With the increasing necessities for reliable printed circuit board(PCB) product, there has been a considerable demand for high speed and high precision vision positioning system. To locate a rectangular lead component...With the increasing necessities for reliable printed circuit board(PCB) product, there has been a considerable demand for high speed and high precision vision positioning system. To locate a rectangular lead component with high accuracy and reliability, a new visual positioning method was introduced. Considering the limitations of Ghosal sub-pixel edge detection algorithm, an improved algorithm was proposed, in which Harris corner features were used to coarsely detect the edge points and Zernike moments were adopted to accurately detect the edge points. Besides, two formulas were developed to determine the edge intersections whose sub-pixel coordinates were calculated with bilinear interpolation and conjugate gradient method. The last experimental results show that the proposed method can detect the deflection and offset, and the detection errors are less than 0.04° and 0.02 pixels.展开更多
Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision...Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.展开更多
基金Project(51175242)supported by the National Natural Science Foundation of ChinaProject(BA2012031)supported by the Jiangsu Province Science and Technology Foundation of China
文摘With the increasing necessities for reliable printed circuit board(PCB) product, there has been a considerable demand for high speed and high precision vision positioning system. To locate a rectangular lead component with high accuracy and reliability, a new visual positioning method was introduced. Considering the limitations of Ghosal sub-pixel edge detection algorithm, an improved algorithm was proposed, in which Harris corner features were used to coarsely detect the edge points and Zernike moments were adopted to accurately detect the edge points. Besides, two formulas were developed to determine the edge intersections whose sub-pixel coordinates were calculated with bilinear interpolation and conjugate gradient method. The last experimental results show that the proposed method can detect the deflection and offset, and the detection errors are less than 0.04° and 0.02 pixels.
文摘Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.
