化学微蚀工艺对铜面表观粗糙度的影响研究

随着电子产品朝轻小薄方向发展,PCB产品布线密度也在不断增加,这也给线路制作带来更大的挑战。化学微蚀作为线路制作的关键因素,研究其对铜面粗糙度的影响显得越来越重要。本文研究了硫酸-过硫酸钠、中粗化和超粗化三种化学前处理体系对铜面表观粗糙度的影响,利用三维非接触式光学轮廓仪测量微蚀后铜面的粗糙度,得到每种药水微蚀量和铜面粗糙度的变化规律。结果表明:在药水组成一定的条件下,铜面经硫酸-过硫酸钠处理后的粗糙度与微蚀量变化相关性不大;中粗化处理的铜面粗糙度随着微蚀量的增大呈现出先增大、后减小、再增大的趋势;超粗化处理的铜面粗糙度随着微蚀量的增大呈现出先增大、后变平缓的趋势。

Chemical etching process of copper electrode for bioelectrical impedance technology

In order to obtain bioelectrical impedance electrodes with high stability, the chemical etching process was used to fabricate the copper electrode with a series of surface microstructures. By changing the etching processing parameters, some comparison experiments were performed to reveal the influence of etching time, etching temperature, etching liquid concentration, and sample sizes on the etching rate and surface microstructures of copper electrode. The result shows that the etching rate is decreased with increasing etching time, and is increased with increasing etching temperature. Moreover, it is found that the sample size has little influence on the etching rate. After choosing the reasonable etching liquid composition （formulation 3）, the copper electrode with many surface microstructures can be obtained by chemical etching process at room temperature for 20 rain. In addition, using the alternating current impedance test of electrode-electrode for 24 h, the copper electrode with a series of surface microstructures fabricated by the etching process presents a more stable impedance value compared with the electrocardiograph （ECG） electrode, resulting from the reliable surface contact of copper electrode-electrode.

Effects of Hg and Ga on microstructures and electrochemical corrosion behaviors of Mg anode alloys

The effects of Hg and Ga on the electrochemical corrosion behaviors of the Mg-2%Hg, Mg-2%Ga and Mg-2%Hg-2%Ga (mass fraction) alloys were investigated by measurements of polarization curves, galvanostatic tests and measurements of electrochemical impedance spectroscopy. Scanning electron microscopy, X-ray diffractometry and energy dispersive spectrometry were employed to characterize the microstructures and the corroded surface of the above alloys. The results demonstrate that the microstructure of the Mg-2%Ga alloy is solid solution and the Mg-2%Hg and Mg-2%Hg-2%Ga alloys have white second-phases at the grain boundaries. The Mg-2%Ga alloy has the worst electrochemical activity and the best corrosion resistance, showing a mean potential of -1.48 V and a corrosion current density of 0.15 mA/cm2. The Mg-2%Hg-2%Ga alloy has the best electrochemical activity and the worst corrosion resistance, showing a mean potential of -1.848 V and a corrosion current density of 2.136 mA/cm2. The activation mechanism of the Mg-Hg-Ga alloy is dissolution-deposition of the Hg and Ga atoms.

Microstructure and electrochemical corrosion behavior of selective laser melted Ti−6Al−4V alloy in simulated artificial saliva

Ti−6Al−4V alloy was fabricated via selective laser melting(SLM)to improve its corrosion resistance for implant.The microstructure and electrochemical corrosion behavior were investigated using scanning electron microscopy(SEM),electron backscatter diffraction(EBSD),transmission electron microscopy(TEM),electrochemical test and contact angle test.It can be found that the as-selective laser melted(as-SLMed)Ti−6Al−4V alloys showβcolumnar microstructure in building direction and nearly circular checkerboard microstructure in scanning direction,while the wrought and wrought+HT samples exhibit equiaxed microstructure.The as-SLMed Ti−6Al−4V alloy exhibits better corrosion resistance than the wrought and wrought+HT samples due to hydrophobicity,high grain boundary density and uniform distribution of alloying elements in simulated artificial saliva at 37℃.

