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高导电片状银包铜粉的制备技术研究 被引量:6
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作者 伍继君 朱晓云 +2 位作者 郭忠诚 黄峰 李国明 《电子元件与材料》 CAS CSCD 北大核心 2006年第7期39-42,共4页
采用[Ag(NH3)]^+溶液对片状铜粉进行包覆,研究了铜粉粒径、[Ag(NH3)]^+溶液浓度、包覆温度、分散剂含量等因素对银包铜粉银含量和电阻率等的影响。结果表明:通过控制包覆温度(60℃)、银氨络离子浓度(0.8mol·L^-1)以... 采用[Ag(NH3)]^+溶液对片状铜粉进行包覆,研究了铜粉粒径、[Ag(NH3)]^+溶液浓度、包覆温度、分散剂含量等因素对银包铜粉银含量和电阻率等的影响。结果表明:通过控制包覆温度(60℃)、银氨络离子浓度(0.8mol·L^-1)以及分散剂含量(1.0g·L^-1),得到了电阻率为0.8×10^-3Ω·cm的银包铜粉。XRD分析表明,该银包铜粉只有Ag和Cu相,不含中间产物。银包铜粉松装密度为0.50g·cm^-3左右,比表面积为3.1~3.3m^2·g^-1。 展开更多
关键词 复合材料 导电性 片状银铜粉 包覆温度 分散剂
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Effect of clad ratio on interfacial microstructure and properties of cladding billets via direct-chill casting process 被引量:4
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作者 Hai-tao ZHANG Xing HAN +3 位作者 Dong-tao WANG Bo SHAO Ke QIN Jian-zhong CUI 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2018年第5期998-1006,共9页
Numerical simulation and experiments were introduced to develop AA4045/AA3003 cladding billets with different clad-ratios. The temperature fields, microstructures and mechanical properties near interface were investig... Numerical simulation and experiments were introduced to develop AA4045/AA3003 cladding billets with different clad-ratios. The temperature fields, microstructures and mechanical properties near interface were investigated in detail. The results show that cladding billets with different clad-ratios were fabricated successfully. Si and Mn elements diffused across the bonding interface and formed diffusion layer. With the increase of clad-layer thickness, the interfacial region transforms from semisolid-solid state to liquid-solid state and the diffusion layer increased from 10 to 25 μm. The hardness at interface is higher than that of AA3003 side but lower than that of the other side. The bonding strength increased with the clad-layer thickness, attributing to solution strengthening due to elements diffusion. The cladding billets were extruded into clad pipe by indirect extrusion process after homogenization. The clad pipe remained the interfacial characteristics of as-cast cladding billet and the heredity of clad-ratio during deformation was testified. 展开更多
关键词 cladding billet clad ratio temperature field interfacial microstzucture diffusion layer bonding strength
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