The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization(ECMP)at different pH values including 5-methyl-1H-benzotriazole(TTA),hydroxyethylidenediphosphoric a...The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization(ECMP)at different pH values including 5-methyl-1H-benzotriazole(TTA),hydroxyethylidenediphosphoric acid(HEDP),and tribasic ammonium citrate(TAC)were investigated by electrochemical techniques,X-ray photoelectron spectrometer(XPS)analysis,nano-scratch tests,AFM measurements,and polishing of Cu-coated blanket wafers.The experimental results show that the planarization efficiency and the surface quality after ECMP obtained in alkali-based solutions are superior to that in acidic-based solutions,especially at pH=8.The optimal electrolyte compositions(mass fraction)are 6% HEDP,0.3% TTA and 3% TAC at pH=8.The main factor affecting the thickness of the oxide layer formed during ECMP process is the applied potential.The soft layer formation is a major mechanism for electrochemical enhanced mechanical abrasion.The surface topography evolution before and after electrochemical polishing(ECP)illustrates the mechanism of mechanical abrasion accelerating electrochemical dissolution,that is,the residual stress caused by the mechanical wear enhances the electrochemical dissolution rate.This understanding is beneficial for optimization of ECMP processes.展开更多
Spectrometer is an essential and necessary optical element used for measuring the chemical components and content of the matter. The development of miniature spectrometers can be traced back to 1980s. The development ...Spectrometer is an essential and necessary optical element used for measuring the chemical components and content of the matter. The development of miniature spectrometers can be traced back to 1980s. The development state and different manufacturing methods of micro-spectrometers are presented. Finally, we analyze the miniaturization trend of spectrometers. Some groundwork for the scientific research is offered by introducing micro-spectrometers development.展开更多
The problem of bimaterial body boundary, especially, microcosmic and macroscopic boundary behavior of bimetallic boundary, ceramic and metal, is paid close attention by many scholars in electronic device and communica...The problem of bimaterial body boundary, especially, microcosmic and macroscopic boundary behavior of bimetallic boundary, ceramic and metal, is paid close attention by many scholars in electronic device and communication, material science, aeronautical and astronautical engineering and et al. Modern photoelectric technology, such as laser technique, conveniently is used to measure geometrical stress field of bimaterial body, quantitatively analyse boundary mechanical behavior with crack-tip and composition of boundary matter element. One has put forward mechanical model, which is used to analyze joint energy, atom transition of matter of medium layer, diffusion and solid solution, by means of energy theory of quasi- continuous body. This paper recommended the theory, technology, and gives the results.展开更多
Most biological tissues are supple and elastic, while current electronic devices fabricated by semiconductors and metals are usually stiff and brittle. As a result, implanted electronic devices can irritate and damage...Most biological tissues are supple and elastic, while current electronic devices fabricated by semiconductors and metals are usually stiff and brittle. As a result, implanted electronic devices can irritate and damage surrounding tissues, causing immune reaction and scarring. In this work, we develop stretchable microelectrode arrays, with the development of a novel soft lithography technology, which are designed and fabricated with a polymer/stretchable metal/polymer sandwich structure. With the great deformability of stretch, compression, bend and twisting, while preserving electrical property, this technology overcomes the fundamental mismatch of mechanical properties between biological tissues and electronic devices, and provides highly-compliant, confonnal and stretchable bio-electronic interfaces. Here we also describe the following three applications of the stretchable electrode arrays： a. monitoring intracranial electroencephalography （EEG）; b. stimulating peripheral nerves to drive muscles; c. monitoring epicardial electrocardiography （ECG）. Stretchable microelectrode arrays create a promising field in biomedical applications for its better modulus match with biological tissues and robust mechanical and electrical properties. They allow for construction of electronic integrated circuits spread over on complex and dynamic curved surfaces, providing a much friendlier bio-electronic interface for diagnosis, treatment and in- telligent bio-control.展开更多
