选取莱文在English Verb and Alternations一书中收录的切刻类动词为语料,运用成分理论讨论动词及其变式的语义关系。在此研究了切刻类动词进入相应变式的准入条件,讨论了在概念框架下切刻类动词和其变式的语义联系,并且指出莱文对动词...选取莱文在English Verb and Alternations一书中收录的切刻类动词为语料,运用成分理论讨论动词及其变式的语义关系。在此研究了切刻类动词进入相应变式的准入条件,讨论了在概念框架下切刻类动词和其变式的语义联系,并且指出莱文对动词分类的不合理之处,提出了修改意见。展开更多
Several orthogonal cutting experiments were carried out on SiC reinforced aluminium composites. In the cutting process, photos of the chip bottom specimen SEM were gotten with the aid of ‘quick stop tool device’. Ac...Several orthogonal cutting experiments were carried out on SiC reinforced aluminium composites. In the cutting process, photos of the chip bottom specimen SEM were gotten with the aid of ‘quick stop tool device’. According to the photos, the build up edge (BUE) can be produced in circumferential cutting experiments. In comparison with carbon steel BUE, aluminium composites BUE is like a wedge in shape, and its development mechanism is mechanical enchasing other than "cold welding". In addition to the above mentioned conclusions, the minishing BUE height H b is also analyzed.展开更多
Objective Mandibular angle ostectomy is usually applied to the facial contouring sculpture. We evaluated the various techniques in order to enhance the precision and avoid unnecessary damage. Methods Before operation ...Objective Mandibular angle ostectomy is usually applied to the facial contouring sculpture. We evaluated the various techniques in order to enhance the precision and avoid unnecessary damage. Methods Before operation the area and quantity resected bone were designed according to facial measurement, mandible pantomagraphy and orthophoria and lateral localized radiograph of skull. The Incises of mandibular angle ostectomy included intraoral, retroauricular or intraoral associated with retroauricular. Howerer, the sagittal resection of mandible outer table was necessary in all intraoral incise. Results Single mandibular angle ostectomy was not satisfactory for the patients having mandible hypertrophy with over-width basifacial contouring. Mandibular angle ostectomy combined with the sagittal resection of outer table of mandibular angle were required. Good symmetry and appearance were gained in 206 cases. One case had facial paralysis. Two patients occured mandibular fracture during the operation. Three cases complicated angled deformity at mandible body. Conclusion Reduction mandibuloplasty should be selected depends on varied types of mandibular angle hypertrophy before operation.展开更多
Dicing of fabricated MEMS （microelectromechanical system） devices is sometimes a source of challenge, especially when devices are overhanging structures. In this work, a modified cleaving technique is developed to p...Dicing of fabricated MEMS （microelectromechanical system） devices is sometimes a source of challenge, especially when devices are overhanging structures. In this work, a modified cleaving technique is developed to precisely separate fabricated devices from a silicon substrate without requiring a dicing machine. This technique is based on DRIE （deep reactive ion etching） which is regularly used to make cleaving trenches in the substrate during the releasing stage. Other similar techniques require some extra later steps or in some cases a long HF soak. To mask the etching process, a thick photoresist is used. It is shown that by applying different UV （ultraviolate） exposure and developing times for the photoresist, the DRIE process could be controlled to etch specific cleaving trenches with less depth than other patterns on the photoresist. Those cleaving trenches are used to cleave the wafer later, while the whole wafer remains as one piece until the end of the silicon etching despite some features being etched all the way through the wafer at the same time. The other steps of fabricating and releasing the devices are unaffected. The process flow is described in details and some results of applying this technique for cleaving fabricated cantilevers on a silicon substrate are presented.展开更多
文摘Several orthogonal cutting experiments were carried out on SiC reinforced aluminium composites. In the cutting process, photos of the chip bottom specimen SEM were gotten with the aid of ‘quick stop tool device’. According to the photos, the build up edge (BUE) can be produced in circumferential cutting experiments. In comparison with carbon steel BUE, aluminium composites BUE is like a wedge in shape, and its development mechanism is mechanical enchasing other than "cold welding". In addition to the above mentioned conclusions, the minishing BUE height H b is also analyzed.
文摘Objective Mandibular angle ostectomy is usually applied to the facial contouring sculpture. We evaluated the various techniques in order to enhance the precision and avoid unnecessary damage. Methods Before operation the area and quantity resected bone were designed according to facial measurement, mandible pantomagraphy and orthophoria and lateral localized radiograph of skull. The Incises of mandibular angle ostectomy included intraoral, retroauricular or intraoral associated with retroauricular. Howerer, the sagittal resection of mandible outer table was necessary in all intraoral incise. Results Single mandibular angle ostectomy was not satisfactory for the patients having mandible hypertrophy with over-width basifacial contouring. Mandibular angle ostectomy combined with the sagittal resection of outer table of mandibular angle were required. Good symmetry and appearance were gained in 206 cases. One case had facial paralysis. Two patients occured mandibular fracture during the operation. Three cases complicated angled deformity at mandible body. Conclusion Reduction mandibuloplasty should be selected depends on varied types of mandibular angle hypertrophy before operation.
文摘Dicing of fabricated MEMS （microelectromechanical system） devices is sometimes a source of challenge, especially when devices are overhanging structures. In this work, a modified cleaving technique is developed to precisely separate fabricated devices from a silicon substrate without requiring a dicing machine. This technique is based on DRIE （deep reactive ion etching） which is regularly used to make cleaving trenches in the substrate during the releasing stage. Other similar techniques require some extra later steps or in some cases a long HF soak. To mask the etching process, a thick photoresist is used. It is shown that by applying different UV （ultraviolate） exposure and developing times for the photoresist, the DRIE process could be controlled to etch specific cleaving trenches with less depth than other patterns on the photoresist. Those cleaving trenches are used to cleave the wafer later, while the whole wafer remains as one piece until the end of the silicon etching despite some features being etched all the way through the wafer at the same time. The other steps of fabricating and releasing the devices are unaffected. The process flow is described in details and some results of applying this technique for cleaving fabricated cantilevers on a silicon substrate are presented.
