Localization of the inspected chip image is one of the key problems with machine vision aided surface mount devices (SMD) and other micro-electronic equipments. This paper presents a new edge-directed subpixel edge lo...Localization of the inspected chip image is one of the key problems with machine vision aided surface mount devices (SMD) and other micro-electronic equipments. This paper presents a new edge-directed subpixel edge localization method. The image is divided into two regions, edge and non-edge, using edge detection to emphasize the edge feature. Since the edges of the chip image are straight, they have straight-line characteristics locally and globally. First, the line segments of the straight edge are located to subpixel precision, according to their local straight properties, in a 3×3 neighborhood of the edge region. Second, the subpixel midpoints of the line segments are computed. Finally, the straight edge is fitted using the midpoints and the least square method, according to its global straight property in the entire edge region. In this way, the edge is located to subpixel precision. While fitting the edge, the irregular points are eliminated by the angles of the line segments to improve the precision. We can also distinguish different edges and their intersections using the angles of the line segments and distances between the edge points, then give the vectorial result of the image edge with high precision.展开更多
The fabrication technique of micro/nano-scale speckle patterns with focused ion beam (FIB) system is studied for digital image correlation (DIC) measurement under a scanning electron microscope (SEM).The speckle patte...The fabrication technique of micro/nano-scale speckle patterns with focused ion beam (FIB) system is studied for digital image correlation (DIC) measurement under a scanning electron microscope (SEM).The speckle patterns are fabricated by directly etching the counterpart of the specimen to the black part of a template.Mean intensity gradient is used to evaluate the quality of these SEM images of speckle patterns fabricated based on different templates to select an optimum template.The pattern size depending on the displacement measurement sensitivity is adjusted by altering the magnification of FIB according to the relation curve of the etching size versus magnification.The influencing factors including etching time and ion beam current are discussed.Rigid body translation tests and rotation tests are carried out under SEM to verify the reliability of the fabricated speckle patterns.The calculated values are in good agreement with the imposed ones.展开更多
文摘Localization of the inspected chip image is one of the key problems with machine vision aided surface mount devices (SMD) and other micro-electronic equipments. This paper presents a new edge-directed subpixel edge localization method. The image is divided into two regions, edge and non-edge, using edge detection to emphasize the edge feature. Since the edges of the chip image are straight, they have straight-line characteristics locally and globally. First, the line segments of the straight edge are located to subpixel precision, according to their local straight properties, in a 3×3 neighborhood of the edge region. Second, the subpixel midpoints of the line segments are computed. Finally, the straight edge is fitted using the midpoints and the least square method, according to its global straight property in the entire edge region. In this way, the edge is located to subpixel precision. While fitting the edge, the irregular points are eliminated by the angles of the line segments to improve the precision. We can also distinguish different edges and their intersections using the angles of the line segments and distances between the edge points, then give the vectorial result of the image edge with high precision.
基金supported by the National Basic Research Program of China (Grant Nos.2010CB631005 and 2011CB606105)the National Natural Science Foundation of China (Grant Nos.90916010 and 11172151)the Specialized Research Fund for the Doctoral Program of Higher Education (Grant No. 20090002110048)
文摘The fabrication technique of micro/nano-scale speckle patterns with focused ion beam (FIB) system is studied for digital image correlation (DIC) measurement under a scanning electron microscope (SEM).The speckle patterns are fabricated by directly etching the counterpart of the specimen to the black part of a template.Mean intensity gradient is used to evaluate the quality of these SEM images of speckle patterns fabricated based on different templates to select an optimum template.The pattern size depending on the displacement measurement sensitivity is adjusted by altering the magnification of FIB according to the relation curve of the etching size versus magnification.The influencing factors including etching time and ion beam current are discussed.Rigid body translation tests and rotation tests are carried out under SEM to verify the reliability of the fabricated speckle patterns.The calculated values are in good agreement with the imposed ones.