采用红外光谱(FT-IR)和核磁共振(29S i NMR)对3,3'-二(3-三甲氧基硅丙基)双酚A环氧树脂(SEP)进行了结构表征,并对其性能和固化进行了研究。该树脂为含烷氧硅基的环氧树脂,室温下可流动,室温下黏度比E51大,在60℃以上黏度相近。采用...采用红外光谱(FT-IR)和核磁共振(29S i NMR)对3,3'-二(3-三甲氧基硅丙基)双酚A环氧树脂(SEP)进行了结构表征,并对其性能和固化进行了研究。该树脂为含烷氧硅基的环氧树脂,室温下可流动,室温下黏度比E51大,在60℃以上黏度相近。采用表干时间、DSC和FT-IR等对SEP的湿固化研究结果表明,该环氧树脂通过硅氧烷水解缩合而固化,表干时间随固化温度升高而减小。该环氧树脂可以像E-51一样用胺类固化剂进行固化,低温下凝胶时间稍长,90℃以上比较接近。展开更多
The silicon-containing poly (amic acid)s were synthesized from bis (3, 4-dicarboxyphenyl) dimethylsilane dianhydride (SIDA), pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (4,4'-ODA) in N, N-dimethylacetam...The silicon-containing poly (amic acid)s were synthesized from bis (3, 4-dicarboxyphenyl) dimethylsilane dianhydride (SIDA), pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (4,4'-ODA) in N, N-dimethylacetamide (DMAc). The poly (amic acid) films were obtained by solution-cast method from DMAc solutions and thermally converted into transparent, flexible and tough polyimide films. The wide-angle X-ray diffraction diagrams revealed that all the polyimides possessed amorphous character, and the regulation of those polyimides were decreased with the increase of the molar ratio of SIDA to PMDA. Differential scanning calorimeter measurements showed that the introduction of SIDA to polyimide backbone would make glass transition temperature shift to lower temperature. Thermogravimetric analyses indicated that the silicon-containing polyimides lowered decomposition temperature as compared with PMDA/4, 4′-ODA polyimides. However, UV-visible transmission and reflection spectra showed that the optical transparency of silicon-containing polyimide thin films was superior to that of PMDA/4, 4'-ODA polyimide thin films.展开更多
文摘采用红外光谱(FT-IR)和核磁共振(29S i NMR)对3,3'-二(3-三甲氧基硅丙基)双酚A环氧树脂(SEP)进行了结构表征,并对其性能和固化进行了研究。该树脂为含烷氧硅基的环氧树脂,室温下可流动,室温下黏度比E51大,在60℃以上黏度相近。采用表干时间、DSC和FT-IR等对SEP的湿固化研究结果表明,该环氧树脂通过硅氧烷水解缩合而固化,表干时间随固化温度升高而减小。该环氧树脂可以像E-51一样用胺类固化剂进行固化,低温下凝胶时间稍长,90℃以上比较接近。
文摘The silicon-containing poly (amic acid)s were synthesized from bis (3, 4-dicarboxyphenyl) dimethylsilane dianhydride (SIDA), pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (4,4'-ODA) in N, N-dimethylacetamide (DMAc). The poly (amic acid) films were obtained by solution-cast method from DMAc solutions and thermally converted into transparent, flexible and tough polyimide films. The wide-angle X-ray diffraction diagrams revealed that all the polyimides possessed amorphous character, and the regulation of those polyimides were decreased with the increase of the molar ratio of SIDA to PMDA. Differential scanning calorimeter measurements showed that the introduction of SIDA to polyimide backbone would make glass transition temperature shift to lower temperature. Thermogravimetric analyses indicated that the silicon-containing polyimides lowered decomposition temperature as compared with PMDA/4, 4′-ODA polyimides. However, UV-visible transmission and reflection spectra showed that the optical transparency of silicon-containing polyimide thin films was superior to that of PMDA/4, 4'-ODA polyimide thin films.
