The growth of brass nanofilms sputtered on acrylics substrate was studied through experimental investigation of the effect of sputtering voltage, target-to-substrate distance, chamber pressure and sputtering time on t...The growth of brass nanofilms sputtered on acrylics substrate was studied through experimental investigation of the effect of sputtering voltage, target-to-substrate distance, chamber pressure and sputtering time on the content, growth rate and surface morphology of brass nanofilms. The results show that compared with original brass target, Cu content in brass nanofilms changes by no more than 6.23%(mass fraction). High sputtering voltage and short target-to-substrate distance help to improve brass nanofilm deposition rate. There exists an optimal chamber pressure where deposition rate of nanofilm reaches the maximum. The key factor affecting surface morphology is the kinetic energy of sputtering particles. Low sputtering voltage, large target-to-substrate distance and low chamber pressure are very important for the formation of the high-quality brass nanofilms. The brass films prepared under the conditions of sputtering voltage 1.6kV, target-to-substrate distance 2.5cm, chamber pressure 10Pa and sputtering time 20min, possess following characteristics: smooth and uniform surface, thickness of 41nm and Cu content of 71.0%(mass fraction).展开更多
文摘The growth of brass nanofilms sputtered on acrylics substrate was studied through experimental investigation of the effect of sputtering voltage, target-to-substrate distance, chamber pressure and sputtering time on the content, growth rate and surface morphology of brass nanofilms. The results show that compared with original brass target, Cu content in brass nanofilms changes by no more than 6.23%(mass fraction). High sputtering voltage and short target-to-substrate distance help to improve brass nanofilm deposition rate. There exists an optimal chamber pressure where deposition rate of nanofilm reaches the maximum. The key factor affecting surface morphology is the kinetic energy of sputtering particles. Low sputtering voltage, large target-to-substrate distance and low chamber pressure are very important for the formation of the high-quality brass nanofilms. The brass films prepared under the conditions of sputtering voltage 1.6kV, target-to-substrate distance 2.5cm, chamber pressure 10Pa and sputtering time 20min, possess following characteristics: smooth and uniform surface, thickness of 41nm and Cu content of 71.0%(mass fraction).
