The revolution in information and communication technology has brought huge technical benefits and wealth, but has created a major global problem： the generation of vast amounts of electronic waste, or e-waste throug...The revolution in information and communication technology has brought huge technical benefits and wealth, but has created a major global problem： the generation of vast amounts of electronic waste, or e-waste through product obsolesce. The challenge in managing e-waste will be in developing sustainable recycling tech- nologies that are able to address the volume and complexity of this waste using cost effective and ecologically sen-sitive methods. In this study, the capability or microorganism metabolic acids in dissolving the metallic tractions from waste printed circuit boards was examined. Several factors were considered in the examination of the activityof the acids-including secondary reactions, solution pH, temperature and the nature of ligands in solutions （or bioacid constituents）. The leaching tests were cgnducted ex-situ, using synthetic organic acids. Leaching was performed for periods of up to 6 hat 70-90 ℃ and 1000 r-min-1.展开更多
Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision...Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.展开更多
基金Supported by Australian Research Council's Discovery Projects fundings scheme(DP1096342)
文摘The revolution in information and communication technology has brought huge technical benefits and wealth, but has created a major global problem： the generation of vast amounts of electronic waste, or e-waste through product obsolesce. The challenge in managing e-waste will be in developing sustainable recycling tech- nologies that are able to address the volume and complexity of this waste using cost effective and ecologically sen-sitive methods. In this study, the capability or microorganism metabolic acids in dissolving the metallic tractions from waste printed circuit boards was examined. Several factors were considered in the examination of the activityof the acids-including secondary reactions, solution pH, temperature and the nature of ligands in solutions （or bioacid constituents）. The leaching tests were cgnducted ex-situ, using synthetic organic acids. Leaching was performed for periods of up to 6 hat 70-90 ℃ and 1000 r-min-1.
文摘Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.
