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中国专利
1
《有机硅材料》 CAS 2004年第5期29-29,共1页
关键词 硫化硅酮胶 碳酸钙 表面改性 表面活性剂 化妆品 有机聚硅氧烷树脂 偶联剂 甲基丙烯酸三甲基甲硅烷基酯 粉末涂料 液体垫圈 调理剂 螯合剂 导热复合片材 硅橡胶
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The Development of Thermal Conductive Polymer Composites for Heat Sink 被引量:1
2
作者 Yeo-Seong Yoon Mee-Hye Oh Ah-Yeong Kim Namil Kim 《Journal of Chemistry and Chemical Engineering》 2012年第6期515-519,共5页
The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly ther... The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly thermal conductive h-BN and graphite gives rise to large increase (about 2 times) of thermal conductivity of individual polymer. In PPS/graphite system, the higher conductivity value was obtained when smaller graphites were added. Meanwhile, the tensile and flexural strength are reduced upon increasing filler loading. 展开更多
关键词 Polymer composites thermal conductivity PA6 (polyamide 6) PPS (polyphenylene sulfide) h-BN (boron nitride) graphite.
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中国专利
3
《有机硅材料》 CAS 2004年第5期38-38,共1页
关键词 抗渗防水剂 粘接剂 水泥密封剂 光元件 导热硅橡胶复合片材 半导电性树脂 涂饰剂 催化剂 聚碳酸酯 水性涂料 有机卤代硅烷 偶联剂 钛硅分子筛 塑木板材
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