To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were iden...To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.展开更多
In rapid thermal processing of a semiconductor wafer, it is important to keep a given temperature rising speed of the wafer during the temperature rising process. We made an experimental apparatus to measure the tempe...In rapid thermal processing of a semiconductor wafer, it is important to keep a given temperature rising speed of the wafer during the temperature rising process. We made an experimental apparatus to measure the temperature rising speed of a ceramic ball of 2 mm in diameter heated with four halogen lamp heaters. The heating rate of the halogen lamp heaters was controlled by computer to keep a given temperature rising speed of 50 ℃/s with a controlling time interval of 0.1 s. We examined the effect of various heating control methods on the error of the temperature rising speed of the ceramic ball. We found that a combined method of control with prepared correlation and PID （proportional integral derivative） control is a good method to decrease the error of the temperature rising speed. The average error of the temperature rising speed is 0.5 ℃/s, and the repetition error is almost zero for the temperature rising speed of 50 ℃/s from 330 ℃ to 370 ℃. We also measured the effects of artificial control delay time and measuring error of the monitoring temperature on the error of the temperature rising speed.展开更多
基金Projects(51475072,51171036)supported by the National Natural Science Foundation of China
文摘To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.
文摘In rapid thermal processing of a semiconductor wafer, it is important to keep a given temperature rising speed of the wafer during the temperature rising process. We made an experimental apparatus to measure the temperature rising speed of a ceramic ball of 2 mm in diameter heated with four halogen lamp heaters. The heating rate of the halogen lamp heaters was controlled by computer to keep a given temperature rising speed of 50 ℃/s with a controlling time interval of 0.1 s. We examined the effect of various heating control methods on the error of the temperature rising speed of the ceramic ball. We found that a combined method of control with prepared correlation and PID （proportional integral derivative） control is a good method to decrease the error of the temperature rising speed. The average error of the temperature rising speed is 0.5 ℃/s, and the repetition error is almost zero for the temperature rising speed of 50 ℃/s from 330 ℃ to 370 ℃. We also measured the effects of artificial control delay time and measuring error of the monitoring temperature on the error of the temperature rising speed.
