We have investigated the distribution of the electric field in p-i-n GaN avalanche photodiodes under different reverse bias values. type and separate absorption and multiplication （SAM） type We have also analyzed th...We have investigated the distribution of the electric field in p-i-n GaN avalanche photodiodes under different reverse bias values. type and separate absorption and multiplication （SAM） type We have also analyzed the influences of the parameters of each layer, including width and concentration, on the distribution of the electric field, especially on the breakdown voltage. It is found that a relatively high concentration of p-GaN （higher than 1×10^18 cm-3） and low cartier concentration of i-GaN （lower than 5×1016 cm-3） are helpful to restrict the electric field and reduce the breakdown voltage. In a SAM （p-i-n-i-n） structure, a suitable choice should be made for the concentration and thickness of the intermediate n-GaN layer in order to decrease breakdown voltage and prevent the device from degenerating into a p-i-n structure. Finally, the optimized material parameters of each layer are proposed.展开更多
基金supported by the National Science Fund for Distinguished Young Scholars (Grant No. 60925017)the National Natural Science Foundation of China (Grant Nos. 10990100,60836003 and 60776047)
文摘We have investigated the distribution of the electric field in p-i-n GaN avalanche photodiodes under different reverse bias values. type and separate absorption and multiplication （SAM） type We have also analyzed the influences of the parameters of each layer, including width and concentration, on the distribution of the electric field, especially on the breakdown voltage. It is found that a relatively high concentration of p-GaN （higher than 1×10^18 cm-3） and low cartier concentration of i-GaN （lower than 5×1016 cm-3） are helpful to restrict the electric field and reduce the breakdown voltage. In a SAM （p-i-n-i-n） structure, a suitable choice should be made for the concentration and thickness of the intermediate n-GaN layer in order to decrease breakdown voltage and prevent the device from degenerating into a p-i-n structure. Finally, the optimized material parameters of each layer are proposed.
