A series of tests were carried microstructures of 2124 aluminum alloy in increase of aging time, temperature and low-to-peak-to-low manner. No significant out to investigate the effects of process parameters on mechan...A series of tests were carried microstructures of 2124 aluminum alloy in increase of aging time, temperature and low-to-peak-to-low manner. No significant out to investigate the effects of process parameters on mechanical properties and creep aging process. The results show that creep strain and creep rate increase with the applied stress. The hardness of specimen varies with aging time and stress in a effect of temperature on hardness of material is seen in the range of 185-195 ℃. The optimum mechanical properties are obtained at the conditions of （200 MPa, 185 ℃, 8 h） as the result of the coexistence of strengthening S＂ and S＇ phases in the matrix by transmission electron microscopy （TEM）. TEM observation shows that applied stress promotes the formation and growth of precioitates and no obvious stress orientation effect is observed in the matrix.展开更多
Differential scanning calorimetric （DSC） study was carried out at different heating rates to examine the solid state reactions in a 7150 A1-Zn-Mg alloy in water-quenched （WQ） state, naturally and artificially aged...Differential scanning calorimetric （DSC） study was carried out at different heating rates to examine the solid state reactions in a 7150 A1-Zn-Mg alloy in water-quenched （WQ） state, naturally and artificially aged tempers. The exothermic and endothermic peaks of the thermograms indicating the solid state reaction sequence were identified. The shift of peak temperatures to higher temperatures with increasing heating rates suggests that the solid state reactions are thermally activated and kinetically controlled. The artificial aging behaviour of the alloy was assessed by measuring the variations of hardness with aging time. The fraction of transformation （Y）, the rate of transformation （dY/dt）, the transformation functionflY）, and the kinetic parameters such as activation energy （Q） and frequency factor （k0） of all the solid state reactions in the alloy were determined by analyzing the DSC data, i.e. heat flow involved with the corresponding DSC peaks. It was found that the kinetic parameters of the solid state reactions are in good agreement with the published data.展开更多
This research sought to improve the properties of SAC305 solder joints by the addition of 1 and 2 wt.%Bi.The effects of bismuth doping on the microstructure,thermal properties,and mechanical performance of the SAC305−...This research sought to improve the properties of SAC305 solder joints by the addition of 1 and 2 wt.%Bi.The effects of bismuth doping on the microstructure,thermal properties,and mechanical performance of the SAC305−xBiCu solder joints were investigated.Bi-doping modified the microstructure of the solder joints by refining the primaryβ-Sn and eutectic phases.Bi-doping below 2 wt.%dissolved in theβ-Sn matrix and formed a solid solution,whereas Bi additions equal to or greater than 2 wt.%formed Bi precipitates in theβ-Sn matrix.Solid solution strengthening and precipitation strengthening mechanisms in theβ-Sn matrix increased the ultimate tensile strength and microhardness of the alloy from 35.7 MPa and 12.6 HV to 55.3 MPa and 20.8 HV,respectively,but elongation decreased from 24.6%to 16.1%.The fracture surface of a solder joint containing 2 wt.%Bi was typical of a brittle failure rather than a ductile failure.The interfacial layer of all solder joints comprised two parallel IMC layers:a layer of Cu6Sn5 and a layer of Cu3Sn.The interfacial layer was thinner and the shear strength was greater in SAC305−xBiCu joints than in SAC305Cu solder joints.Therefore,small addition of Bi refined microstructure,reduced melting temperature and improved the mechanical performance of SAC305Cu solder joints.展开更多
基金Project(51235010)supported by the National Natural Science Foundation of ChinaProject(2010CB731700)supported by the National Basic Research Program of ChinaProject(20120162110003)supported by PhD Programs Foundation of Ministry of Education of China
文摘A series of tests were carried microstructures of 2124 aluminum alloy in increase of aging time, temperature and low-to-peak-to-low manner. No significant out to investigate the effects of process parameters on mechanical properties and creep aging process. The results show that creep strain and creep rate increase with the applied stress. The hardness of specimen varies with aging time and stress in a effect of temperature on hardness of material is seen in the range of 185-195 ℃. The optimum mechanical properties are obtained at the conditions of （200 MPa, 185 ℃, 8 h） as the result of the coexistence of strengthening S＂ and S＇ phases in the matrix by transmission electron microscopy （TEM）. TEM observation shows that applied stress promotes the formation and growth of precioitates and no obvious stress orientation effect is observed in the matrix.
文摘Differential scanning calorimetric （DSC） study was carried out at different heating rates to examine the solid state reactions in a 7150 A1-Zn-Mg alloy in water-quenched （WQ） state, naturally and artificially aged tempers. The exothermic and endothermic peaks of the thermograms indicating the solid state reaction sequence were identified. The shift of peak temperatures to higher temperatures with increasing heating rates suggests that the solid state reactions are thermally activated and kinetically controlled. The artificial aging behaviour of the alloy was assessed by measuring the variations of hardness with aging time. The fraction of transformation （Y）, the rate of transformation （dY/dt）, the transformation functionflY）, and the kinetic parameters such as activation energy （Q） and frequency factor （k0） of all the solid state reactions in the alloy were determined by analyzing the DSC data, i.e. heat flow involved with the corresponding DSC peaks. It was found that the kinetic parameters of the solid state reactions are in good agreement with the published data.
文摘This research sought to improve the properties of SAC305 solder joints by the addition of 1 and 2 wt.%Bi.The effects of bismuth doping on the microstructure,thermal properties,and mechanical performance of the SAC305−xBiCu solder joints were investigated.Bi-doping modified the microstructure of the solder joints by refining the primaryβ-Sn and eutectic phases.Bi-doping below 2 wt.%dissolved in theβ-Sn matrix and formed a solid solution,whereas Bi additions equal to or greater than 2 wt.%formed Bi precipitates in theβ-Sn matrix.Solid solution strengthening and precipitation strengthening mechanisms in theβ-Sn matrix increased the ultimate tensile strength and microhardness of the alloy from 35.7 MPa and 12.6 HV to 55.3 MPa and 20.8 HV,respectively,but elongation decreased from 24.6%to 16.1%.The fracture surface of a solder joint containing 2 wt.%Bi was typical of a brittle failure rather than a ductile failure.The interfacial layer of all solder joints comprised two parallel IMC layers:a layer of Cu6Sn5 and a layer of Cu3Sn.The interfacial layer was thinner and the shear strength was greater in SAC305−xBiCu joints than in SAC305Cu solder joints.Therefore,small addition of Bi refined microstructure,reduced melting temperature and improved the mechanical performance of SAC305Cu solder joints.
