The improvements of the design and the compatibility with silicon IC of RF MEMS switch are presented.The compatibility with silicon IC is realized by dielectric isolation technology,and the decrease of the pull voltag...The improvements of the design and the compatibility with silicon IC of RF MEMS switch are presented.The compatibility with silicon IC is realized by dielectric isolation technology,and the decrease of the pull voltage of the switch is done by etching some holes on the metal membrane.The preliminary test results are as follows: C off and C on are 0 32pF,6pF,respectively;the pull down voltage is about 25V.The package of the RF MEMS switch is done by micro stripline,and the isolation and the insertion loss are 35dB,2dB,respectively at 1 5GHz;the switching speed is about 3μs by oscilloscope.展开更多
文摘The improvements of the design and the compatibility with silicon IC of RF MEMS switch are presented.The compatibility with silicon IC is realized by dielectric isolation technology,and the decrease of the pull voltage of the switch is done by etching some holes on the metal membrane.The preliminary test results are as follows: C off and C on are 0 32pF,6pF,respectively;the pull down voltage is about 25V.The package of the RF MEMS switch is done by micro stripline,and the isolation and the insertion loss are 35dB,2dB,respectively at 1 5GHz;the switching speed is about 3μs by oscilloscope.