电沉积参数对含憎水剂微胶囊复合镀铜层的影响研究

采用水相分离法制备出了粒径在2～10μm之间的液体憎水剂微胶囊，研究了含憎水剂微胶囊复合镀铜层的制备工艺，讨论了试样放置方式、电流密度、阴阳极距离、镀液中微胶囊溶液含量、电镀时间等电沉积参数对复合镀铜层中微胶囊含量的影响。研究表明，当试样水平放置时，复合镀铜层中微胶囊的含量明显增加；镀铜层中微胶囊含量随阴极电流密度、阴阳极距离、镀液中微胶囊溶液含量的增加呈现出先增加后减小的趋势；并且随着电沉积时间的增加，复合镀铜层中憎水剂微胶囊的数量增加。

含润滑油微胶囊复合镀铜机理和镀层性能

采用水相分离法制备了以润滑油为囊心、聚乙烯醇为囊壁的微胶囊,并考察了含这种微胶囊复合镀铜层的性能.通过对这种复合镀层微观形貌的观察及耐腐蚀性、耐磨性、动摩擦系数的测定,结果表明由于复合镀铜层中含有润滑油微胶囊,其耐腐蚀性和耐磨性能都得到很大提高,并分析了这种微胶囊复合电沉积的机理和镀层的润滑、修复作用.

含液体微胶囊复合镀镍、铜层的耐腐蚀性能研究

采用水相分离法中的单凝聚法制备了以明胶、聚乙烯醇为囊壁材料,润滑油、缓蚀剂、憎水剂等为囊心材料的液体微胶囊,并与镀铜、镀镍液中的金属离子复合电沉积得到含有高耐腐蚀性能的复合镀层。通过比较,含有防锈润滑油微胶囊的复合镀镍层在5%NaCl溶液中出现腐蚀锈点的时间是普通镀镍层的40倍以上;含苯并三氮唑缓蚀剂的微胶囊复合镀铜层耐氨水点滴及硝酸点滴腐蚀时间是普通镀铜层的3倍左右;含憎水剂微胶囊的复合镀铜层在硫酸溶液中的电极电位随时间变化规律和阳极极化曲线表明,其比普通镀铜层具有更好的耐腐蚀性。

含有液体微胶囊的复合电沉积铜镀层性能的研究

研究了含有有机硅树脂为囊心的液体微胶囊复合镀铜层的性能。通过进行25%氨水溶液腐蚀试验、10%硝酸溶液腐蚀试验和耐磨试验,测定了这种复合镀层的耐蚀性和耐磨性。结果表明,由于复合镀铜层中含有液体微胶囊,其耐腐蚀性和耐磨性能都得到很大提高。

液体微胶囊复合电沉积铜的研究

讨论了用水相分离法制备含有液体微胶囊的技术,并将以有机硅树脂为囊心的液体微胶囊加入到酸性镀铜液中进行复合共沉积,得到了含有液体微胶囊的复合镀铜层。通过对这种镀层的表面、断面形貌和表面成分分析,这种含有液体微胶囊的复合镀铜层得到了证实和确认。

Microstructures and mechanical properties of electroplated Cu-Bi coatings

Electroplating has been used to produce Cu-Bi coatings. The crystal structure and lattice parameters of Cu in Cu-Bi composite coating were measured and compared with Cu coating. The mechanical properties of the coatings were also studied. It was found that the deposition parameters have significant effect on the mechanical properties of the Cu-Bi coatings. The microhardness has been improved from HVso165 of Cu coating to HVs0 250 of Cu-Bi composite coating prepared at 50 mA/cm2 for 20 min. Correspondingly, wear resistance of the Cu-Bi composite coating has also been enhanced significantly.

Microstructure and deposition mechanism of electrodeposited Cu/liquid microcapsule composite

The nanostructured copper/microcapsule containing liquid core materials composite（copper/liquid microcapsules composite） was prepared using direct current（DC） electrodeposition method.The surface morphology and microstructure of composite were investigated by means of scanning electron microscopy（SEM）,transmission electron microscopy（TEM） and X-ray diffraction（XRD）.The results show that the microstructure of electrodeposited layer transformed from bulk crystal to nano structure because of the participation of microcapsules.The diameters of microcapsules and the copper grain sizes in the composite were 2？20 μm and 10？20 nm,respectively.In addition,the electrodeposition mechanism of composite in the deposition process followed electrochemistry theory,which was proved by the theoretical analysis result and the experiment results.Meanwhile,the co-deposition process model was presented.

Preparation and thermal conductivity of tungsten coated diamond/copper composites

Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).

Corrosion protection of composite coating combining ceramic layer,copper layer and benzotriazole layer on magnesium alloy

A novel composite coating was fabricated on AZ91 magnesium alloy by applying a composite surface treatment which combined the methods of plasma electrolytic oxidation(PEO)pre-treatment,electroless copper and benzotriazole(BTA)passivation. The cross-section microstructures and chemical compositions of coating were examined using scanning electron microscopy(SEM) equipped with energy dispersive analysis of X-rays(EDX).Potentiodynamic polarization curves and salt spray tests were employed to evaluate corrosion protection of the coating to substrate in 5%NaCl solution.It is indicated that electroless copper produces a rough interface between the electroless copper layer and the ceramic layer.The corrosion potential shifts to the positive direction significantly and the current density decreases by more than one order of magnitude.There is no visible galvanic corrosion pits on the surface of the composite coating combination of PEO and electroless copper after 168 h neutral salt spray testing.The color of copper after BTA immersion could be held more than 60 d.