Conductive sheets consisting of copper fibers,urea formaldehyde resins and decorative papers were prepared by hot pressing.The results showed that the sheet resistance of composites had mutations with the increasing o...Conductive sheets consisting of copper fibers,urea formaldehyde resins and decorative papers were prepared by hot pressing.The results showed that the sheet resistance of composites had mutations with the increasing of copper fiber filling ratio.The sheets exhibited percolation threshold effect.The threshold of sheets filled with 5 mm copper fibers was about 16% and the threshold of sheets filled with 10 mm or 15 mm copper fibers were about 8.7%.Meanwhile,the sheets showed piezoresistive characteristics and the conductive structure of sheets have been gradually developped into "three-dimensional conductive network" from "two-dimensional conductive network".Moreover,the length of copper fibers showed strong effects to the conductivity.Under the same fiber filling ratio,the larger length of fiber was,the higher conductivity and the lower percolation threshold could be.展开更多
以纳米硅粉为活性材料,乙炔为碳源,通过化学气相沉积(CVD)一步法原位制得核壳结构可控的三维硅/多孔碳纳米复合材料。透射电子显微镜(TEM)和热重分析(TGA)结果表明,制备了厚度可控的无定形碳包覆纳米硅颗粒核壳结构,并形成串珠状三维导...以纳米硅粉为活性材料,乙炔为碳源,通过化学气相沉积(CVD)一步法原位制得核壳结构可控的三维硅/多孔碳纳米复合材料。透射电子显微镜(TEM)和热重分析(TGA)结果表明,制备了厚度可控的无定形碳包覆纳米硅颗粒核壳结构,并形成串珠状三维导电网络。以200 m A/g在0.01~1.00 V循环100次,复合材料中硅的可逆比容量保持在1 270 m Ah/g。这主要是因为:原位生成的无定形碳可缓冲纳米硅颗粒的体积变化,Li+扩散通道更好;三维网络改善了电子传输性能。展开更多
基金Project supported by the National Natural Science Foundation of China(Grant Nos.51225204,21303222,and 21127901)the "Strategic Priority Research Program" of the Chinese Academy of Sciences(Grant No.XDA09010100)~~
文摘Conductive sheets consisting of copper fibers,urea formaldehyde resins and decorative papers were prepared by hot pressing.The results showed that the sheet resistance of composites had mutations with the increasing of copper fiber filling ratio.The sheets exhibited percolation threshold effect.The threshold of sheets filled with 5 mm copper fibers was about 16% and the threshold of sheets filled with 10 mm or 15 mm copper fibers were about 8.7%.Meanwhile,the sheets showed piezoresistive characteristics and the conductive structure of sheets have been gradually developped into "three-dimensional conductive network" from "two-dimensional conductive network".Moreover,the length of copper fibers showed strong effects to the conductivity.Under the same fiber filling ratio,the larger length of fiber was,the higher conductivity and the lower percolation threshold could be.
文摘以纳米硅粉为活性材料,乙炔为碳源,通过化学气相沉积(CVD)一步法原位制得核壳结构可控的三维硅/多孔碳纳米复合材料。透射电子显微镜(TEM)和热重分析(TGA)结果表明,制备了厚度可控的无定形碳包覆纳米硅颗粒核壳结构,并形成串珠状三维导电网络。以200 m A/g在0.01~1.00 V循环100次,复合材料中硅的可逆比容量保持在1 270 m Ah/g。这主要是因为:原位生成的无定形碳可缓冲纳米硅颗粒的体积变化,Li+扩散通道更好;三维网络改善了电子传输性能。
