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聚合物电光调制器包覆层材料研究 被引量:1
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作者 余志滨 于海峰 +1 位作者 连彦青 王晓工 《高分子学报》 SCIE CAS CSCD 北大核心 2003年第6期891-894,共4页
An epoxy-based precursor polymer was prepared from the diglycidyl ether of Bisphenol A and aniline.The precursor polymer was doped with a certain amount of cross-linking agent M20S to obtain a thermal-curable polymeri... An epoxy-based precursor polymer was prepared from the diglycidyl ether of Bisphenol A and aniline.The precursor polymer was doped with a certain amount of cross-linking agent M20S to obtain a thermal-curable polymeric system BPAN+M20S.The thermal curing behavior of BPAN+M20S was studied by means of in-situ infrared spectroscopy and it was found that BPAN+M20S showed significant thermal-curability and had the similar curing dynamics at both 120℃ and 180℃.The curing degree can reach 70 7% at 120℃ and 81 8% at 180℃ within 20 min,respectively.When a two-layer film was prepared with the cured polymer BPAN+M20S as the bottom cladding and an E.O.polymer BPAN-1A-NT as the upper layer,SEM studies showed a perfect interface between the bottom and the upper layers of the two-layer film and the surface of the upper layer was quite smooth.A polymeric planar prototype waveguide,which was fabricated based on the above two-layer film and covered by another layer of UV photoresist,showed good wave-guide performance. 展开更多
关键词 电光调制器 聚合物材料 包覆层材料 双酚a环氧单体 苯胺 聚合 光电子信息技术
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