The loss mechanisms of different passive devices (on-chip inductors and capacitors) on different substrates are analyzed and compared. OPS (oxidized porous silicon) and HR (high-resistivity) substrates are used ...The loss mechanisms of different passive devices (on-chip inductors and capacitors) on different substrates are analyzed and compared. OPS (oxidized porous silicon) and HR (high-resistivity) substrates are used as low-loss substrates for on-chip planar LPF (low pass filter) fabrication. For the study of substrate loss, a planar coil inductor is also designed. Simulation results show that Q (the quality factor) of the inductor on both substrates is over 20. Measurements of the LPF on OPS substrate give a - 3dB bandwidth of 2.9GHz and a midband insertion loss of 0.87dB at 500MHz. The LPF on HR substrate gives a - 3dB bandwidth of 2.3GHz and a midband insertion loss of 0.42dB at 500MHz.展开更多
Y2000-62085-229 0007558集成了微加工滤波器和倒装有源器件的 K 波段接收机前端集成电路=K-band receive front-end IC integrat-ing micromachined filter and flip-chip assemble active de-vices[会,英]//1999 IEEE MTT-S Internati...Y2000-62085-229 0007558集成了微加工滤波器和倒装有源器件的 K 波段接收机前端集成电路=K-band receive front-end IC integrat-ing micromachined filter and flip-chip assemble active de-vices[会,英]//1999 IEEE MTT-S International Mi-crowave Symposium,Vol.1.—229~232(U)现已开发出一种在硅衬底上集成了微加工低损耗滤波器和倒装片有源器件的新型三维 K 波段接收机前端集成电路。展开更多
Y98-61383-235 9904282铌酸钾超高电机耦合和零温度特性及其在低损耗宽带滤波器中的应用=Super high electromechanical cou-pling and zero-temperature characteristics of kNbO<sub>3</sub> andits applications for low...Y98-61383-235 9904282铌酸钾超高电机耦合和零温度特性及其在低损耗宽带滤波器中的应用=Super high electromechanical cou-pling and zero-temperature characteristics of kNbO<sub>3</sub> andits applications for low-loss wide band filters[会,英]/展开更多
文摘The loss mechanisms of different passive devices (on-chip inductors and capacitors) on different substrates are analyzed and compared. OPS (oxidized porous silicon) and HR (high-resistivity) substrates are used as low-loss substrates for on-chip planar LPF (low pass filter) fabrication. For the study of substrate loss, a planar coil inductor is also designed. Simulation results show that Q (the quality factor) of the inductor on both substrates is over 20. Measurements of the LPF on OPS substrate give a - 3dB bandwidth of 2.9GHz and a midband insertion loss of 0.87dB at 500MHz. The LPF on HR substrate gives a - 3dB bandwidth of 2.3GHz and a midband insertion loss of 0.42dB at 500MHz.
文摘Y2000-62085-229 0007558集成了微加工滤波器和倒装有源器件的 K 波段接收机前端集成电路=K-band receive front-end IC integrat-ing micromachined filter and flip-chip assemble active de-vices[会,英]//1999 IEEE MTT-S International Mi-crowave Symposium,Vol.1.—229~232(U)现已开发出一种在硅衬底上集成了微加工低损耗滤波器和倒装片有源器件的新型三维 K 波段接收机前端集成电路。
文摘Y98-61383-235 9904282铌酸钾超高电机耦合和零温度特性及其在低损耗宽带滤波器中的应用=Super high electromechanical cou-pling and zero-temperature characteristics of kNbO<sub>3</sub> andits applications for low-loss wide band filters[会,英]/