当前主流的传统C/S架构的IPTV网络存储成本巨大,即使是采用H.264这样的高性能编码器,可以节省的存储费用也是有限的,而且服务器的响应时间长,服务器性能和带宽“瓶颈”严重。提出一种P2P(Peer to Peer)和C/S(Client/Server)混合的用于...当前主流的传统C/S架构的IPTV网络存储成本巨大,即使是采用H.264这样的高性能编码器,可以节省的存储费用也是有限的,而且服务器的响应时间长,服务器性能和带宽“瓶颈”严重。提出一种P2P(Peer to Peer)和C/S(Client/Server)混合的用于存储和传送IPTV(Internet Protocol based Tele- vision)数据的网络新结构G2P(Group to Point),并详细介绍G2P结构中媒体服务器的分布以及分布式差异化存储和组对点分片数据分发方式,分析比较采用G2P技术发展IPTV业务的特点,并针对不足之处提出改进方向。展开更多
In this paper,a 2-mm long on-chip dipole antenna pair on silicon substrate is simulated to investigate the transmission characteristics.A novel technique is proposed by employing a 0.35-mm thick diamond layer between ...In this paper,a 2-mm long on-chip dipole antenna pair on silicon substrate is simulated to investigate the transmission characteristics.A novel technique is proposed by employing a 0.35-mm thick diamond layer between silicon substrate and heat sink to improve antenna performance.The simulated transmission gain of this antenna pair with 1 mm separation on a 10-Ω cm silicon substrate increases by 9 dB at 20 GHz.A modified plane wave model involving diamond layer is also presented to explain gain improvement.Effects of dielectric variety,diamond thickness,substrate resistivity and antenna pair separation on transmission gain have been studied.The results indicate that thinner diamond layer along with high resistivity substrate is preferred.Our method makes integrated dipole antennas well suitable for intra-chip wireless interconnection which is known as a future solution to replace critical wiring interconnection.展开更多
文摘当前主流的传统C/S架构的IPTV网络存储成本巨大,即使是采用H.264这样的高性能编码器,可以节省的存储费用也是有限的,而且服务器的响应时间长,服务器性能和带宽“瓶颈”严重。提出一种P2P(Peer to Peer)和C/S(Client/Server)混合的用于存储和传送IPTV(Internet Protocol based Tele- vision)数据的网络新结构G2P(Group to Point),并详细介绍G2P结构中媒体服务器的分布以及分布式差异化存储和组对点分片数据分发方式,分析比较采用G2P技术发展IPTV业务的特点,并针对不足之处提出改进方向。
基金supported by the National High Technology Research and Development Program of China (Grant Nos. 2009AA01Z124 and 2009AA01Z102)the National Natural Science Foundation of China (Grant No. 60873212)
文摘In this paper,a 2-mm long on-chip dipole antenna pair on silicon substrate is simulated to investigate the transmission characteristics.A novel technique is proposed by employing a 0.35-mm thick diamond layer between silicon substrate and heat sink to improve antenna performance.The simulated transmission gain of this antenna pair with 1 mm separation on a 10-Ω cm silicon substrate increases by 9 dB at 20 GHz.A modified plane wave model involving diamond layer is also presented to explain gain improvement.Effects of dielectric variety,diamond thickness,substrate resistivity and antenna pair separation on transmission gain have been studied.The results indicate that thinner diamond layer along with high resistivity substrate is preferred.Our method makes integrated dipole antennas well suitable for intra-chip wireless interconnection which is known as a future solution to replace critical wiring interconnection.