The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of t...The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.展开更多
Laminar natural convection heat transfer inside air-filled, rectangular enclosures partially heated from below and cooled at one side is studied numerically. A computational code based on the SIMPLE-C algorithm is use...Laminar natural convection heat transfer inside air-filled, rectangular enclosures partially heated from below and cooled at one side is studied numerically. A computational code based on the SIMPLE-C algorithm is used for the solution of the system of the mass, momentum, and energy transfer governing equations. Simulations are performed for a complete range of heater size, for Rayleigh numbers based on the height of the cavity ranging from 10~3to 10~6, and for height-to-width aspect ratios of the cavity spanning from 0.25 to 4. It is found that the heat transfer rate increases with increasing the heater size and the Rayleigh number, while it decreases with increasing the aspect ratio of the cavity. Dimensionless heat transfer correlations are also proposed.展开更多
文摘The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.
文摘Laminar natural convection heat transfer inside air-filled, rectangular enclosures partially heated from below and cooled at one side is studied numerically. A computational code based on the SIMPLE-C algorithm is used for the solution of the system of the mass, momentum, and energy transfer governing equations. Simulations are performed for a complete range of heater size, for Rayleigh numbers based on the height of the cavity ranging from 10~3to 10~6, and for height-to-width aspect ratios of the cavity spanning from 0.25 to 4. It is found that the heat transfer rate increases with increasing the heater size and the Rayleigh number, while it decreases with increasing the aspect ratio of the cavity. Dimensionless heat transfer correlations are also proposed.
