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一种射频基板BGA端口传输性能检测方法
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作者 笪余生 张柳 +2 位作者 廖翱 王睿 吕英飞 《电子与封装》 2020年第10期13-16,共4页
随着BGA(Ball Grid Array)封装的射频SiP(Systems in Package)产品的逐渐应用,对SiP产品及其射频基板的测试提出了很高的要求。介绍了一种射频基板BGA端口传输性能检测方法,通过设计射频BGA端口的检测装置,实现射频基板上射频BGA端口传... 随着BGA(Ball Grid Array)封装的射频SiP(Systems in Package)产品的逐渐应用,对SiP产品及其射频基板的测试提出了很高的要求。介绍了一种射频基板BGA端口传输性能检测方法,通过设计射频BGA端口的检测装置,实现射频基板上射频BGA端口传输线的性能检测及筛选。该检测方法能够实现DC 40 GHz频率范围内的射频性能检测,且DC 40 GHz频率范围内单个装置引入插损小于1 dB,驻波优于2。基于此方法的检测装置可实现目前多数频段的基板射频BGA端口性能检测。 展开更多
关键词 射频基板 BGA端口 检测
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Characterization of sputtered ZnO films under different sputter-etching time of substrate 被引量:7
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作者 李翠平 杨保和 +5 位作者 钱丽荣 徐盛 戴伟 李明吉 李晓伟 高成耀 《Optoelectronics Letters》 EI 2011年第6期431-436,共6页
Polycrystalline ZnO films are prepared using radio frequency magnetron sputtering on glass substrates which are sputter-etched for different time. Both the size of ZnO grains and the root-mean-square (RMS) roughness d... Polycrystalline ZnO films are prepared using radio frequency magnetron sputtering on glass substrates which are sputter-etched for different time. Both the size of ZnO grains and the root-mean-square (RMS) roughness decrease, as the sputter-etching time of the substrate increases. More Zn atoms are bound to O atoms in the films, and the defect concentration is decreased with increasing sputter-etching time of substrate. Meanwhile, the crystallinity and c-axis orientation are improved at longer sputter-etching time of the substrate. The Raman peaks at 99 cm-1, 438 cm-1 and 589 cm-1 are identified as E2(low), E2(high) and E1(LO) modes, respectively, and the position of E1(LO) peak blue shifts at longer sputter-etching time. The transmittances of the films, which are deposited on the substrate and etched for 10 min and 20 min, are higher in the visible region than that of the films deposited under longer sputter-etching time of 30 min. The bandgap increases from 3.23 eV to 3.27 eV with the increase of the sputter-etching time of substrate. 展开更多
关键词 ETCHING Metallic films Zinc oxide
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