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RF MEMS开关在牺牲层工艺上的改进 被引量:1
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作者 蔡描 郭兴龙 +2 位作者 刘蕾 陈瑾瑾 赖宗声 《传感器与微系统》 CSCD 北大核心 2006年第7期40-42,共3页
通过对传统的RF MEMS开关采取在信号线上电镀桥墩、改进桥梁的形状以及在桥背面设计接触点的新颖方法,使得RF MEMS开关的下拉电压减小、开关时间缩短和可靠性提高。在工艺上,特别采用了对聚酰亚胺牺牲层进行全刻蚀和半刻蚀的改进加工... 通过对传统的RF MEMS开关采取在信号线上电镀桥墩、改进桥梁的形状以及在桥背面设计接触点的新颖方法,使得RF MEMS开关的下拉电压减小、开关时间缩短和可靠性提高。在工艺上,特别采用了对聚酰亚胺牺牲层进行全刻蚀和半刻蚀的改进加工流程来实现桥背面的接触点。测试结果表明:开关的下拉电压为28V,最低开关时间为0.8μs,开关寿命达7×10^5次,0~10GHz的插入损耗在0~0.5dB,隔离度为35~45dB。 展开更多
关键词 射频微机械开关 聚酰亚胺 刻蚀 半刻蚀
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Reactive Ion Etching of ITO Transparent Electrode of TFT-AMLCD in Ar/CF_4 Plasma
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作者 ElHassaneOULACHGAR XUZhongyang 《Semiconductor Photonics and Technology》 CAS 1998年第3期188-192,共5页
The pattern of ITO transparent electrode of pixel cells in TFT-AMLCD is a critical step in the manufacturing process of flat panel display devices,the development of suitable plasma reactive ion etching is necessary t... The pattern of ITO transparent electrode of pixel cells in TFT-AMLCD is a critical step in the manufacturing process of flat panel display devices,the development of suitable plasma reactive ion etching is necessary to achieve high resolution display.In this work we investigated the Ar/CF 4 plasma etching of ITO as function of different parameters.We demonstrated the ability of this plasma to etch ITO and achieved an etching rate of about 3.73 nm/min,which is expected to increase for long pumping down period,and also through addition of hydrogen in the plasma.Furthermore we described the ITO etching mechanism in Ar/CF 4 plasma.The investigation of selectivity showed to be very low over silicon nitride and silicon dioxide but very high over aluminum. 展开更多
关键词 Ar/CF 4 plasma ITO Reactive Ion Etching TFT-AMLCD
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