Simulations of photoresist etching,aerial image,exposure,and post-bake processes are integrated to obtain a photolithography process simulation for microelectromechanical system（MEMS） and integrated circuit（IC） fa...Simulations of photoresist etching,aerial image,exposure,and post-bake processes are integrated to obtain a photolithography process simulation for microelectromechanical system（MEMS） and integrated circuit（IC） fabrication based on three-dimensional （3D） cellular automata（CA）. The simulation results agree well with available experimental results. This indicates that the 3D dynamic CA model for the photoresist etching simulation and the 3D CA model for the post-bake simulation could be useful for the monolithic simulation of various lithography processes. This is determined to be useful for the device-sized fabrication process simulation of IC and MEMS.展开更多
The PRO/Ⅱ process simulation software was applied to carry out simulated calculation of the aromatics fractionation unit and the heat integrated rectification process was proposed for the aromatics fractionation sect...The PRO/Ⅱ process simulation software was applied to carry out simulated calculation of the aromatics fractionation unit and the heat integrated rectification process was proposed for the aromatics fractionation section of the 1.0 Mt/a toluene disproportionation unit at the Zhenhai Refining and Chemical Company. The optimized operating parameters were obtained through the energy utilization analysis,process simulation,heat exchanger calculations and comparisons of utility consumption. The operation of commercialized unit has revealed that the design parameters of each rectification column were consistent with the operation results,and the utility consumption was about 47% lower than the traditional heat integrated process.展开更多
文摘Simulations of photoresist etching,aerial image,exposure,and post-bake processes are integrated to obtain a photolithography process simulation for microelectromechanical system（MEMS） and integrated circuit（IC） fabrication based on three-dimensional （3D） cellular automata（CA）. The simulation results agree well with available experimental results. This indicates that the 3D dynamic CA model for the photoresist etching simulation and the 3D CA model for the post-bake simulation could be useful for the monolithic simulation of various lithography processes. This is determined to be useful for the device-sized fabrication process simulation of IC and MEMS.
文摘The PRO/Ⅱ process simulation software was applied to carry out simulated calculation of the aromatics fractionation unit and the heat integrated rectification process was proposed for the aromatics fractionation section of the 1.0 Mt/a toluene disproportionation unit at the Zhenhai Refining and Chemical Company. The optimized operating parameters were obtained through the energy utilization analysis,process simulation,heat exchanger calculations and comparisons of utility consumption. The operation of commercialized unit has revealed that the design parameters of each rectification column were consistent with the operation results,and the utility consumption was about 47% lower than the traditional heat integrated process.
