A whole-field 3D surface measurement system for semiconductor wafer inspection is described.The system consists of an optical fiber plate,which can split the light beam into N^2 subbeams to realize the whole-field ins...A whole-field 3D surface measurement system for semiconductor wafer inspection is described.The system consists of an optical fiber plate,which can split the light beam into N^2 subbeams to realize the whole-field inspection.A special prism is used to separate the illumination light and signal light.This setup is characterized by high precision,high speed and simple structure.展开更多
文摘A whole-field 3D surface measurement system for semiconductor wafer inspection is described.The system consists of an optical fiber plate,which can split the light beam into N^2 subbeams to realize the whole-field inspection.A special prism is used to separate the illumination light and signal light.This setup is characterized by high precision,high speed and simple structure.
