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VLSI互连寄生电容准三维多极加速提取 被引量:2
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作者 杨钊志 王泽毅 方蜀州 《电子学报》 EI CAS CSCD 北大核心 2000年第11期129-131,共3页
随着VLSI向深亚微米发展 ,需要快速而精确地计算互连寄生电容以保证高性能电路设计的正确性 .本文介绍一个单介质准三维电容提取软件 .在位势理论建立的间接边界积分方程中 ,它在导体表面采用线电荷近似面电荷的思想简化 3 D结构 ,并采... 随着VLSI向深亚微米发展 ,需要快速而精确地计算互连寄生电容以保证高性能电路设计的正确性 .本文介绍一个单介质准三维电容提取软件 .在位势理论建立的间接边界积分方程中 ,它在导体表面采用线电荷近似面电荷的思想简化 3 D结构 ,并采用多极加速法进一步降低计算复杂度 .由于既保留了三维形体的空间架构 ,又使大量电荷积分降为一维 ,取得了精度与速度的良好平衡 .数值计算结果表明 ,其计算复杂性为O(n) 。 展开更多
关键词 寄生电容 多极加速法 VLSI 集成电路
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Fast multipole accelerated boundary element method for the Helmholtz equation in acoustic scattering problems 被引量:2
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作者 LI ShanDe GAO GuiBing +2 位作者 HUANG QiBai LIU WeiQi CHEN Jun 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS 2011年第8期1405-1410,共6页
We apply the fast multipole method (FMM) accelerated boundary element method (BEM) for the three-dimensional (3D) Helmholtz equation, and as a result, large-scale acoustic scattering problems involving 400000 elements... We apply the fast multipole method (FMM) accelerated boundary element method (BEM) for the three-dimensional (3D) Helmholtz equation, and as a result, large-scale acoustic scattering problems involving 400000 elements are solved efficiently. This is an extension of the fast multipole BEM for two-dimensional (2D) acoustic problems developed by authors recently. Some new improvements are obtained. In this new technique, the improved Burton-Miller formulation is employed to over-come non-uniqueness difficulties in the conventional BEM for exterior acoustic problems. The computational efficiency is further improved by adopting the FMM and the block diagonal preconditioner used in the generalized minimum residual method (GMRES) iterative solver to solve the system matrix equation. Numerical results clearly demonstrate the complete reliability and efficiency of the proposed algorithm. It is potentially useful for solving large-scale engineering acoustic scattering problems. 展开更多
关键词 fast multipole method boundary element method Helmholtz equation acoustic scattering problems.
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