Analysis is given in the paper, on Design parameters of coal pillars left for protection at Mine area through simulation experiment of subsidence resulted from coal mining under mountain mine area, combined with some ...Analysis is given in the paper, on Design parameters of coal pillars left for protection at Mine area through simulation experiment of subsidence resulted from coal mining under mountain mine area, combined with some information from observation of movement of ground surface at the area. The author has also made his own point of view on still partially imperfect points in the current regulations in relation to the design of coal pillar under the mountain areas (Hu ,linshan).展开更多
High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-...High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.展开更多
文摘Analysis is given in the paper, on Design parameters of coal pillars left for protection at Mine area through simulation experiment of subsidence resulted from coal mining under mountain mine area, combined with some information from observation of movement of ground surface at the area. The author has also made his own point of view on still partially imperfect points in the current regulations in relation to the design of coal pillar under the mountain areas (Hu ,linshan).
基金Fok Ying Tung Education Foundation(No.91058)the Natural Science Foundation of High Education Institutions of Jiangsu Province(No.08KJD470004)Qing Lan Project of Jiangsu Province of 2008
文摘High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.
