服装设计《错位》

设计说明:灵感来源于蒙德里安的“红、黄、蓝”作品,通过对其作品颜色、造型的提取,并采用打敎、解构等创新手法逬行设计,形成“错位”的视觉效果。

《错位》·错位?

处女作的成功,使人们对青年导演黄建新的第二部作品格外关注。元月中旬,本刊编辑部邀请在京的一些文艺界、电影界的同志观看了《错位》,并由副主编王人殷主持了对该片的讨论会。现将部分发言摘登如下。

《错位》1987

故事梗概:本片是《黑炮事件》的续集。主人公仍由《黑》片男主角、第六届金鸡最佳男主角获得者刘子枫担任。工程师赵书信升为某局局长。为摆脱“文山会海”的干扰,他特制了一个智能机器人,让机器去应付各种会议。

High density dislocations enhance creep ageing response and mechanical properties in 2195 alloy sheet

The creep strain of conventionally treated 2195 alloy is very low,increasing the difficulty of manufacturing Al-Cu-Li alloy sheet parts by creep age forming.Therefore,finding a solution to improve the creep formability of Al-Cu-Li alloy is vital.A thorough comparison of the effects of cryo-deformation and ambient temperature large pre-deformation(LPD)on the creep ageing response in the 2195 alloy sheet at 160℃with different stresses has been made.The evolution of dislocations and precipitates during creep ageing of LPD alloys are revealed by X-ray diffraction and transmission electron microscopy.High-quality 2195 alloy sheet largely pre-deformed by 80%without edge-cracking is obtained by cryo-rolling at liquid nitrogen temperature,while severe edge-cracking occurs during room temperature rolling.The creep formability and strength of the 2195 alloy are both enhanced by introducing pre-existing dislocations with a density over 1.4×10^(15)m^(−2).At 160℃and 150 MPa,creep strain and creep-aged strength generally increases by 4−6 times and 30−50 MPa in the LPD sample,respectively,compared to conventional T3 alloy counterpart.The elongation of creep-aged LPD sample is low but remains relevant for application.The high-density dislocations,though existing in the form of dislocation tangles,promote the formation of refined T1 precipitates with a uniform dispersion.

Influence of thermomechanical treatment on recrystallization and softening resistance of Cu-6.5Fe-0.3Mg alloy

The recrystallization and softening resistance of a Cu-6.5Fe-0.3Mg(mass fraction,%)alloy prepared by Process 1(cold rolling heat treatment)and Process 2(hot/cold rolling heat treatment)were studied using Vickers hardness tests,tensile tests,scanning electron microscopy and transmission electron microscopy.The softening temperature,hardness and tensile strength of the alloy prepared by Process 2 were 110°C,HV 15 and 114 MPa higher,respectively,than those of the alloy prepared by Process 1 after aging at 300°C.The recrystallization activation energy of the alloys prepared by Process 1 and Process 2 were 72.83 and 98.11 kJ/mol,respectively.The pinning effects of the precipitates of the two alloys on grain boundaries and dislocations were basically the same.The softening mechanism was mainly attributed to the loss of dislocation strengthening.The higher Fe fiber density inhibited the average free migration path of dislocations and grain boundary migration in the alloy,which was the main reason for higher softening temperature of the alloy prepared by Process 2.

Effect of Mo and ZrO_(2)nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.

