印制电路板阻焊油墨塞孔对孔铜的影响

印制电路板孔铜(金属化孔)不良,其带来的品质后果相当严重,历来为PCB厂商极为关注之缺陷。导致孔铜不良的原因很多,文章仅从阻焊油墨塞孔之角度,论述其对孔铜之影响。

PCB孔铜断裂失效分析探讨

针对PCB在SMT后出现的通孔开路问题,本文结合孔铜断裂失效案例,通过CT、金相切片、SEM及热分析等分析手段来进行论证,分析PCB孔铜断裂的失效机理,并给出了预防控制建议。

Influence of solidification mode on pore structure of directionally solidified porous Cu-Mn alloy

By the directional solidification of metal-gas eutectic method（GASAR）,porous Cu-Mn alloy with oriented pores was fabricated successfully.The variation of pore structure was studied by experiments.The results show that the pore structure is primarily dependent on the solidification mode（planar,columnar cellular,columnar dendritic,equiaxed dendritic）,which is controlled by the solidification process.By numerical simulation,it is noted that along with solidification,the solidification mode of the alloy transforms from cellular to columnar dendritic and finally to equiaxed dendritic.Through increasing melt temperature and mold preheating,the range of equiaxed dendrite could be decreased,which helps to extend the region of oriented pore structure.

电镀铜孪晶形成原因及对产品质量的影响

介绍PCB电镀铜过程中,铜孪晶产生的机理、图像及表现,并结合PCB在电镀铜实际生产过程中如何预防铜孪晶的产生,防止PCB板在客户端SMT高温焊接时或后期使用过程中,因铜孪晶问题导致PCB孔铜断裂发生失效的致命缺陷产生。

BGA微孔背钻毛刺堵孔改善研究

在印制电路板钻孔生产制程中,毛刺堵孔一直是困扰行业微孔背钻加工的难点和痛点。文章以成品孔径为0.15 mm的16层通信基站板为研究对象,通过对孔铜厚度、背钻钻头直径和切削量等几个关键要素进行研究,给出了改善堵孔的最佳参数。

印制线路板电镀均匀性概述

电镀生产实践中,电镀均匀性是检验镀层质量的一个重要指标。本文总结归纳了对表面及孔内镀铜均匀性进行改善的一般性思路与方法,并结合应用实例进行了说明,以期对实际生产提供一定的借鉴与指导意义。

Corrosion behavior of brass coinage in synthetic sweat solution

Corrosion behavior of brass coinage was investigated in synthetic sweat solution by electrochemical measurement and surface analysis methods including scanning electron microscope （SEM） and energy dispersive X-ray spectrometer （EDX）. It is indicated that chloride ions in sweat solution accelerate the anodic active dissolution of brass, which is the main reason of pitting corrosion and dezincification corrosion. Meanwhile, lactic acid and ammonia water also promote the anode reaction. The corrosion products on the surface are mainly composed of basic copper chloride, cuprous oxide, the complex consisting of urea in association with copper, and few lactate ion. The kinetics of pitting corrosion development obeys the following equation of J0=0.3735（t＋185.93）^-1/2, and the process is controlled by dissolution of salt deposited on pit surface.

印制电路板背钻孔方法改进

背钻孔铜残桩(stub)的大小是影响通信类印制电路板(PCB)信号传输完整性的一个重要因素;本文以机械控深钻制作背钻的方式为研究对象,针对目前行业常用的几种背钻方法缺点;设计并验证了一种新型不使用导电盖板的控深背钻方法,以提高背钻孔铜残桩的控制精度和生产效率。

PTHTLTLN电化学腐蚀失效分析及机理探究

阻焊塞孔不饱满以及裂纹会导致孔铜暴露于空气中，当使用环境湿度较大时，物体表面会形成液膜，在整机使用的过程中，孔铜、液膜与焊盘形成电解池，发生电化学反应，使孔铜腐蚀，出现PTH孔内局部孔铜缺失的现象。导致整机信号不良。文章分享一例阻焊塞孔黑色异物失效分析方法，并结合液膜理论及电化学腐蚀理论对失效机理进行分析。为阻焊塞孔不良导致PTH孔孔铜腐蚀失效分析提供理论依据。

Electrochemical discharging performance of 3D porous magnesium electrode in organic electrolyte

A novel type of porous magnesium electrode with a stable 3D copper foam as current collectors for the organic magnesium-air battery was prepared by both amperostatic and pulsed electrodeposition of magnesium on copper foam substrates in an electrolyte of 1 mol/L EtMgBr/THF solution, respectively. Optimal parameters of the pulsed electrodeposition were obtained using a bending cathode at the right angle. The surface morphology of the porous electrode was investigated by SEM, and the discharging performance of the porous magnesium electrode was detected by the chronoamperometric measurement. The electrochemical stability of 3D copper foam current collectors was examined by cyclic voltammetry, SEM and ICP-OES analyses. The results show that the rate capability of the porous magnesium electrode with a stable 3D copper foam as a current collector is better than that of the planar magnesium electrode, and the rate capability of the porous magnesium electrode prepared by the pulsed electrodeposition is superior to that of the porous magnesium electrode prepared by the amperostatic electrodeposition. The 3D structure of copper foam current collectors of the porous magnesium electrode could keep stable during the discharging process.

