A new low leakage 3×VDD-tolerant electrostatic discharge(ESD)detection circuit using only low-voltage device without deep N-well is proposed in a standard 90-nm 1.2-V CMOS process.Stacked-transistors technique is...A new low leakage 3×VDD-tolerant electrostatic discharge(ESD)detection circuit using only low-voltage device without deep N-well is proposed in a standard 90-nm 1.2-V CMOS process.Stacked-transistors technique is adopted to sustain high-voltage stress and reduce leakage current.No NMOSFET operates in high voltage range and it is unnecessary to use any deep N-well.The proposed detection circuit can generate a 38 mA current to turn on the substrate triggered silicon-controlled rectifier(STSCR)under the ESD stress.Under normal operating conditions,all the devices are free from over-stress voltage threat.The leakage current is 88 nA under 3×VDD bias at 25°C.The simulation result shows the circuit can be successfully used for 3×VDD-tolerant I/O buffer.展开更多
基金supported by the National Natural Science Foundation of China (Grant Nos. 61076097,60936005)in part by Cultivation Fund of the Key Scientific and Technical Innovation Project,Ministry of Education of China Program (Grant No. 20110203110012)
文摘A new low leakage 3×VDD-tolerant electrostatic discharge(ESD)detection circuit using only low-voltage device without deep N-well is proposed in a standard 90-nm 1.2-V CMOS process.Stacked-transistors technique is adopted to sustain high-voltage stress and reduce leakage current.No NMOSFET operates in high voltage range and it is unnecessary to use any deep N-well.The proposed detection circuit can generate a 38 mA current to turn on the substrate triggered silicon-controlled rectifier(STSCR)under the ESD stress.Under normal operating conditions,all the devices are free from over-stress voltage threat.The leakage current is 88 nA under 3×VDD bias at 25°C.The simulation result shows the circuit can be successfully used for 3×VDD-tolerant I/O buffer.