错位

小景被录取为市政府公务员，被安排从事市长新一任秘书的职务。报到时，看见原来的秘书正在收拾物品。小景听别人说他眼前的这位秘书已经“高升”了。心里难免生出敬意与羡慕，并暗暗地发誓，自己一定也要好好做。站稳脚跟。就在这时，小景走上前，向原来的秘书打了个招呼，说：“您好，我是新来的秘书，请多多指教。”

多味的《错位》

在35年前的1987年,黄建新导演的“先锋三部曲”的第二部《错位》上映,但相比于一年前《黑炮事件》在影坛上的一鸣惊人,这部影片则遭到了国内观众的冷遇。当时国外的一些电影专家反倒觉得《错位》比《黑炮事件》更幽默辛辣,寓意也更深刻。

错位

不要觉得 自己丑 更不要觉得

笔补造化天无功——实力派画将匡剑的油画世界

在美国著名艺术品收藏家罗伯特·赫夫纳的当代中国油画藏品里,匡剑的人物画作品无疑闪烁着一种独创的、异样的、创生的光辉。难怪这位实力派画家的力作深受美国藏家们的青睐。不仅尽显其扎实艺术功力的《帕米尔光》（1994）通过高保真印刷在美国限量发行,而且富有现代观念性的《错位》（1995）也被评论家认为是试验油画的最早力作之一。

Effects of rolling parameters of snake hot rolling on strain distribution of aluminum alloy 7075

The realization way of snake rolling was introduced. Flow velocity, strain and stress distribution of 7075 aluminum alloy plate during snake rolling and symmetrical rolling were analyzed in Deform 3D. Effects of velocity ratio, offset distance between two rolls and pass reduction on the distribution of equivalent strain and shear strain were analyzed. The results show that flow velocity and equivalent strain on the lower layer of the plate are larger than those of the upper layer because of the larger velocity of the lower roll and the gap is increased with the increase of velocity ratio and pass reduction. The shear strain of roiling direction in the center point is almost zero during symmetrical rolling, while it is much larger during snake rolling because of the existence of rub zone. The shear strain is increased with the increase of velocity ratio, offset distance and pass reduction. This additional shear strain is beneficial to improve the in_homogeneous strain distribution.

Elastic Field of a Straight Dislocation in One Dimensional Hexagonal Quasicrystals *L

Aim To study dislocation elasticity theory in quasicrystals. Methods A dislocation was separated into pure edge part and pure screw part and their superposition was used to find the elastic field. Results and Conclusion The elastic solution of a straight dislocation parallel to the quasiperiodic axis in 1D hexagonal quasicrystals was obtained and the generalized Peach Koehler force on a dislocation in quasicrystals was given.

Micro-bending of metallic crystalline foils by non-local dislocation density based crystal plasticity finite element model

A non-local dislocation density based crystal plasticity model, which takes account of the microstrncture inhomogeneity, was used to investigate the micro-bending of metallic crystalline foils. In this model, both statistically stored dislocations （SSDs） and geometrically necessary dislocations （GNDs） are taken as the internal state variables. The strain gradient hardening in micro-bending of single-grained metal foils was predicted by evolution of GNDs. The predicted results were compared with the micro-hardness distribution of the previous micro-bending experiments of CuZn37 a-brass foils with coarse grains and fine grains. Comparison of the simulated dislocation densities distribution of SSDs and GNDs with the experimental results shows that different micro-hardness distribution patterns of the coarse and fine grain foils can be attributed to the corresponding SSDs and GNDs distributions. The present model provides a physical insight into the deformation mechanism and dislocation densities evolution of the micro-bending process.

Effect of stress on microstructures of creep-aged 2524 alloy

Microstructures of creep-aged 2524 （A1-4.3Cu-1.5Mg） aged at 170 ℃ with various stresses （0, 173 and 250 MPa） were studied on a creep machine. Ageing hardness curves under various stresses were plotted and the corresponding microstructures were characterized by transmission electron microscopy （TEM）. The results show that the value of peak hardness is increased, while the time to reach the peak hardness is reduced under an external stress. Meanwhile, the length of S（Al2CuMg） phase is shorter and the number density of S phases is larger in the creep-aged alloy. The predominant contribution to the peak hardness can be ascribed to the GPB zones with an elastic stress.

