A model for the morphological evolution of a void under thermal and mechanical loads is established, and the thermodynamics potential of the model is given based on energy principle. Thus, the path and the bifurcation...A model for the morphological evolution of a void under thermal and mechanical loads is established, and the thermodynamics potential of the model is given based on energy principle. Thus, the path and the bifurcation condition of the morphological evolution of the void are described, which gives some insight into the reliability of the interconnect under combined thermal and mechanical loads.展开更多
基金the National Natural Science Foundation of China(Nos.10602034,10572088)
文摘A model for the morphological evolution of a void under thermal and mechanical loads is established, and the thermodynamics potential of the model is given based on energy principle. Thus, the path and the bifurcation condition of the morphological evolution of the void are described, which gives some insight into the reliability of the interconnect under combined thermal and mechanical loads.
