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N多晶电阻的温度漂移影响因子及工艺研究
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作者 陈培仓 周凌霄 +2 位作者 洪成强 王涛 吴建伟 《电子与封装》 2024年第5期85-88,共4页
多晶电阻在集成电路中应用广泛,可用作电路负载、阻尼、分压或分流,但是在实际使用过程中,多晶掺杂电阻的阻值由载流子浓度和迁移率决定,而2者都会受到温度的影响,因此多晶电阻的阻值随温度的变化而变化,且存在一定的温度系数。对N多晶... 多晶电阻在集成电路中应用广泛,可用作电路负载、阻尼、分压或分流,但是在实际使用过程中,多晶掺杂电阻的阻值由载流子浓度和迁移率决定,而2者都会受到温度的影响,因此多晶电阻的阻值随温度的变化而变化,且存在一定的温度系数。对N多晶电阻的温度漂移影响因子展开研究并进行分组实验验证,制备出了温度系数在±10×10^(-6)/℃以内的低温度漂移、高精度半导体N多晶电阻,保证了不同温度环境下电路的工作稳定性,为高稳定电路设计提供了参考依据。 展开更多
关键词 多晶电阻 掺杂 温度漂移
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多晶电阻工艺监控与影响因素研究
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作者 张世权 马慧红 吴晓鸫 《电子与封装》 2015年第5期33-35,40,共4页
首先介绍了多晶电阻在线监控和工艺控制模块(PCM)监控的两种方法:四探针法和范德堡法,并解决了四探针法在线监控方法多晶电阻波动大的问题;针对生产过程中遇到的多晶电阻偏小问题,通过扫描电镜分析发现多晶晶粒明显偏大,通过对多晶淀积... 首先介绍了多晶电阻在线监控和工艺控制模块(PCM)监控的两种方法:四探针法和范德堡法,并解决了四探针法在线监控方法多晶电阻波动大的问题;针对生产过程中遇到的多晶电阻偏小问题,通过扫描电镜分析发现多晶晶粒明显偏大,通过对多晶淀积速率的分析确定多晶速率越小,多晶淀积晶粒越大,根据多晶导电理论可知多晶晶粒大,晶粒间界变小,晶粒间界杂质俘获变少,多晶掺杂浓度转化为载流子的比例变高,因此多晶电阻变小。最后根据工程实践列举了影响多晶淀积速率的两大主要因素为多晶淀积温度和多晶炉管维护次数,为保证多晶淀积速率稳定,多晶炉管维护次数尽量少于6次,同时需要对多晶淀积温度进行控制。 展开更多
关键词 多晶电阻 淀积速率 四探针法测试电阻
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提高多晶电阻工艺稳定性 被引量:1
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作者 吴建伟 江月艳 +1 位作者 贺琪 王传博 《电子与封装》 2009年第8期38-42,共5页
文章通过对多晶薄膜的性质和多晶电阻形成工艺的稳定性研究,剖析在生产过程中三种形成多晶电阻主要工艺的波动情况,并对形成工艺波动的原因和控制方法进行了讨论。同时对于采取控制方法以后的多晶电阻的工艺情况进行分析,证明提高多晶... 文章通过对多晶薄膜的性质和多晶电阻形成工艺的稳定性研究,剖析在生产过程中三种形成多晶电阻主要工艺的波动情况,并对形成工艺波动的原因和控制方法进行了讨论。同时对于采取控制方法以后的多晶电阻的工艺情况进行分析,证明提高多晶电阻制造工艺稳定性必须提高多晶淀积和离子注入工艺能力,以及如何提高多晶淀积和离子注入的受控。最后对采取控制措施后的多晶电阻的改善效果进行回顾,说明离子注入工艺采取除气和多晶淀积隔片放置方式有效地提高了多晶电阻工艺的稳定性。 展开更多
关键词 多晶电阻 离子注入 多晶淀积 方块电阻和均匀性
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Zn_(0.5)Fe_(2.5)O_4-(α-Fe_2O_3)多晶隧道结磁致电阻材料合成与制备
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作者 包丽梅 曾燕伟 《南京工业大学学报(自然科学版)》 CAS 2005年第6期68-72,共5页
以PVA为分散介质,通过低温固相反应合成了组成结构均匀的单相超微Zn0.5Fe2.5O4颗粒,然后经成型、高温气氛控制反应烧结成功制备得到具有Zn0.5Fe2.5O4-(α-Fe2O3)双相微结构的多晶隧道结磁致电阻材料。利用DAT/TG、IR、XRD、SEM和VSM-4... 以PVA为分散介质,通过低温固相反应合成了组成结构均匀的单相超微Zn0.5Fe2.5O4颗粒,然后经成型、高温气氛控制反应烧结成功制备得到具有Zn0.5Fe2.5O4-(α-Fe2O3)双相微结构的多晶隧道结磁致电阻材料。利用DAT/TG、IR、XRD、SEM和VSM-4探针磁电阻测定等技术,就超微Zn0.5Fe2.5O4颗粒的合成和Zn0.5Fe2.5O4-(α-Fe2O3)多晶隧道结磁致电阻材料的微结构特征及其磁致电阻效应进行了初步测定和分析讨论。研究发现,不同溶液动力学条件下合成粉体的粒径明显不同,且在烧结过程中一定氧分压的存在有利于绝缘层的形成。 展开更多
关键词 隧道结磁电阻 Zn0.5Fe2.5O4 多晶电阻材料
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自举二极管的集成开发
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作者 俞韬 陈勇臻 陈烨 《中国科技期刊数据库 工业A》 2024年第10期0079-0083,共5页
IPM 即智能功率模块,其内部以IGBT或MOS作为功率开关,集成高压栅驱动电路,相比于分离方案,IPM既可以极大地缩小PCB尺寸,同时又能良好地保证系统的可靠性和稳定性,目前已经成为白色家电变频控制的理想功能单元。目前IPM的供应基本被国外... IPM 即智能功率模块,其内部以IGBT或MOS作为功率开关,集成高压栅驱动电路,相比于分离方案,IPM既可以极大地缩小PCB尺寸,同时又能良好地保证系统的可靠性和稳定性,目前已经成为白色家电变频控制的理想功能单元。目前IPM的供应基本被国外厂商垄断,即使像国内头部家电企业自建IPM生产线,实际也是采用进口的器件和相对落后的封装技术实现。 展开更多
关键词 自举线路 快恢复二极管 多晶电阻
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Resistivity Instability in Polysilicon Resistors Under Metal Interco-nnects and Its Suppression by Compensating Ion Implantation
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作者 余宁梅 高勇 陈治明 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2001年第4期511-515,共5页