Precipitation orientation effect of 2124 aluminum alloy in creep aging

The precipitation behaviors of 2124 aluminum alloy under the conditions of artificial aging （AA）, creep aging （CA） and creep aging with pre-deformation （PCA） were investigated by means of mechanical property and microstructure. The results show that the mechanical properties of CA treated sample decrease significantly compared with AA treated sample. The yield strength of the CA treated sample falls by 14%, the tensile strength falls by 6.2%, and the elongation falls by 21%. Nevertheless, the mechanical properties of PCA sample are improved obviously, close to the AA treated sample. Moreover, the generation and control mechanisms of the precipitation orientation effect in 2124 aluminum alloy were studied. It is deduced that the key mechanism lies in the effect of dislocation.

Effect of thermal annealing on defects of upgraded metallurgical grade silicon

Effect of thermal annealing on the upgraded metallurgical grade（UMG）-Si was investigated under different conditions.The dislocation,grain boundaries and preferred growth orientation of Si ingot were characterized by optical microscopy,electron back scattering diffraction（EBSD） and X-ray diffractometry（XRD）,respectively.The arrange order of dislocation density of Si ingot is from the lowest in the middle to the lower in the bottom and low in the top before and after annealing.And it decreases gradually with increase of the annealing temperature.The number of small angle grain boundaries declines gradually until disappears whereas the proportion of coincidence site lattice（CSL） grain boundaries increases firstly and then decreases.The twin boundary Σ3 reaches the highest proportion of 28% after annealing at 1 200 ℃ for 3 h.Furthermore,the crystal grains in different positions gain the best preferred growth orientation,which can promote the following machining of Si ingot and the conversion efficiency of solar cells.

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Molecular dynamics （MD） simulations of monocrystalline copper （100） surface during nanomachining process were performed based on a new 3D simulation model. The material removal mechanism and system temperature distribution were discussed. The simulation results indicate that the system temperature distribution presents a roughly concentric shape, a steep temperature gradient is observed in diamond cutting tool, and the highest temperature is located in chip. Centrosymmetry parameter method was used to monitor defect structures. Dislocations and vacancies are the two principal types of defect structures. Residual defect structures impose a major change on the workpiece physical properties and machined surface quality. The defect structures in workpiece are temperature dependent. As the temperature increases, the dislocations are mainly mediated from the workpiece surface, while the others are dissociated into point defects. The relatively high cutting speed used in nanomachining results in less defect structures, beneficial to obtain highly machined surface quality.

Observation of Dislocation Etch Pits in GaN Epilayers by Atomic Force Microscopy and Scanning Electron Microscopy

A combination of atomic force microscopy （AFM） and scanning electron microscopy （SEM） is used to characterize dislocation etch pits in Si-doped GaN epilayer etched by molten KOH. Three types of etch pits with different shapes and specific positions in the surface have been observed,and a model of the etching mechanism is proposed to explain their origins. The pure screw dislocation is easily etched along the steps that the dislocation terminates. Consequently a small Ga-polar plane is formed to prevent further vertical etching,resulting in an etch pit shaped like an inverted truncated hexagonal pyramid at the terminal chiasma of two surface steps. However, the pure edge dislocation is easily etched along the dislocation line,inducing an etch pit of inverted hexagonal pyramid aligned with the surface step. The polarity is found to play an important role in the etching process of GaN.

Hot deformation behavior of high Ti 6061 Al alloy

The hot deformation behavior of a high Ti 6061 aluminum alloy in the temperature range from 350 to 510 ℃ and strain rate range from 0.001 to 10 s^-1 was investigated using stress-strain curve analysis, processing map, transmission electron microscopy and electron backscatter diffraction analysis. The results show that the peak stress decreases with increasing deformation temperatures and decreasing strain rate. The average deformation activation energy is 185 kJ/mol in the parameter range investigated. The flow stress model was constructed. The main softening mechanism is dynamic recovery. The processing map was obtained using dynamic material model, and the suggested processing window is 400-440℃ and 0.001-0.1 s^-1.