Effect of three-step homogenization on microstructure and properties of 7N01 aluminum alloys

The effect of different homogenization treatments on the microstructure and properties of the 7N01 aluminum alloy was investigated using hardness measurements, electrical conductivity measurements, tensile and slow strain rate tests, electron probe microanalysis, optical microscopy, scanning electron microscopy, and transmission electron microscopy. The results revealed that three-step homogenization improved the uniformity of Zr distribution by eliminating segregation of the main alloying elements. During the second homogenization step at 350 °C for 10 h, coarse and strip-like equilibrium η phases formed which assisted the nucleation of Al3Zr dispersoids and reduced the width of the precipitate-free zone of A13Zr dispersoids. As a result, coarse recrystallization was greatly reduced after homogenization at 200 °C, 2 h ＋ 350 °C, 10 h ＋ 470 °C, 12 h, which contributed to improving the overall properties of the 7N01 aluminum alloys.

Effect of thermo-mechanical processing on microstructure and electrochemical behavior of Ti-Nb-Zr-V new metastable β titanium biomedical alloy

The influence of thermo-mechanical processing (TMP) on the microstructure and the electrochemical behavior of new metastableβ alloy Ti?20.6Nb?13.6Zr?0.5V (TNZV) was investigated. The TMP included hot working in belowβ transus, solution heat treatments at the same temperature and different cooling rates in addition to aging. Depending upon the TMP conditions, a wide range of microstructures with varying spatial distributions and morphologies of equiaxed/elongatedα andβ phases were attained, allowing for a wide range of electrochemical properties to be achieved. The corrosion behavior of the studied alloy was evaluated in a Ringer’s solution at 37 °C via open circuit potential?time and potentiodynamic polarization measurements.

Corrosion behavior of bulk two-phase Ag-25Cu alloys with different microstructures in NaCl aqueous solution

In order to have a better understanding on the corrosion mechanisms of bulk two-phase Ag-25Cu (at.%) alloys with different microstructures, two bulk nanocrystalline Ag-25Cu alloys and one coarse grained counterpart were prepared by liquid phase reduction (LPR), mechanical alloying (MA) and powder metallurgy (PM) methods, respectively. Their corrosion behavior was investigated comparatively using electrochemical methods in NaCl aqueous solution. Results show that the microstructure of the coarse grained PMAg-25Cu alloy is extremely inhomogeneous. On the contrary, compared with PMAg-25Cu alloy, the microstructures of the nanocrystalline LPRAg-25Cu and MAAg-25Cu alloys are more homogeneous, especially for LPRAg-25Cu alloy. The corrosion rate of MAAg-25Cu alloy is higher than that of PMAg-25Cu alloy, but lower than that of LPRAg-25Cu alloy. Furthermore, the passive films formed by three Ag-25Cu alloys exhibit n-type semiconducting properties. The passive current density of LPRAg-25Cu alloy is lower than that of PMAg-25Cu alloy, but higher that of MAAg-25Cu alloy.

Microstructure,mechanical properties and corrosion performance of selective laser melting Ti/GNPs composite with a porous structure

In this study,nano-graphene reinforced titanium matrix composites(GNPs/Ti)with a honeycomb porous structure were fabricated by selective laser melting(SLM).The effects of graphene on the microstructure,mechanical properties and corrosion performance of the SLM GNPs/Ti were systematically investigated.Results of microstructure characterization show that:1)the density of the SLM GNPs/Ti was improved as compared to that of the SLM Ti;2)abundant TiC particles were formed in the SLM GNPs/Ti.The hardness and compressive strength of the composite increased by 90%(from HV 236 to HV 503)and 14%(from 277 MPa to 316 MPa),respectively,attributed to the uniformly distributed TiC and fine GNPs in the Ti matrix.Electrochemical tests reveal that the corrosion current density of the SLM GNPs/Ti is only 0.328μA/cm^(2),that is about 25%less than that of the SLM Ti.The results indicate that the incorporation of nano-graphene is a potential method to strengthen the Ti by SLM.

