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Formation mechanism of nanopores in dense films of anodic alumina
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作者 Peng-ze LI Yu ZHANG +5 位作者 Jia-zheng ZHANG Lin LIU Shi-yi WANG Rui LIU Ye SONG Xu-fei ZHU 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2024年第9期2918-2927,共10页
Constant-current anodization of pure aluminum was carried out in non-corrosive capacitor working electrolytes to study the formation mechanism of nanopores in the anodic oxide films.Through comparative experiments,nan... Constant-current anodization of pure aluminum was carried out in non-corrosive capacitor working electrolytes to study the formation mechanism of nanopores in the anodic oxide films.Through comparative experiments,nanopores are found in the anodic films formed in the electrolytes after high-temperature storage(HTS)at 130°C for 240 h.A comparison of the voltage-time curves suggests that the formation of nanopores results from the decrease in formation efficiency of anodic oxide films rather than the corrosion of the electrolytes.FT-IR and UV spectra analysis shows that carboxylate and ethylene glycol in electrolytes can easily react by esterification at high temperatures.Combining the electronic current theory and oxygen bubble mold effect,the change in electrolyte composition could increase the electronic current in the anodizing process.The electronic current decreases the formation efficiency of anodic oxide films,and oxygen bubbles accompanying electronic current lead to the formation of nanopores in the dense films.The continuous electronic current and oxygen bubbles are the prerequisites for the formation of porous anodic oxides rather than the traditional field-assisted dissolution model. 展开更多
关键词 anodic alumina formation mechanism NANOPORES formation efficiency electronic current oxygen bubble
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微过孔技术的组装问题
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作者 Harjinder Ladhar 李桂云(编译) 《现代表面贴装资讯》 2005年第4期40-46,共7页
由于对低成本、高密度PCB的需求越来越强烈,微过孔技术也就显得更为重要了。形态因素的要求迫使缩小元件间距,这样才能形成微型盲导通孔的焊盘。而盲孔可提高有效布局,其在制造商和板子组装厂家在制造方面展开了一系列的竞争。传统... 由于对低成本、高密度PCB的需求越来越强烈,微过孔技术也就显得更为重要了。形态因素的要求迫使缩小元件间距,这样才能形成微型盲导通孔的焊盘。而盲孔可提高有效布局,其在制造商和板子组装厂家在制造方面展开了一系列的竞争。传统的焊盘中的通孔(VIP)组装的主要问题之一是焊点中会产生孔洞。在再流过程中,微过孔中截留的气体不能排除时,就会产生孔洞。本文主要论述不同微过孔结构及其对组装工艺的影响。设计了一个实验(DOE),以便了解通孔尺寸、通孔位置、通孔类型和其它工艺参数的影响。此外,还对其它关键系数的影响,如像印制电路板(PCB)表面涂层和焊膏沉积进行了检测。为减少孔洞而优化再流参数。为了对结果进行量化评估,使用自动X射线检测(AXI)系统记录形成孔洞的数据。实施横剖面以便对X射线检验结果进行确认。传统狗骨形和插入式微过孔的数据用作为评估新的微过孔设计的基线。除了传统的微过孔结构外,还论述了填充的微过孔和倒置的微过孔的组装结果。 展开更多
关键词 焊盘中导通孔 VIP 孔洞成形 微过孔 CSP 组装工艺 过孔 技术 自动X射线检测 印制电路板
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