亚微米铜循环形变特征研究

本文研究了恒塑性应变控制下，egualchannelangularextrusion（ECAE）技术制备的亚微米铜的室温拉压时称循环形变行为，结果表明，亚微米钢在εpl＝5×10(－4)和1×10(－3)下表现出典型的循环软化特征、且直到断裂没有饱和阶段；而在εpl＝1×10(－4)下循环至5000周，应力幅仍没有明显变化，样品表面的光学显微镜及SEM－electronchannelingcontrast（SEM－ECC）技术研究发现：存在着宏观形貌与单晶表面滑移线相类似的‘滑移线’，‘滑移线’在侧面与载荷轴成45°，而在前表面与载荷轴相垂直：微观上‘滑移线’又可分为细而长的‘滑移线’和宽而短的微剪切带。

我国独创废弃物制亚微米铜粉技术

正北京雄财普吉科技有限公司对外宣布,该公司自主开发的利用含铜废弃物制备亚微米铜粉技术已通过工信部组织的科技成果鉴定。采用该技术生产的新一代高科技功能性金属粉体新材料、亚微米铜基润滑油、亚微米铜基油等铜基抗磨修复系列产品已批量生产并销往国内外,正式服务于石油和化学工业等相关领域。据技术发明人雄财普吉公司董事长吉维群介绍。

Rapid pressure-assisted sinter bonding in air using 200 nm Cu particles and enhancement of bonding strength by successive pressureless annealing

To design an effective and realistically applicable sinter bonding process for power devices,we proposed a two-step process using a 200 nm Cu-particle-based paste to form a bondline having high-temperature sustainability and superior thermal conductance.This process involved rapid pressure-assisted sinter bonding in air followed by pressureless annealing in a nitrogen atmosphere.In the case of a paste prepared with a mixture of 20 wt.%malic acid and 80 wt.%ethylene glycol,sinter bonding at 300℃and 5 MPa for only 30 s resulted in a sufficient shear strength of 23.1 MPa.The shear strength was significantly enhanced to 69.6 MPa by the additional pressureless aging for 30 min.Therefore,the two-step sinter bonding process is expected to provide an outstanding production rate as a next-generation sinter bonding process.

Silego公司推出体积小一倍电流为4.5 A的双通道全功能负载开关

近日,Silego于美国加州圣克拉拉推出一款基于Silego亚微米铜制程电源FET技术的16mΩ双通道GreenFET3负载开关产品即SLG59M1527V。该款负载开关每条通道最高电流可达到4.5A、总电流高达9.0A。并且引用Silego CuFETTM技术来实现低导通电阻、外形尺寸最小同时可靠性提高。