Influence of porogen type and copper powder morphology on property of sintering copper porous materials

Copper porous materials have been manufactured by the method of powder metallurgy.Electrolytic copper powders and atomized copper powders are used as matrix material.Methylcellulose and paraffin are used as porogen.The influence of porogen type and copper powder morphology on the property of copper porous materials is investigated as well.The results show that copper porous materials with paraffin as porogen have lower porosity and permeability compared with materials using methylcellulose as porogen,due to the different pore-forming mechanisms.The pore forming mechanism of methylcellulose is thermal decomposition,while the pore forming mechanism of paraffin is melting–evaporation.The morphology of copper powders affects the contact state between adjacent powders,which further influence the sintering shrinkage.The porous materials using arborescent copper powders as matrix have lower porosity,smaller pore size and lower permeability,compared with materials with atomized copper powders as matrix.

Effect of heat treatment of Mn-Cu precursors on morphology of dealloyed nanoporous copper

Nanoporous copper with nano-scale pore size was synthesized by dealloying Mn-Cu precursor alloy using a free corrosion method. The effects of heat treatment of Mn-Cu precursors on alloy phase, morphology and composition of the resultant nanoporous copper were investigated. It is revealed that the compositions distribute homogeneously in the bulk Mn-Cu precursors, which consequently results in a more fully dealloying for forming nanoporous copper. The alloy phase changes from Cuo.a9Mno.51 and Cuo.21Mno.79 of non-thermally treated precursor to Cuo.33Mn0.67 of heat treated alloy. The residual Mn content in nanoporous copper is decreased from 12.97% to 2.04% （molar fraction） made from the precursor without and with 95 h heat treatment. The typical pore shape of nanoporous copper prepared by dealloying the precursor without the heat treatment is divided into two different zones： the uniform bi-continuous structure zone and the blurry or no pore structure zone. Nanoporous copper is of a uniform sponge-like morphology made from the heat-treated precursor, and the average ligament diameter is 40 nm, far smaller than that from the non-thermally treated precursor, in which the average ligament diameter is estimated to be about 70 nm.

Preparation of copper nano-wires by template synthesis method

Highly ordered and porous anodic aluminum oxide templates were prepared. The ordered copper nanowires arrays were assembled in nano-holes of the template by alternating current electrodeposition at lover voltage. The morphologies of template and copper nano-wires arrays were characterized by means of field emission scanning electron microscope (FESEM) and the crystal structure of copper nano-wires was determined by means of X-ray diffraction. The results indicate that copper nano-wires hold the preferred crystalline orientation along (111), (200), (220) and (331) crystal faces during growth, and the growth of copper nano-wires in the nano-holes of the template is homogenous and continuous.

Enhanced Pool Boiling Heat Transfer on Copper Foam Welded Surfaces

Enhanced pool boiling heat transfer of the porous structure is critical to the thermal management technology.In this paper,pool boiling heat transfer experiments are performed on copper foam welded surfaces in de-ionized water to investigate the effects of basic parameters of copper foam on heat transfer enhancement.Boiling phenomenon is observed to facilitate the understanding of enhancement mechanism.The results show that copper foam welded surfaces can significantly enhance the pool boiling heat transfer performance,reduce the boiling incipience temperature by 7-9℃,and reach two times heat transfer coefficient compared with smooth plain surfaces due to numerous nucleation sites,extended surface areas,and enhanced turbulent effect.Pore density and thickness of foam have two side effects on heat transfer.

Enhanced stability of highly-dispersed copper catalyst supported by hierarchically porous carbon for long term selective hydrogenation

Copper based catalysts have high potential for the substituent of noble-metal based catalysts as their high selectivity and moderate activity for selective hydrogenation reaction;however,achieving further high catalytic stability is very difficult.In this work,the carbonization process of Cu-based organic frameworks was explored for the synthesis of highly-dispersed Cu supported by hierarchically porous carbon with high catalytic performance for selective hydrogenation of 1,3-butadiene.The porous hierarchy of carbon support and the dispersion of copper nanoparticles can be precisely tuned by controlling the carbonization process.The resultant catalyst carbonized at 600°C exhibits a rather low reaction temperature at 75°C for 100%butadiene conversion with 100%selectivity to butenes,due to its reasonable porous hierarchy and highly-dispersed copper sites.More importantly,unprecedentedly stability of the corresponding Cu catalyst was firstly observed for selective 1,3-butadiene hydrogenation,with both 100%butadiene conversion and 100%butenes selectivity over 120 h of reaction at 75°C.This study verifies that a simply control the carbonization process of metal organic frameworks can be an effective way to obtain Cu-based catalysts with superior catalytic performance for selective hydrogenation reaction.

