In this paper, we conduct theoretical research on design and implementation on wind and light complementary LED lighting controller based on the novel base board packaging technology. LED, as a kind of device can conv...In this paper, we conduct theoretical research on design and implementation on wind and light complementary LED lighting controller based on the novel base board packaging technology. LED, as a kind of device can convert electric power into visible light directly the homomorphism of semiconductor devices, with high efficiency and small energy consumption, good light quality, use safety, long service life, green environmental protection, flexible control as this is common lamps and lanterns is incomparable advantage. Therefore, it is considered to be 21 century of a new generation of lighting source. Based on the superiority of LED, it is widely applied in many fields of lighting. To enhance the traditional solar based pure LED system, we enhance it with the combination of the wind power and the optimized controller that holds specific meaning.展开更多
Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to ...Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to have high reliability. The thermal resistance of LED modules was numerical and experimental. Thermal resistance from the jtnction to aluminten metal plate, considering input power of IFD module using MOAMP technology, is 3.02 K/W, 3.23 K/W for the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED fighting modules.展开更多
文摘In this paper, we conduct theoretical research on design and implementation on wind and light complementary LED lighting controller based on the novel base board packaging technology. LED, as a kind of device can convert electric power into visible light directly the homomorphism of semiconductor devices, with high efficiency and small energy consumption, good light quality, use safety, long service life, green environmental protection, flexible control as this is common lamps and lanterns is incomparable advantage. Therefore, it is considered to be 21 century of a new generation of lighting source. Based on the superiority of LED, it is widely applied in many fields of lighting. To enhance the traditional solar based pure LED system, we enhance it with the combination of the wind power and the optimized controller that holds specific meaning.
文摘Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to have high reliability. The thermal resistance of LED modules was numerical and experimental. Thermal resistance from the jtnction to aluminten metal plate, considering input power of IFD module using MOAMP technology, is 3.02 K/W, 3.23 K/W for the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED fighting modules.