The resistivity instability of the boron-doped polysilicon resistors being a line resistance element of ICs is within the range of several kΩ's,especially when our running the underneath metal interconnects.Polys... The resistivity instability of the boron-doped polysilicon resistors being a line resistance element of ICs is within the range of several kΩ's,especially when our running the underneath metal interconnects.Polysilicon resistors have been fabricated under various processing conditions as well as some electrical and crystallographic characteristics have been obtained.It is shown the resistivity instability mainly results from the variational carrier mobility.By analyzing the Seto's model,the barrier height and trapped charge density are observed reducing under the Al over layer.Therefore,the resistance instability is also caused by both the charge trapping/detrapping occurring at polysilicon grain boundaries and the resultant variation in the potential barrier height.The formation of high-stability polysilicon resistors in the range of several kΩ's has been decided by compensating the ion implantation,which makes the charge trapping/detrapping at the grain boundary less susceptible to the hydrogen annealing. 展开更多
关键词 POLYSILICON INTERCONNECT
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Fabrication of n^+ Polysilicon Ohmic Contacts with a Heterojunction Structure to n-Type 4H-Silicon Carbide
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作者 郭辉 冯倩 +2 位作者 汤晓燕 张义门 张玉明 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第4期637-640,共4页
Polysilicon ohmic contacts to n-type 4H-SiC have been fabricated. TLM (transfer length method) test patterns with polysilicon structure are formed on n-wells created by phosphorus ion (P^+) implantation into a Si... Polysilicon ohmic contacts to n-type 4H-SiC have been fabricated. TLM (transfer length method) test patterns with polysilicon structure are formed on n-wells created by phosphorus ion (P^+) implantation into a Si-faced p-type 4H-SiC epilayer. The polysilicon is deposited using low-pressure chemical vapor deposition (LPCVD) and doped by phosphorous ions implantation followed by diffusion to obtain a sheet resistance of 22Ω/□. The specific contact resistance pc of n^+ polysilicon contact to n-type 4H-SiC as low as 3.82 × 10^-5Ω· cm^2 is achieved. The result for sheet resistance Rsh of the phosphorous ion implanted layers in SiC is about 4.9kΩ/□. The mechanisms for n^+ polysilicon ohmic contact to n-type SiC are discussed. 展开更多
关键词 ohmic contact silicon carbide POLYSILICON specific contact resistance P^+ ion implantation
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Electrodeposition and Surface Characterization of Sulfur on Polycrystalline Platinum from Sulfide Polluted Brine 被引量:1
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作者 Faiza Mohamed AI Kharafi Aiman Yehia Saad Badr Ghazy Ateya Ibrahim Mohamed Ghayad 《Journal of Chemistry and Chemical Engineering》 2010年第2期15-21,共7页
