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反向凝固1Cr18Ni9/15F复合铸带微观组织特征和界面剪切强度 被引量:3
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作者 张建 王新华 +2 位作者 王万军 张立君 许中波 《北京科技大学学报》 EI CAS CSCD 北大核心 2000年第2期113-116,共4页
采用反向凝固法在实验室条件下研究奥氏体不锈钢复合带制取的工艺过程,通过对 复合铸带试样的金相和扫描电镜研究,发现了复合铸带由具有不同微观组织特征的3个区域 组成,即碳素钢母带区、不锈钢新相层和界面过渡区.复合铸带界面剪... 采用反向凝固法在实验室条件下研究奥氏体不锈钢复合带制取的工艺过程,通过对 复合铸带试样的金相和扫描电镜研究,发现了复合铸带由具有不同微观组织特征的3个区域 组成,即碳素钢母带区、不锈钢新相层和界面过渡区.复合铸带界面剪切强度试验的结果表明, 反向凝固奥氏体不锈钢复合铸带的界面结合性能完全达到国标的要求. 展开更多
关键词 复合铸带 微观组织 界面剪切强度 奥氏体不锈钢
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Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip 被引量:11
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作者 Hua-gui HUANG Yi-kang DONG +1 位作者 Meng YAN Feng-shan DU 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2017年第5期1019-1025,共7页
Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,an... Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly. 展开更多
关键词 Cu/Al clad strip solid.liquid cast-rolling bonding bonding interface reaction diffusion peeling test
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Bonding strength of Invar/Cu clad strips fabricated by twin-roll casting process 被引量:3
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作者 Peng CHEN Hua-gui HUANG +2 位作者 Ce JI Xu ZHANG Zhong-hua SUN 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2018年第12期2460-2469,共10页
Based on traditional twin-roll casting process,Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature,high pressure and plastic deformatio... Based on traditional twin-roll casting process,Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature,high pressure and plastic deformation.A series of tests including tensile test,bending test,T-type peeling test and scanning electron microscope(SEM)and energy dispersive spectrometer(EDS)measurements were carried out to analyze the mechanical properties of Invar/Cu clad strips and the micro-morphology of tensile fracture surfaces and bonding interfaces.The results indicate that no delamination phenomenon occurs during the compatible deformation of Invar/Cu in bending test and only one stress platform exists in the tensile stress-strain curve when the bonding strength is large.On the contrary,different mechanical properties of Invar and Cu lead to delamination phenomenon during the uniaxial tensile test,which determines that two stress platforms occur on the stress-strain curve of Invar/Cu clad strips when two elements experience necking.The average peeling strength can be increased from13.85to42.31N/mm after heat treatment at800℃for1h,and the observation of the Cu side at peeling interface shows that more Fe is adhered on the Cu side after the heat treatment.All above illustrate that heat treatment can improve the strength of the bonding interface of Invar/Cu clad strips. 展开更多
关键词 twin-roll casting Invar/Cu clad strip heat treatment bonding interface bonding strength
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