change is retained in the composites.This work provides a universal approach to fabricating thermo-electro-magnetic materials with excellent MC and TE properties.

Wettability and interfacial reactions of PdNi-based brazing fillers on C-C composite

The wettability and interfacial reactions of four kinds of PdNi-based brazing fillers on C-C composite were studied with the sessile drop method.The results showed that the wettability of these brazing fillers was improved with the increase of Cr content. Cr distributed at the interface of brazing filler/C-C composite and the formation of Cr23C6 phase was speculated.In the interface between Ni-33Cr-24Pd-4Si brazing filler and C-C composite,element Cr reacted with C-C to form Cr-C reaction layer.Pd together with Si participated in the interfacial reactions and formed Pd2Si and Pd3Si phases.Furthermore,in this reaction zone,the residual brazing alloy became Ni-rich and Pd-depleted.

Numerical simulation of interfacial reaction between titanium and zirconia

Based on the conservation laws of energy and mass, and taking into account the effect of chemical reaction between liquid titanium and zirconia ceramic mold on the concentration field and the temperature field, a comprehensive mathematical model for numerical simulation of heat and mass transfer has been established to study the interfacial reaction between liquid Ti and ZrO 2 ceramic mold. With the proposed model, numerical simulations were preformed to investigate the effects of pouring temperature and holding time on the oxygen concentrations and reactive layer thickness in metal. The results showed that both the oxygen concentration and the thickness of reactive layer in metal increase with the increase of the holding time and the pouring temperature. The development of reactive layer thickness with time consists of three stages: inoculation (0-1 s), linear increase (1-5 s) and parabolic increase (after 5 s).

Mechanism of the Interfacial Reaction of AI_2O_3/Medium Mn Steel Containing Nb

The mechanism of the interfacial reaction of Al_2O_3/medium Mn steel containing Nb was studied by means of the observation on the interfacial reaction phenomenon of Al_2O_3/medium Mn steel,and the analyses on the interracial phases.The results show that when T≥1550℃,the interfacial reac- tion of Al_2O_3/medium Mn steel containing Nb happened.In the medium Mn steel matrix,Nb exists in the form of NbC.NbC are the nucleating base of CO gas bubbles.

Wettability of CuNi-Ti Alloys on Si_3N_4 and Interfacial Reaction Products

Based on the alloy Cu55Ni45 (at pct), holding the proportion of Cu to Ni in constant and in the temperature range of 1233~1573 K, the wetting angles of CuNi-0~56 at pct Ti alloys on Si3N4 have been measured by the sessile drop method. With the increase of Ti content, the wetting angles decreased. The equilibrium wetting angle was 5° when Ti content ≥32 at pct.In the case of same Ti content, the activity of Ti in CuNiTi alloy was weaker than that in CuTi alloy The cross-section of the CuNiTi-Si3N4 interface and the elements distribution were examined by scanning electron microscope with X-ray wave-dispersion spectrometer, and the reaction products formed at the interface were determined by X-ray diffiaction analysis method.

Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging

The wetting property of （Sn-9Zn）-2Cu （wt pct） on Ni substrate and the evolution of interracial microstructure in （Sn-9Zn）-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-gZn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy. Plate-like Cu5Zn8 intermetallic compounds （IMCs） were detected in （Sn-9Zn）-2Cu solder matrix. A continuous NisZn21 IMC layer was formed at （Sn-9Zn）-2Cu/Ni interface after soldering. This IMC layer kept its type and integrality even after aging at 170℃ for up to 1000 h. At the early aging stage （before 500 h）, the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time. Thereafter, however, the thickness increased very slowly with longer aging time. When the joints were aged for 1000 h, a new IMC phase, （Cu,Ni）5Zn8, was found in the matrix near the interface. The formation of （Cu,Ni）5Zns phase can be attributed to the diffusion of Ni atoms into the solder matrix from the substrate.

Interfacial reaction in squeeze cast SiC_w/AZ91 composites with different binders

The whisker/matrix interfaces in squeeze cast SiC w/AZ91 composites with different binders (silica binder, acid aluminum phosphate binder and without binder), were studied by transmission electron microscopy (TEM) and high resolution electron microscopy (HREM). The SiC w/AZ91 interface is very clean in the composites with no binders. For the composites with acid aluminum phosphate binders or silica binders, there exists fine discrete interfacial reaction products MgO at the interface, and a definite orientation relationship between MgO and SiC w. The interfacial reaction products MgO is unevenly distributed at different parts of the composite ingot with silica binder, and mainly distributed to the interface at the side part of the composite cylinder. While in the SiC w/AZ91 composite with acid aluminum phosphate binder, MgO particles are distributed evenly at the interface in almost all the parts of the composite ingot. [

Characteristics of interfacial reactions between Ti-6Al-4V alloy and ZrO2 ceramic mold

The interfacial reaction between Ti-6Al-4V alloy and ZrO2 ceramic mold with zirconia sol binder was investigated by keeping the 12 g alloy melt in a vacuum induction furnace for 15 s.The microstructures,element distribution and phase constitution of the interface were identified by optical microscopy(OM),scanning electron microscopy(SEM)equipped with energy dispersive spectroscopy(EDS)and X-ray diffraction(XRD).The results show that the whole interface reaction layer can be divided into three regions:metal penetration layer,transition layer,and hardened layer according to the structure morphology,which has the characteristics of severe metal penetration,finer lamellar,and coarse oxygen-richαphase,respectively.The erosion of the alloy melt on the ceramic mold promotes the decomposition of zirconia,which leads to the increase of local Zr concentration,greatly increasing the activity coefficient of Ti,aggravating the occurrence of interfacial reaction.Thus,the interfacial reaction shows the characteristics of chain reaction.When the oxygen released by the dissolution of zirconia exceeds the local solid solubility,it precipitates in the form of bubbles,resulting in blowholes at the interface.The result also indicates that the zirconia mold with zirconia sol binder is not suitable for pouring heavy titanium alloy castings.

Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature

Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.