Spinel LiMn2O4 microspheres with durable high rate capability were synthesized by a facile route using spherical MnCO3 precursors as the self-supported templates, combined with the calcinations of LiNO3 at 700 °C...Spinel LiMn2O4 microspheres with durable high rate capability were synthesized by a facile route using spherical MnCO3 precursors as the self-supported templates, combined with the calcinations of LiNO3 at 700 °C for 8 h. The spherical MnCO3 precursors were obtained from the control of the crystallizing process of Mn2＋ ions and NH4HCO3 in aqueous solution. The effects of the mole ratio of the raw materials, reaction time, and reaction temperature on the morphology and yield of the MnCO3 were investigated. The as-synthesized MnCO3 and LiMn2O4 microspheres were characterized by powder X-ray diffractometry （XRD） and scanning electron microscopy （SEM）. Galvanostatic charge/discharge tests indicate that the spinel LiMn2O4 microspheres deliver a discharge capacity of 90 mA-h/g at 10C rate show good capacity retention capability （75% of their initial capacity after 800 cycles at 10C rate）. The durable high rate capability suggests that the as-synthesized LiMn2O4 microspheres are promising cathode materials for high power lithium ion batteries.展开更多
An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapt...An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology.Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process.Each layer adopts though silicon via(TSV)technology to realize signal interconnection.A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity,and the silicon-based filter is integrated with the high-resistance silicon substrate.The interconnect line,cavity and filter of the silicon-based adapter board are designed with AutoCAD,and HFSS is adopted for 3D electromagnetic field simulation.According to the measured results,the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm.The multiplier multi-function chip operates at 16-20 GHz.The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm.The cascaded fully assembled mixing component achieves a spur of better than-50 dBc and a gain of better than 15 dB.展开更多
基金Project(2011M501090) upported by the China Postdoctoral Science FoundationProject(SCUT2012ZZ0042) upported by the Fundamental Research Funds for the Central Universities+1 种基金Project supported by the"SPR-2011"of South China University of TechnologyProject(NRC07/08.EG01)supprted by the Fok Ying Tung Foundation
文摘Spinel LiMn2O4 microspheres with durable high rate capability were synthesized by a facile route using spherical MnCO3 precursors as the self-supported templates, combined with the calcinations of LiNO3 at 700 °C for 8 h. The spherical MnCO3 precursors were obtained from the control of the crystallizing process of Mn2＋ ions and NH4HCO3 in aqueous solution. The effects of the mole ratio of the raw materials, reaction time, and reaction temperature on the morphology and yield of the MnCO3 were investigated. The as-synthesized MnCO3 and LiMn2O4 microspheres were characterized by powder X-ray diffractometry （XRD） and scanning electron microscopy （SEM）. Galvanostatic charge/discharge tests indicate that the spinel LiMn2O4 microspheres deliver a discharge capacity of 90 mA-h/g at 10C rate show good capacity retention capability （75% of their initial capacity after 800 cycles at 10C rate）. The durable high rate capability suggests that the as-synthesized LiMn2O4 microspheres are promising cathode materials for high power lithium ion batteries.
文摘An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology.Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process.Each layer adopts though silicon via(TSV)technology to realize signal interconnection.A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity,and the silicon-based filter is integrated with the high-resistance silicon substrate.The interconnect line,cavity and filter of the silicon-based adapter board are designed with AutoCAD,and HFSS is adopted for 3D electromagnetic field simulation.According to the measured results,the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm.The multiplier multi-function chip operates at 16-20 GHz.The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm.The cascaded fully assembled mixing component achieves a spur of better than-50 dBc and a gain of better than 15 dB.
