On account of the multiformity of MEMS devices, it is necessary to integrate with some optical measurement techniques for meeting static and dynamic unit test requirements. In this paper, an automated MEMS test system...On account of the multiformity of MEMS devices, it is necessary to integrate with some optical measurement techniques for meeting static and dynamic unit test requirements. In this paper, an automated MEMS test system is built of some commercially available components and instruments based on virtual instrument technology. The system is integrated with stroboscopic imaging, computer micro-vision, microscopic Mirau phase shifting interferometry, and laser Doppler vibrometer, and is used for the measurement of full-view in-plane and out-of-plane geometric parameters and periodical motions and single spot out-of-plane transient motion. The system configuration and measurement methods are analyzed, and some applications of the measurement of in-plane and out-of-plane dimensions and motions were described. The measurement accuracy of in-plane dimensions and out-of-plane dimensional is better than 0.2 um and 5 nm respectively. The resolution of measuring in-plane and out-of-plane motions is better than 15 nm and 2 nm respectively.展开更多
基金Supported by National Natural Science Foundation of China (No.50505031)Tianjin Municipal Science and Technology Commission(No.043185911)Programfor NewCentury Excellent Talents in University
文摘On account of the multiformity of MEMS devices, it is necessary to integrate with some optical measurement techniques for meeting static and dynamic unit test requirements. In this paper, an automated MEMS test system is built of some commercially available components and instruments based on virtual instrument technology. The system is integrated with stroboscopic imaging, computer micro-vision, microscopic Mirau phase shifting interferometry, and laser Doppler vibrometer, and is used for the measurement of full-view in-plane and out-of-plane geometric parameters and periodical motions and single spot out-of-plane transient motion. The system configuration and measurement methods are analyzed, and some applications of the measurement of in-plane and out-of-plane dimensions and motions were described. The measurement accuracy of in-plane dimensions and out-of-plane dimensional is better than 0.2 um and 5 nm respectively. The resolution of measuring in-plane and out-of-plane motions is better than 15 nm and 2 nm respectively.
