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酚醛树脂层压基板真空热裂解产物分析表征 被引量:5
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作者 吴文彪 丘克强 +1 位作者 李承龙 徐筱群 《分析化学》 SCIE EI CAS CSCD 北大核心 2010年第1期72-76,共5页
利用程序升温的热解炉反应器对酚醛树脂层压基板进行真空热裂解,通过元素分析、傅里叶红外(FT-IR)分析和气相色谱-质谱(GC-MS)分析,对原料及产物油成分进行了表征。研究表明,热解油上层清液主要是一些较易溶于水的物质,如苯酚、甲酚、... 利用程序升温的热解炉反应器对酚醛树脂层压基板进行真空热裂解,通过元素分析、傅里叶红外(FT-IR)分析和气相色谱-质谱(GC-MS)分析,对原料及产物油成分进行了表征。研究表明,热解油上层清液主要是一些较易溶于水的物质,如苯酚、甲酚、二甲酚、糖类、乙内酰脲类、吗啉类、吡喃酮类和吡啶类化合物等;而下层沉淀则主要为不溶或难溶于水的物质,如大取代基酚类(取代基碳原子数≥2)、磷酸三芳基酯类、脂肪酸酯类和腈类化合物等。其中,三聚氰胺在上层清液和下层沉淀中都有较高的含量。 展开更多
关键词 层压基板 真空热裂解 酚醛树脂 表征
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封装基板阻焊层分层分析与研究 被引量:2
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作者 杨建伟 《电子与封装》 2019年第2期1-4,12,共5页
封装基板的可靠性对封装产品至关重要。通过对超薄层压基板封装产品的失效实例进行分析研究,确认由于基板阻焊层受应力造成阻焊层与铜层出现分层。经基板分层应力仿真模拟,发现阻焊层的厚度对阻焊层受到的应力影响最明显。增加阻焊层的... 封装基板的可靠性对封装产品至关重要。通过对超薄层压基板封装产品的失效实例进行分析研究,确认由于基板阻焊层受应力造成阻焊层与铜层出现分层。经基板分层应力仿真模拟,发现阻焊层的厚度对阻焊层受到的应力影响最明显。增加阻焊层的厚度,可减小阻焊层与铜层之间的应力,解决阻焊层与铜层之间的分层问题,也提高了基板封装产品的可靠性。 展开更多
关键词 超薄层压基板 阻焊层 分层 翘曲 短路
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积层(Build-up)封装工艺的发展及其设计挑战(1)
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作者 吴梅珠 吴小龙 《印制电路信息》 2011年第5期8-16,52,共10页
回顾了自1988年以来的逐次积层(SBU)层压基板的发展过程。文中报告了IBM自2000年采用的这种工艺的开发过程。这些层压基板是一种非均匀性结构,有3部分组成:芯板,积层和表面层,每一部分都是为满足封装应用的需求而开发。薄膜工艺极大提高... 回顾了自1988年以来的逐次积层(SBU)层压基板的发展过程。文中报告了IBM自2000年采用的这种工艺的开发过程。这些层压基板是一种非均匀性结构,有3部分组成:芯板,积层和表面层,每一部分都是为满足封装应用的需求而开发。薄膜工艺极大提高了SBU层压基板的绕线能力,同时也使得这种工艺非常适合高性能设计。本文着重阐述了IBM在将该工艺用于ASIC和微处理器封装时,在设计、制造和可靠性测试等各个阶段所遇到的挑战。 展开更多
关键词 逐次积层 层压基板 封装 微处理器设计
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文献与摘要(27)
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《印制电路信息》 2003年第9期71-72,共2页
层压基板上多层无机-有机聚合物薄膜技术中微波电路Microwave Circuits in Multilayer Inorganic-organic Poly-mer Thin Technology on Laminate Substrates 要求印制板高性能、小尺寸与轻量化,促使了新材料、新方法、新工艺、新设备... 层压基板上多层无机-有机聚合物薄膜技术中微波电路Microwave Circuits in Multilayer Inorganic-organic Poly-mer Thin Technology on Laminate Substrates 要求印制板高性能、小尺寸与轻量化,促使了新材料、新方法、新工艺、新设备等领域的不断发展,以及高频电子封装与光学互连的整合封装备受关注。 展开更多
关键词 层压基板 微波电路 集成薄膜电容器 电介质材料 芯片封装 挠性电路 覆铜箔
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Analytical Solutions to the Fundamental Frequency of Arbitrary Laminated Plates under Various Boundary Conditions 被引量:1
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作者 Yingqin Luo Ming Hong Yuan Liu 《Journal of Marine Science and Application》 CSCD 2015年第1期46-52,共7页
In recent years, as the composite laminated plates are widely used in engineering practice such as aerospace, marine and building engineering, the vibration problem of the composite laminated plates is becoming more a... In recent years, as the composite laminated plates are widely used in engineering practice such as aerospace, marine and building engineering, the vibration problem of the composite laminated plates is becoming more and more important. Frequency, especially the fundamental frequency, has been considered as an important factor in vibration problem. In this paper, a calculation method of the fundamental frequency of arbitrary laminated plates under various boundary conditions is proposed. The vibration differential equation of the laminated plates is established at the beginning of this paper and the frequency formulae of specialty orthotropic laminated plates under various boundary conditions and antisymmetric angle-ply laminated plates with simply-supported edges are investigated. They are proved to be correct. Simple algorithm of the fundamental frequency for multilayer antisymmetric and arbitrary laminated plates under various boundary conditions is studied by a series of typical examples. From the perspective of coupling, when the number of laminated plates layers N〉8-10, some coupling influence on the fundamental frequency can be neglected. It is reasonable to use specialty orthotropic laminated plates with the same thickness but less layers to calculate the corresponding fundamental frequency of laminated plates. Several examples are conducted to prove correctness of this conclusion. At the end of this paper, the influence of the selected number of layers of specialty orthotropic laminates on the fundamental frequency is investigated. The accuracy and complexity are determined by the number of layers. It is necessary to use proper number of layers of special orthotropic laminates with the same thickness to simulate the fundamental frequency in different boundary conditions. 展开更多
关键词 laminated plates arbitrary orientation analytical solutions fundamental frequency boundary conditions
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