Stability and nonlinear dynamic behavior of drilling shaft system in copper stave deep hole drilling

The stability and nonlinear dynamic behavior of drilling shaft system in copper stave deep hole drilling were analyzed. The effects of the fluctuation of the cutting force, the mass eccentricity and the hydrodynamic forces of cutting fluid could be taken into consideration in the model of drilling shaft system. Based on the isoparametric finite element method, the variational form of Reynolds equation in hydrodynamic fluid was used to calculate nonlinear hydrodynamic forces and their Jacobian matrices simultaneously. In the stability analysis, a new shooting method for rapidly determining the periodic orbit of the nonlinear drilling shaft system and its period was presented by rebuilding the traditional shooting method and changing the time scale. Through the combination of theories with experiment, the correctness and effectiveness of the above methods are verified by using the Floquet theory. The results show that the mass eccentricity can inhibit the whirling motion of drilling shaft to some extent.

Preparation and Characterization of Macroporous Resin Immobilized Pd－Cu Bimetallic Cluster Catalysts

The Solvated Metal Atom Impregnation (SMAI) technique was employed to prepare macroporous resin immobilized Pd--Cu bimetallic cluster catalysts. The X--ray diffraction (XRD) and transmission electron micrograph (TEM) showed that Pd--Cu alloy was formed and the particle sizes of Pd--Cu clusters were very small, with average diameters <3nm. X--ray photoelectron spectroscopy indicated that both Pd and Cu were in zero--valent state. The catalytic activities of the macroporous resin immobilized Pd--Cu catalysts in hydrogenation of 4--methyl--3--penten--2--one were much greater than that of the carbon supported Pd--Cu catalysts.

Control of Pinhole Defects Formation in Semi-flexible Coaxial Cable by Vertical Tin-Plating Process

Holistic tin-plating on the outer conductor is one of the key processes in the manufacture of semi-flexible coaxial cable, which is widely applied to the third generation (3G) mobile communication system. However, in the traditional horizontal tin-plating process, disadvantages such as the pinhole defects and low productivity effect cannot be avoided. In this paper, a vertical tin-plating process was proposed to reduce the pinhole defects and improve the tincoating quality. Compared with the traditional horizontal tin-plating process, the immersion length was reduced from 300-400 mm to 10-100 mm and the tin-plating time was reduced from 7 s to 3 s in the proposed method. The experimental results indicate that immersion length and time are key parameters for the tin-plating quality. With this new tin-plating process, the experimental results show that the pinhole defects can be eliminated effectively by controlling the immersion depth below 100 mm and tin-plating time at 3 s. The thickness of tin-coating increased from not more than 5 μm to 12.3 μm with the proposed vertical tin-plating process. Meanwhile, the thickness of the intermetallic compounds (IMCs) layer between the tin-coating and copper wires was reduced from 3.26 μm to 0.62 μm if the immersion time decreased from 30 s to 1 s. Besides, a self-developed flux, which possesses a boiling point or decomposed temperature of active components over 300℃, exhibits a better efficiency in reducing the pinhole formation.

Adsorption of Metal Ions by Sorbents Composed of Marine Alga Saccharina bongardiana and Poriferous Aluminosilicates

The development of gold and cobalt-copper-nickel deposits in Kamchatka threatens the loss of biodiversity in spawning rivers and lakes and has negative effects on coastal ecosystems. To reduce pollution by mining wastes, filters with dried marine alga Saccharina bongardiana in combination with zeolite and pumice are recommended. Combined Saccharina-based sorbents remove heavy metal ions more effectively, increasing adsorption capacity by five times compared to mineral （pumice） sorhents. As a result of desorption, a tenfold increase of the solution concentration is reached after the first sorption cycle. Valuable elements （Ni, Co, Cu etc.） can then be extracted from concentrates by any known method. It increases economic efficiency of the mining industry due to recycling of non-ferrous metals. Saccharina-based sorbents can be also utilized for purification of polluted natural waters. It may serve as environmental protection measure and provide for ecological safety of the unique natural environment of Kamchatka and its bioresources.

Room-temperature liquid metal synthesis of nanoporous copper-indium heterostructures for efficient carbon dioxide reduction to syngas

Nanoporous metals show promising performances in electrochemical catalysis.In this paper,we report a self-supporting bimetallic porous heterogeneous indium/copper structure synthesized with a eutectic gallium-indium(EGaIn)material on a copper substrate.This nanoporous copper-indium heterostructure catalyst exhibits excellent performance in the reduction of carbon dioxide to syngas.The ratio of H_(2)/CO is tunable from 0.47 to 2.0 by changing working potentials.The catalyst is highly stable,showing 96%maintenance of the current density after a 70-h continuous test.Density functional theory calculations reveal that the indium/copper interface induces charge redistribution within the copper surface,leading to the formation of two distinct active sites,namely,Cu^(δ)and Cu0,and enabling a high-performance generation of CO and H_(2).This work provides a new strategy for obtaining self-supporting nanoporous metal electrode catalysts.