Low dielectric constant materials/Cu interconnects integration technology provides the direction as well as the challenges in the fabrication of integrated circuits(IC) wafers during copper electrochemical-mechanical ...Low dielectric constant materials/Cu interconnects integration technology provides the direction as well as the challenges in the fabrication of integrated circuits(IC) wafers during copper electrochemical-mechanical polishing(ECMP). These challenges arise primarily from the mechanical fragility of such dielectrics, in which the undesirable scratches are prone to produce. To mitigate this problem, a new model is proposed to predict the initiation of scratching based on the mechanical properties of passive layer and copper substrate. In order to deduce the ratio of the passive layer yield strength to the substrate yield strength and the layer thickness, the limit analysis solution of surface scratch under Berkovich indenter is used to analyze the nano-scratch experimental measurements. The modulus of the passive layer can be calculated by the nano-indentation test combined with the FEM simulation. It is found that the film modulus is about 30% of the substrate modulus. Various regimes of scratching are delineated by FEM modeling and the results are verified by experimental data.展开更多
In order to ensure the testing range and long-term reliability of the fiber Bragg grating （FBG） used for the smart cable, a smart cable embedded with FBG strain sensors based on the desensitized encapsulation struct...In order to ensure the testing range and long-term reliability of the fiber Bragg grating （FBG） used for the smart cable, a smart cable embedded with FBG strain sensors based on the desensitized encapsulation structure was designed. For a smart cable specimen, the fatigue loading experiments with the cycle from 100 thousands to 2 million and 0.95 times nominal breaking cable force （Pb） were carried out, which tested the long-serving effects of the smart cable. The test results of the static tension loading and unloading during the stepwise fatigue cycle process showed that the encapsulated FBG strain sensors had the good linearity and repeatability. Also all sensors survived after 2 million times fatigue cycle. 0.95Pb static tension test showed that the encapsulated FBG strain sensors embedded inside the cable reached 4.5% testing accuracy in the 0.86Pb working range. After 0.95Pb static tension test, the dissection test was carried out by breaking the force tension. The results showed that the appearances of the encapsulated sensors were good, and the design structures were not changed and damaged.展开更多
基金Project(50975058)supported by the National Science Foundation of China
文摘The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization(ECMP)at different pH values including 5-methyl-1H-benzotriazole(TTA),hydroxyethylidenediphosphoric acid(HEDP),and tribasic ammonium citrate(TAC)were investigated by electrochemical techniques,X-ray photoelectron spectrometer(XPS)analysis,nano-scratch tests,AFM measurements,and polishing of Cu-coated blanket wafers.The experimental results show that the planarization efficiency and the surface quality after ECMP obtained in alkali-based solutions are superior to that in acidic-based solutions,especially at pH=8.The optimal electrolyte compositions(mass fraction)are 6% HEDP,0.3% TTA and 3% TAC at pH=8.The main factor affecting the thickness of the oxide layer formed during ECMP process is the applied potential.The soft layer formation is a major mechanism for electrochemical enhanced mechanical abrasion.The surface topography evolution before and after electrochemical polishing(ECP)illustrates the mechanism of mechanical abrasion accelerating electrochemical dissolution,that is,the residual stress caused by the mechanical wear enhances the electrochemical dissolution rate.This understanding is beneficial for optimization of ECMP processes.
文摘Spectrometer is an essential and necessary optical element used for measuring the chemical components and content of the matter. The development of miniature spectrometers can be traced back to 1980s. The development state and different manufacturing methods of micro-spectrometers are presented. Finally, we analyze the miniaturization trend of spectrometers. Some groundwork for the scientific research is offered by introducing micro-spectrometers development.
基金supported by National Natural Science Foundation of Shandong, China! Z94A0102
文摘The problem of bimaterial body boundary, especially, microcosmic and macroscopic boundary behavior of bimetallic boundary, ceramic and metal, is paid close attention by many scholars in electronic device and communication, material science, aeronautical and astronautical engineering and et al. Modern photoelectric technology, such as laser technique, conveniently is used to measure geometrical stress field of bimaterial body, quantitatively analyse boundary mechanical behavior with crack-tip and composition of boundary matter element. One has put forward mechanical model, which is used to analyze joint energy, atom transition of matter of medium layer, diffusion and solid solution, by means of energy theory of quasi- continuous body. This paper recommended the theory, technology, and gives the results.