A novel colloid probe preparation method based on chemical etching technique

Several fundamental problems in hydrophobic force measurements using atomic force microscope (AFM) are dis-cussed in this paper. A novel method for colloid probe preparation based on chemical etching technology is proposed, which is specially fit for the unique demands of hydrophobic force measurements by AFM. The features of three different approaches for determining spring constants of rectangular cantilevers, including geometric dimension, Cleveland and Sader methods are com-pared. The influences of the sizes of the colloids on the measurements of the hydrophobic force curves are investigated. Our experimental results showed that by selecting colloid probe with proper spring constant and tip size, the hydrophobic force and the complete hydrophobic interaction force curve can be measured by using AFM.

Generation reason and corrosion characteristicof cavity of tinplate alloy layer

The surface morphology of alloy layer of tinplate was studied by means of scanning electron microscopy. By using the layer on layer debonding technology of glow discharge spectrum, the contents of C and O at the boundary of alloy layer and black plate were analyzed. And the corrosion characteristic of cavity of tinplate alloy layer was studied on-line and in-situ by means of electrochemical atomic force microscope. The corrosion depth of cavity of alloy layer in-situ after different corrosion time was measured. The results show that the cavity of alloy layer is a critical factor causing rapid decline of corrosion resistance of tinplate, and the formation of cavity of alloy layer is due to incorrect pretreatment of black plate before electrotinning. The cavity of alloy layer is the internal factor causing pitting corrosion of tinplate when the tinplate is applied to food packaging material. And the dynamic equation of pitting corrosion generated in the cavity of alloy layer conforms to logarithm law.

Corrosion Process Detection of Tinplate in Deaerated Functional Beverage by EIS

The corrosion process of tinplate in deaerated functional beverage was investigated by using electrochemical impedance spectroscopy (EIS) combined with scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) techniques. The results reveal that the uncoated tinplate shows a poor corrosion resistance and the corrosion type is detinning. During the initial stage of immersion, EIS spectrum consisted of two capacitance arcs with obvious time-constant dispersion effect, which was attributed to the two-dimensional and three-dimensional inhomogeneous distribution of the electrode surface. With the increase of immersion time, the capacitance arc of high frequency shrunk and degenerated, due to the corrosion of tin coating. The pore resistance of tin coating and the charger transfer resistance of substrate, which are determined from the electrochemical equivalent circuit, can be used as the indicators of tinplate corrosion process. The decrease of the pore resistance of tin coating indicates that the corrosion degree of tin layer becomes more severe, whereas the decrease of the charger transfer resistance of substrate implies that the corrosion degree of steel substrate also becomes more severe as the immersion time prolongs.

Through-thickness inhomogeneity of localized corrosion in 7050-T7451 Al alloy thick plate

The through-thickness corrosion inhomogeneity of 7050-T7451 Al alloy thick plate was studied using immersion tests, potentiodynamic polarization, electrochemical impedance spectroscopy(EIS), slow strain rate testing(SSRT) technique combined with optical microscopy(OM), scanning electron microscopy(SEM) and transmission electron microscopy(TEM). The results show that the through-thickness corrosion resistance is ranked in the order of T/2>surface>T/4. And the 75 mm-thick 7050 alloy plate presents better corrosion resistance than the 35 mm-thick plate. The results are discussed in terms of the combined effect of recrystallization and cooling rate in quenching. Alloy with lower volume fraction of recrystallization and smaller grain aspect ratio displays better corrosion resistance. The lower corrosion resistance caused by the slower cooling rate results from the higher coverage rate of grain boundary precipitates and larger width of precipitate free zone.

Microstructure characterization and electrochemical corrosion behavior of Zn and Zn/Mg alloys in H_2SO_4 solution

The three systems of pure Zn, Zn-0.10% Mg(mass fraction), and Zn-0.15% Mg(mass fraction) were cast under controlled atmosphere and their microstructures were characterized by SEM/EDS analysis. The electrochemical corrosion behavior of these three samples was examined in the very aggressive solution of 50% H2SO4(mass fraction) using electrochemical impedance spectroscopy(EIS) and potentiodynamic polarization measurements. The results show that magnesium improves in some extent the corrosion resistance of pure Zn in 50% H2SO4(mass fraction) confirmed by EIS test. Results of polarization measurment also demonstrate that small amount of Mg significantly improves the passivation of Zn in the test solution. Results of surface morphology of the samples and EDS analysis reveal that Mg reduced the corrosion attacks to pure Zn.