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一种新的集成电路互连线串扰模型和估计公式 被引量:1
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作者 赵骏 刘凌志 +1 位作者 戎蒙恬 毛军发 《电子与信息学报》 EI CSCD 北大核心 2003年第4期543-550,共8页
建立了一个考虑分布电阻、分布电容的互连线混П模型.在这个模型的基础上,分析了终端在最坏条件下的串扰响应,并推导出了三阶S域系数的精确表达式。最终,获得了一个新的互连线串扰响应的估计公式.通过与SPICE模拟的结果相比较,该文的模... 建立了一个考虑分布电阻、分布电容的互连线混П模型.在这个模型的基础上,分析了终端在最坏条件下的串扰响应,并推导出了三阶S域系数的精确表达式。最终,获得了一个新的互连线串扰响应的估计公式.通过与SPICE模拟的结果相比较,该文的模拟结果非常接近实际电路的串扰响应,与相关文献所发表的结果相比较,该模型更符合实际情况,结果也更精确。 展开更多
关键词 集成电路 电感效应 串扰 互连线时延模型 S域信号响应 性能驱动 布局规划 估计公式
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A Novel Statistical Delay Model Based on the Birnbaum-Saunders Distribution for RLC Interconnects in 90nm Technologies
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作者 周磊 孙玲玲 蒋立飞 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第7期1313-1317,共5页
For performance optimization such as placement,interconnect synthesis,and routing, an efficient and accurate interconnect delay metric is critical,even in design tools development like design for yield (DFY) and des... For performance optimization such as placement,interconnect synthesis,and routing, an efficient and accurate interconnect delay metric is critical,even in design tools development like design for yield (DFY) and design for manufacture (DFM). In the nanometer regime, the recently proposed delay models for RLC interconnects based on statistical probability density function (PDF)interpretation such as PRIMO,H-gamma,WED and RLD bridge the gap between accuracy and efficiency. However, these models always require table look-up when operating. In this paper, a novel delay model based on the Birnbaum-Saunders distribution (BSD) is presented. BSD can accomplish interconnect delay estimation fast and accurately without table look-up operations. Furthermore, it only needs the first two moments to match. Experimental results in 90nm technology show that BSD is robust, easy to implement,efficient,and accurate. 展开更多
关键词 delay model INTERCONNECT MOMENT probability distribution function
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