This paper investigated the electrodeposition of sulfur on polycrystalline platinum from sulfide polluted brine. Anodic polarization, potentiostatic and electrochemical impedance spectroscopy (EIS) techniques were p... This paper investigated the electrodeposition of sulfur on polycrystalline platinum from sulfide polluted brine. Anodic polarization, potentiostatic and electrochemical impedance spectroscopy (EIS) techniques were performed. The slope of Warburg straight line in Nyquiest plot of the EIS spectra performed at 0.0 V indicates diffusion control mechanism of the electrodeposition process. At 0.5 V the Rp (determined from EIS measurements) increased rapidly with time indicating more sulfur deposition and more passivation of platinum surface. Samples subjected to potentiostatic experiments at 0.4, 0.9 and 1.0 V were investigated under Scanning Electron Microscope (SEM). SEM images reveal the deposition of sulfur on the sample surfaces. The degree of sulfur deposit coverage and its morphology depend on both the potential and time of deposition. 展开更多
关键词 ELECTRODEPOSITION SULFUR PLATINUM sulfide pollution.
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Spin injection and transport in single-crystalline organic spin valves based on TIPS-pentacene
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作者 Ying Wang Jiarong Yao +10 位作者 Shuaishuai Ding Siyu Guo Dapeng Cui Xinyue Wang Shuyuan Yang Lijuan Zhang Xinzi Tian Di Wu Chao Jin Rongjin Li Wenping Hu 《Science China Materials》 SCIE EI CAS CSCD 2021年第11期2795-2804,共10页
Single crystals of organic semiconductors with perfect crystal structure and minimal density of defects can exhibit high mobility and low spin scattering compared with their amorphous or polycrystalline counterparts.T... Single crystals of organic semiconductors with perfect crystal structure and minimal density of defects can exhibit high mobility and low spin scattering compared with their amorphous or polycrystalline counterparts.Therefore,these materials are promising candidates as the spin transport media to obtain long spin relaxation times and spin diffusion lengths in spintronic devices.However,the investigation of spin injection and transport properties in organic single crystals is hindered by the inability to construct devices such as single-crystalline organic spin valves(OSVs).Herein,thin and large organic single crystals of 6,13-bis(triisopropylsilylethynyl)pentacene(TIPS-pentacene)were grown on a liquid substrate and transferred to a target substrate carrying ferromagnetic electrodes to construct single-crystalline OSVs.The magnetoresistance(MR)responses of the single crystals were investigated to study their spin injection and transport properties.MR value as high as 17%was probed with an intermediate layer thickness of 269 nm.More importantly,spin transport was still observed in a single crystal of a thickness up to 457 nm,which was much larger than that of polycrystalline thin film.Our research provides a general methodology for constructing single-crystalline OSVs and paves the way to probe the intrinsic spin transport properties of organic semiconductors based on single crystals. 展开更多
关键词 organic single crystal organic semiconductor MAGNETORESISTANCE organic spin valve SPINTRONICS
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