The growth of intermetallic compounds at the interface between solid Al and Fe and the effects of intermetallic compound layers on the interfacial bonding of clad materials were investigated. The results showed that t...The growth of intermetallic compounds at the interface between solid Al and Fe and the effects of intermetallic compound layers on the interfacial bonding of clad materials were investigated. The results showed that the interface between the solid Fe and Al formed by heat-treatment consisted of Fe2Al5 and FeAl3 intermetallic compound layers, which deteriorated the interfacial bonding strength. Fractures occurred in the intermetallic compound layer during the shear testing. The location of the fracture depended on the defects of microcracks or voids in the intermetallic compound layers. The microcracks in the intermetallic compound layer were caused by the mismatch of thermal expansion coefficients of materials during cooling, and the voids were consistent with the Kirkendall effect. The work will lay an important foundation for welding and joining of aluminum and steel, especially for fabrication of Al-Fe clad materials.展开更多
Cu-4.7%Sn （mass fraction） alloy plate was prepared by the self-developed two-phase zone continuous casting （TZCC） process. The relationship between process parameters of TZCC and surface quality of the alloy plate...Cu-4.7%Sn （mass fraction） alloy plate was prepared by the self-developed two-phase zone continuous casting （TZCC） process. The relationship between process parameters of TZCC and surface quality of the alloy plate was investigated. The microstructure and mechanical properties of the TZCC alloy plate were analyzed. The results show that Cu-4.7%Sn alloy plate with smooth surface can be obtained by means of reasonable matching the entrance temperature of two-phase zone mold and the continuous casting speed. The microstructure of the TZCC alloy is composed of grains-covered grains, small grains with self-closed grain boundaries, columnar grains and equiaxed grains. Compared with cold mold continuous casting Cu-4.7%Sn alloy plate, the room temperature tensile strength and ductility of the TZCC alloy plate are greatly improved.展开更多
基金Project(2011DFR50630)sponsored by the International S&T Cooperation of China
文摘The growth of intermetallic compounds at the interface between solid Al and Fe and the effects of intermetallic compound layers on the interfacial bonding of clad materials were investigated. The results showed that the interface between the solid Fe and Al formed by heat-treatment consisted of Fe2Al5 and FeAl3 intermetallic compound layers, which deteriorated the interfacial bonding strength. Fractures occurred in the intermetallic compound layer during the shear testing. The location of the fracture depended on the defects of microcracks or voids in the intermetallic compound layers. The microcracks in the intermetallic compound layer were caused by the mismatch of thermal expansion coefficients of materials during cooling, and the voids were consistent with the Kirkendall effect. The work will lay an important foundation for welding and joining of aluminum and steel, especially for fabrication of Al-Fe clad materials.
基金Project(51374025) supported by the National Natural Science Foundation of ChinaProject(2014Z-05) supported by the State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,ChinaProject(2152020) supported by the Beijing Natural Science Foundation,China
文摘Cu-4.7%Sn （mass fraction） alloy plate was prepared by the self-developed two-phase zone continuous casting （TZCC） process. The relationship between process parameters of TZCC and surface quality of the alloy plate was investigated. The microstructure and mechanical properties of the TZCC alloy plate were analyzed. The results show that Cu-4.7%Sn alloy plate with smooth surface can be obtained by means of reasonable matching the entrance temperature of two-phase zone mold and the continuous casting speed. The microstructure of the TZCC alloy is composed of grains-covered grains, small grains with self-closed grain boundaries, columnar grains and equiaxed grains. Compared with cold mold continuous casting Cu-4.7%Sn alloy plate, the room temperature tensile strength and ductility of the TZCC alloy plate are greatly improved.
