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印刷法制备功能芯片的研究进展 被引量:1
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作者 陈思思 潘琪 +1 位作者 苏萌 宋延林 《包装工程》 CAS 北大核心 2022年第3期189-201,共13页
目的概述印刷芯片的制备方法和研究现状,开拓印刷技术的研究思路和应用场景,为印刷芯片的发展提供参考。方法从印刷材料、印刷方法和芯片应用3个方面介绍近年来印刷芯片的研究进展,重点对比各种印刷方法的关键科学问题及特点,并且指出... 目的概述印刷芯片的制备方法和研究现状,开拓印刷技术的研究思路和应用场景,为印刷芯片的发展提供参考。方法从印刷材料、印刷方法和芯片应用3个方面介绍近年来印刷芯片的研究进展,重点对比各种印刷方法的关键科学问题及特点,并且指出芯片印刷的发展方向。结果基于印刷方法在大面积制备、材料兼容性、绿色环保等方面的优势,印刷芯片在显示、能源、生物、智能包装等诸多方面快速发展,不过仍然面临高精度、规模化、功能集成方面的挑战。结论通过更好地调控印刷过程中液滴成型,构筑功能材料精细微纳结构,实现高精度器件与芯片全印刷制造。未来在实现智能、自动、互联化功能芯片制造的同时,发展绿色可持续印刷新策略。 展开更多
关键词 印刷芯片 印刷材料 印刷方法 集成应用
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Thermoelectric Behavior of Isotropically Conductive Adhesive
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作者 Vilem KobliZek 《Journal of Mechanics Engineering and Automation》 2014年第2期172-176,共5页
The paper deals with unusual use of one kind of ECA (electrically conductive adhesive)---the ICA (isotropic conductive adhesive). The main sphere of ECA application is electronic assembly, e.g., it is bonding of s... The paper deals with unusual use of one kind of ECA (electrically conductive adhesive)---the ICA (isotropic conductive adhesive). The main sphere of ECA application is electronic assembly, e.g., it is bonding of semiconductor microchips on printed circuits boards. In this sphere, the ECA compete with soft solder. In spite of this fact, the author utilized of two main ECA characteristics--good electrical conductivity and excellent adhesion to material surfaces to make the fiat thermocouples. Both the design of thermocouples and the measuring device and the measuring workplace arrangement are described. The measured data of thermoelectric voltages are plotted. The thermoelectric (Seebeck's) coefficients were calculated from obtained dependences of thermoelectric voltage versus the temperature differences. 展开更多
关键词 ECA (electrically conductive adhesive) THERMOCOUPLE thermoelectric coefficients contact voltage.
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