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复合绝缘子压接连接界面金具部件塑变规律及其结构尺寸选择 被引量:6
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作者 张福林 邸向辉 《电网技术》 EI CSCD 北大核心 2001年第4期54-56,61,共4页
根据复合绝缘子压接连接界面结构部件间的组配特点和金具部件界面受外力塑变的规律 ,对金具部件所用材料性能、金具外压部位外部结构形状、金具塑变部位结构厚度、金具部件内孔尺寸公差和内孔表面粗糙度。
关键词 复合绝缘子 压连接界面 金具部件 塑变
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复合绝缘子压接连接界面机械性能的分析及结构参数的确定 被引量:7
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作者 张福林 《电网技术》 EI CSCD 北大核心 2001年第1期47-48,53,共3页
根据复合绝缘子压接连接界面结构特点 ,分析了界面和芯棒的机械力传递机理和金具最佳形状结构 ,得出了在室温下组装的芯棒径向弹性变形量不宜过大的结论。
关键词 复合绝缘子 连接界面 机械性能 结构参数 输电线路
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复合绝缘子压接连接界面结构机械性能传递机理及其结构组装参数确定 被引量:2
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作者 张福林 《电力建设》 北大核心 2001年第10期48-50,共3页
根据复合绝缘子压接连接界面结构部件组装特点,在找出界面及芯棒机械性能传递机理和金具最佳结构形状的同时,通过分析可知,在室温下组装界面的芯棒径向弹性变形量选择不宜过大,芯棒中纤维含量波动对其变形量也有影响。
关键词 复合绝缘子 连接界面 机械性能 结构组装参数
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Diffusion bonding of Ti−6Al−4V titanium alloy powder and solid by hot isostatic pressing 被引量:2
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作者 Yi XIAO Li-hui LANG +1 位作者 Wen-cai XU De-xin ZHANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第11期3587-3595,共9页
The Ti−6Al−4V(TC4)alloy powder and forged solid were diffusion bonded by hot isostatic pressing(HIP)to fabricate a powder−solid part.The microstructure of the powder−solid part was observed by scanning electron micros... The Ti−6Al−4V(TC4)alloy powder and forged solid were diffusion bonded by hot isostatic pressing(HIP)to fabricate a powder−solid part.The microstructure of the powder−solid part was observed by scanning electron microscope(SEM).The microhardness and tensile tests were conducted to investigate the mechanical properties.The results showed that the powder compact was near-fully dense,and the powder/solid interface was tight and complete.The microhardness of the interface was higher than that of the powder compact and solid.The fractures of all powder−solid tensile specimens were on the solid side rather than at the interface,which indicated that a good interfacial strength was obtained.The tensile strength and elongation of the powder compact were higher than those of the solid.It is concluded that the HIP process can successfully fabricate high-quality Ti−6Al−4V powder−solid parts,which provides a novel near net shape technology for titanium alloys. 展开更多
关键词 Ti−6Al−4V alloy powder/solid interface hot isostatic pressing diffusion bonding microstructure mechanical properties
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