低温型风力发电机钢结构件的选材分析

通过分析低温型风力发电机钢结构件在工作温度、材料性能、制造工艺上的要求,提出低温型风力发电机钢结构件材料的选用原则。

Comparison of microstructures and mechanical properties between forging and rolling processes for commercially pure titanium

In order to reveal the differences caused by forging and rolling process for titanium ingots, hot compression behavior, mechanical properties and the microstructures of forged billets and rolled ones were investigated in detail using Gleeble-1500 thermal mechanical simulator, universal testing machine and optical microscope （OM）. The compression deformation experimental data of commercially pure titanium （CP-Ti） were mapped to be a T vs lg diagram in which data fall into three distinct regions, i.e., three-stage work hardening, two-stage work hardening and flow softening, which can be separated by border lines at 17.5 and 15.4 for lg Z, where Z represents the Zener-Hollomon parameter. The deformation twin is found to have higher Z-value corresponding to the work hardening region. The differences in microstructures and mechanical properties for two kinds of billets indicate that forged billet consists of deformation twins and some twin intersections, and many twins cross the grain boundaries. However, nearly no twins can be seen in the microstructure of billet formed by rolling under optical microscope （OM）, but there are equiaxed and platelike grains. Tensile tests and Vickers hardness test indicate that yield strength, tensile strength and microhardness of the samples after forging are higher than those after rolling.

2BAX-35型新型高效自吸泵

由临沂市农业机械研究所研制的2BAX-35型新型高效自吸泵,近期通过临沂市科委组织的鉴定。

机械零部件的测绘、CAD制图及加工选取

随着市场经济的不断深入,基础建设的飞速发展,机电类工程建设也在快速的发展,机械零部件的设计,更换与研发也越来越得到重视。文章就针对机械零部件在损坏、失效后的如何处理进行研究,重点阐述了机械零部件的测绘,AutoCAD制图以及在机械部零件的加工选取时所要注意的诸多问题。

Influence of Manufacturing Process of Warp-knitted Vascular Prosthesis on the Wall Homogeneity

This paper reports the evolution of textile structure and mechanical properties of vascular prosthesis in the level of the whole prosthesis and the constituent filaments with respect to the manufacturing process. The tubular wall of the prosthesis is divided circumferentially into three zones; basic line (BL), remeshing line ( RL) and guide line ( GL). Some heterogeneity has been observed on the tubular wall in terms of stitch structure of the prosthesis and linear density of the constituent filaments. The breaking position of the prosthesis under circumferential tensile localizes preferentially in remeshing line that is the weakest zone by warp knitting with double needle bed. Furthermore, the statistical differences of the mechanical properties of the filaments of zone RL, GL and BL have been confirmed too. It is predictable that the deterioration of prosthesis, under physiological loads (periodical pulse blood pressure etc.), could happen firstly in the weaker zone in vivo.

Fabrication of iridium oxide neural electrodes at the wafer level

Electro-deposition, electrical activation, thermal oxidation, and reactive ion sputtering are the four primary methods to fabricate iridium oxide film. Among these methods, reactive ion sputtering is a commonly used method in standard micro-fabrication processes. In different sputtering conditions, the component, texture, and electrochemistry character of iridium oxide varies considerably. To fabricate the iridium oxide film compatible with the wafer-level processing of neural electrodes, the quality of iridium oxide film must be able to withstand the mechanical and chemical impact of post-processing, and simultaneously achieve good performance as a neural electrode. In this study, parameters of sputtering were researched and developed to achieve a balance between mechanical stability and good electrochemical characteristics of iridium oxide film on electrode. Iridium oxide fabricating process combined with fabrication flow of silicon electrodes, at wafer-level, is introduced to produce silicon based planar iridium oxide neural electrodes. Compared with bare gold electrodes, iridium oxide electrodes fabricated with this method exhibit particularly good electrochemical stability, low impedance of 386 kW at 1 kH z, high safe charge storage capacity of 3.2 m C/cm^2, and good impedance consistency of less than 25% fluctuation.

Improved conversion efficiency of dye-sensitized solar cells by using novel complex nanostructured TiO_2 electrodes

A novel complex nanostructured TiO2 electrode and fabrication process were proposed and demonstrated to improve the performance of dye-sensitized solar cells(DSSCs).In the proposed process,a nanoporous TiO2 layer was firstly fabricated on the FTO(fluorine-doped tin oxide) conducting substrate by an anodization process,then a nanoparticulate TiO2 film was deposited on the nanoporous TiO2 layer by the screen printed method to form the complex nanostructured TiO2 electrode.The experiments demonstrated that the nanoporous TiO layer can enhance the light scattering,decrease the contact resistance between TiO2 electrode and FTO,and suppress the recombination of I3-ion with the injected electrons of FTO.The process variables are crucial to obtain the optimized performance of DSSCs.By adopting the optimized process,improved conversion efficiency of DSSCs was achieved at AM 1.5 sunlight.

High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication

Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.