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SOI高温电路——突破硅集成电路的高温应用限制 被引量:1
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作者 多新中 张苗 +2 位作者 高剑侠 王连卫 林成鲁 《微细加工技术》 1998年第4期36-42,共7页
常规的体硅基础电路通常只能工作在200℃以下,SOI(Silicon-On-In-sulator)电路的突出特点之一是可以工作在高温环境。简述了市场对高温电路的需求,并分析了SOI电路在高温下的电学特性,讨论了为将S... 常规的体硅基础电路通常只能工作在200℃以下,SOI(Silicon-On-In-sulator)电路的突出特点之一是可以工作在高温环境。简述了市场对高温电路的需求,并分析了SOI电路在高温下的电学特性,讨论了为将SOI高温电路商业化,应当解决的一些技术问题。 展开更多
关键词 SOI 体硅电路 集成
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SOI-21世纪VLSI的高端技术
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作者 李智群 王志功 《中国集成电路》 2002年第12期61-64,共4页
概述体硅CMOS(bulk CMOS)技术在近20年获得了飞速发展,成为VLSI的主流技术。CMOS集成电路的特征尺寸正在向深亚微米发展,0.18μm
关键词 器件 超大规模集成 体硅电路 主流技术 短沟道效应 微处理器 效应 等比例缩小 凹陷沟道
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New Level-Shift LDMOS Structure for a 600 V-HVIC on Thick SOl
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作者 Masaharu Yamaji Keisei Abe Akihiro Jonishi Hidenori Takahashi Hitoshi Sumida 《Journal of Energy and Power Engineering》 2012年第9期1515-1520,共6页
A novel level-shift LDMOS (lateral double-diffused metal oxide semiconductor) structure with the HV (high voltage) -interconnection for a 600 V-HVIC (high voltage integrated circuit) on thick SOI (silicon on in... A novel level-shift LDMOS (lateral double-diffused metal oxide semiconductor) structure with the HV (high voltage) -interconnection for a 600 V-HVIC (high voltage integrated circuit) on thick SOI (silicon on insulator) is proposed. There are two original points in the proposed structure. One is the formation of the double floating p-layers under the HV-interconnection to prevent potential distribution in the drift from disturbing due to the HV-interconnection, and the other is a good combination between the LDMOS structure and multiple trench isolation to obtain the isolation performance over 600 V. From the proposed structure, the high blocking capability of the LDMOS, including both off- and on-breakdown voltages over 600 V and high hot carrier instability, and the isolation performance over 1,200 V can be obtained successfully. This paper will show numerical and experimental results in detail. 展开更多
关键词 HVIC SOL level-shift LDMOS HV-interconnection.
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Study of crystalline silicon solar cells with integrated bypass diodes
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作者 CHEN KaiHan CHEN DaMing +1 位作者 ZHU YanBin SHEN Hui 《Science China(Technological Sciences)》 SCIE EI CAS 2012年第3期594-599,共6页
This paper reported a novel method of integrating bypass diodes into crystalline silicon solar cells.Bypass diodes which have the opposite p-n junction were formed by printing specific paste on the local surface of so... This paper reported a novel method of integrating bypass diodes into crystalline silicon solar cells.Bypass diodes which have the opposite p-n junction were formed by printing specific paste on the local surface of solar cells using screen printing,while infrared laser was applied to isolate the diode from the cell after firing.A module of crystalline silicon solar cells with integrated bypass diodes was fabricated and the I-V characteristics were measured under different shade conditions.The experimental results clearly showed that the integrated bypass diodes can effectively stabilize module's short circuit current while reduce the module power loss when shaded as well. 展开更多
关键词 crystalline silicon solar cells bypass diode INTEGRATION
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