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高层厚孔铜产品制作流程优化探讨
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作者 丁万峰 《印制电路信息》 2012年第5期54-56,61,共4页
探究一种针对孔铜为70μm产品的制作方法,以优化流程,实现孔铜控制在70μm以上,蚀刻底铜控制在75μm以下,以减低相对孤立、细小线路的制作对蚀刻带来的难度。主要针对以下几类实现方式:镀孔+正片,假负片,负片+图镀,负片过程进行总结评估... 探究一种针对孔铜为70μm产品的制作方法,以优化流程,实现孔铜控制在70μm以上,蚀刻底铜控制在75μm以下,以减低相对孤立、细小线路的制作对蚀刻带来的难度。主要针对以下几类实现方式:镀孔+正片,假负片,负片+图镀,负片过程进行总结评估,最终确定负片+图镀为适合我司的最佳流程,同时,产品各指标性能符合客户要求。 展开更多
关键词 厚孔铜 蚀刻底铜 负片 图镀
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Latent fingerprint enhancement on conductive substrates using electrodeposition of copper 被引量:5
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作者 Meiqin Zhang Xi Yu +5 位作者 Gang Qin Yu Zhu Meiling Wang Qianhui Wei Yang Zhang Xueji Zhang 《Science China Chemistry》 SCIE EI CAS CSCD 2015年第7期1200-1205,共6页
We presented a novel method for the development of a latent fingerprint by selective electrodeposition of a copper thin film from sulfate solution onto the conductive substrate between fingerprint ridges to generate a... We presented a novel method for the development of a latent fingerprint by selective electrodeposition of a copper thin film from sulfate solution onto the conductive substrate between fingerprint ridges to generate a negative image of the fingerprint deposit. After optimizing the parameters(deposition time, deposition potential, and copper concentration), the preferential electrodeposition of copper films allowed latent fingerprints on six kinds of conductive surfaces(indium/tin oxide-coated glass, silver sheet, platinum sheet, gold sheet, copper sheet, and a stainless steel coin) to be successfully developed with high resolution. In addition, this technique could also be exploited to visualize latent fingerprints on rough and dirty surfaces. The quality of the developed fingerprints was estimated visually and the morphology of the copper film was characterized by field emission scanning electron microscopy. 展开更多
关键词 latent fingerprint visualization ELECTRODEPOSITION copper thin film forensic science ELECTROCHEMISTRY
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