基金National Natural Science Foundation of China (No. 61102042)Youth Innovation Foundation of Chinese Academy of SciencesShenzhen"Peacock Plan"to Z.Y.
文摘Most biological tissues are supple and elastic, while current electronic devices fabricated by semiconductors and metals are usually stiff and brittle. As a result, implanted electronic devices can irritate and damage surrounding tissues, causing immune reaction and scarring. In this work, we develop stretchable microelectrode arrays, with the development of a novel soft lithography technology, which are designed and fabricated with a polymer/stretchable metal/polymer sandwich structure. With the great deformability of stretch, compression, bend and twisting, while preserving electrical property, this technology overcomes the fundamental mismatch of mechanical properties between biological tissues and electronic devices, and provides highly-compliant, confonnal and stretchable bio-electronic interfaces. Here we also describe the following three applications of the stretchable electrode arrays： a. monitoring intracranial electroencephalography （EEG）; b. stimulating peripheral nerves to drive muscles; c. monitoring epicardial electrocardiography （ECG）. Stretchable microelectrode arrays create a promising field in biomedical applications for its better modulus match with biological tissues and robust mechanical and electrical properties. They allow for construction of electronic integrated circuits spread over on complex and dynamic curved surfaces, providing a much friendlier bio-electronic interface for diagnosis, treatment and in- telligent bio-control.
基金Project(50975058) supported by the National Natural Science Foundation of China
文摘Low dielectric constant materials/Cu interconnects integration technology provides the direction as well as the challenges in the fabrication of integrated circuits(IC) wafers during copper electrochemical-mechanical polishing(ECMP). These challenges arise primarily from the mechanical fragility of such dielectrics, in which the undesirable scratches are prone to produce. To mitigate this problem, a new model is proposed to predict the initiation of scratching based on the mechanical properties of passive layer and copper substrate. In order to deduce the ratio of the passive layer yield strength to the substrate yield strength and the layer thickness, the limit analysis solution of surface scratch under Berkovich indenter is used to analyze the nano-scratch experimental measurements. The modulus of the passive layer can be calculated by the nano-indentation test combined with the FEM simulation. It is found that the film modulus is about 30% of the substrate modulus. Various regimes of scratching are delineated by FEM modeling and the results are verified by experimental data.
基金The research work reported in this paper was jointly supported by the National Engineering Laboratory for Fiber Optic Sensing Technology, Wuhan University of Technology, China and FASTEN Group Company. Thanks to the support of Wuhan City Building Research Funds （201310）, the Fundamental Research Funds for the Central Universities （WUT： 2014-IV-090）, and the National Natural Science Foundation of China （Major Program： 61290310）. Open Access This article is distributed under the terms of the Creative Commons Attribution License which permits any use, distribution, and reproduction in any medium, provided the original author（s） and source are credited.
文摘In order to ensure the testing range and long-term reliability of the fiber Bragg grating （FBG） used for the smart cable, a smart cable embedded with FBG strain sensors based on the desensitized encapsulation structure was designed. For a smart cable specimen, the fatigue loading experiments with the cycle from 100 thousands to 2 million and 0.95 times nominal breaking cable force （Pb） were carried out, which tested the long-serving effects of the smart cable. The test results of the static tension loading and unloading during the stepwise fatigue cycle process showed that the encapsulated FBG strain sensors had the good linearity and repeatability. Also all sensors survived after 2 million times fatigue cycle. 0.95Pb static tension test showed that the encapsulated FBG strain sensors embedded inside the cable reached 4.5% testing accuracy in the 0.86Pb working range. After 0.95Pb static tension test, the dissection test was carried out by breaking the force tension. The results showed that the appearances of the encapsulated sensors were good, and the design structures were not changed and damaged.
