A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu ...A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters （bonding temperature and preheating time） were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni？P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.展开更多
Based on twin-roll casting, a cast-rolling force model was proposed to predict the rolling force in the bimetal solid-liquid cast-rolling bonding(SLCRB) process. The solid-liquid bonding zone was assumed to be below t...Based on twin-roll casting, a cast-rolling force model was proposed to predict the rolling force in the bimetal solid-liquid cast-rolling bonding(SLCRB) process. The solid-liquid bonding zone was assumed to be below the kiss point(KP). The deformation resistance of the liquid zone was ignored. Then, the calculation model was derived. A 2D thermal-flow coupled simulation was established to provide a basis for the parameters in the model, and then the rolling forces of the Cu/Al clad strip at different rolling speeds were calculated. Meanwhile, through measurement experiments, the accuracy of the model was verified. The influence of the rolling speed, the substrate strip thickness, and the material on the rolling force was obtained. The results indicate that the rolling force decreases with the increase of the rolling speed and increases with the increase of the thickness and thermal conductivity of the substrate strip. The rolling force is closely related to the KP height. Therefore, the formulation of reasonable process parameters to control the KP height is of great significance to the stability of cast-rolling forming.展开更多
To achieve Ti/Mg bimetallic composite with high strength and metallurgical bonding interface,Al interlayer and Zn/Al composite interlayer were used to prepare TC4/AZ91D bimetal composite with metallurgical bonding int...To achieve Ti/Mg bimetallic composite with high strength and metallurgical bonding interface,Al interlayer and Zn/Al composite interlayer were used to prepare TC4/AZ91D bimetal composite with metallurgical bonding interface by solid-liquid compound casting,respectively.Al interlayer was prepared on the surface of TC4 alloy by hot dipping,and Zn/Al composite interlayer was prepared by electroplating process.The results suggested that the phases across the interface were Al Ti andα(Al)+Mg_(21)(Al,Zn)_(17)when Zn/Al composite interlayer was used.When Al interlayer was used as interlayer,Al Mg Ti ternary structure and Al_(12)Mg_(17)+δ-Mg eutectic structure were the main phases at the interface.The shear strength of TC4/AZ91D bimetal with Zn/Al composite interlayer was much higher than that with pure Al interlayer,and the value of the shear strength was increased from 48.5 to 67.4 MPa.Thermodynamic models based on different compositions of the interface were established to explain the microstructure evolution of the interfacial zone.展开更多
基金Project(51571080)supported by the National Natural Science Foundation of China
文摘A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters （bonding temperature and preheating time） were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni？P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.
基金The authors are grateful for the financial supports from the National Natural Science Foundation of China(51974278)the Distinguished Young Fund of Natural Science Foundation of Hebei Province,China(E2018203446).
文摘Based on twin-roll casting, a cast-rolling force model was proposed to predict the rolling force in the bimetal solid-liquid cast-rolling bonding(SLCRB) process. The solid-liquid bonding zone was assumed to be below the kiss point(KP). The deformation resistance of the liquid zone was ignored. Then, the calculation model was derived. A 2D thermal-flow coupled simulation was established to provide a basis for the parameters in the model, and then the rolling forces of the Cu/Al clad strip at different rolling speeds were calculated. Meanwhile, through measurement experiments, the accuracy of the model was verified. The influence of the rolling speed, the substrate strip thickness, and the material on the rolling force was obtained. The results indicate that the rolling force decreases with the increase of the rolling speed and increases with the increase of the thickness and thermal conductivity of the substrate strip. The rolling force is closely related to the KP height. Therefore, the formulation of reasonable process parameters to control the KP height is of great significance to the stability of cast-rolling forming.
基金the financial support from the National Natural Science Foundation of China(No.51875062)。
文摘To achieve Ti/Mg bimetallic composite with high strength and metallurgical bonding interface,Al interlayer and Zn/Al composite interlayer were used to prepare TC4/AZ91D bimetal composite with metallurgical bonding interface by solid-liquid compound casting,respectively.Al interlayer was prepared on the surface of TC4 alloy by hot dipping,and Zn/Al composite interlayer was prepared by electroplating process.The results suggested that the phases across the interface were Al Ti andα(Al)+Mg_(21)(Al,Zn)_(17)when Zn/Al composite interlayer was used.When Al interlayer was used as interlayer,Al Mg Ti ternary structure and Al_(12)Mg_(17)+δ-Mg eutectic structure were the main phases at the interface.The shear strength of TC4/AZ91D bimetal with Zn/Al composite interlayer was much higher than that with pure Al interlayer,and the value of the shear strength was increased from 48.5 to 67.4 MPa.Thermodynamic models based on different compositions of the interface were established to explain the microstructure evolution of the interfacial zone.
